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News tagged capex
  • Last update: Thursday 12 January 2017 [479 news items]

TSMC rising 2013 capex to benefit equipment and material suppliers

Apr 22, 13:31

The decision by Taiwan Semiconductor Manufacturing Company (TSMC) to raise its 2013 capex to US$9.5-10 billion, from US$9 billion set previously, will benefit Taiwan-based suppliers...

TSMC 16nm FinFET to enter mass production within one year after 20nm ramp-up, says Chang

Apr 18, 15:53

TSMC's 16nm FinFET process will enter mass production in less than one year after ramping up production of 20nm chips, company chairman and CEO Morris Chang said at an investors meeting...

ASE to issue NT$15 billion convertible bonds

Stockwatch - Apr 9, 12:23

Taiwan-based Advanced Semiconductor Engineering (ASE), which provides semiconductor assembly and test services, has unveiled plans to issue overseas convertible bonds worth up to...

Ledlink 2013 capex to reach NT$200 million

Mar 28, 21:57

LED optical lens maker Ledlink is optimistic about the second quarter, as order visibility is clear to April-May. Telung Tang, CEO of the firm, noted that 2013 capex will reach NT$200...

Intel and Samsung to represent 42% of total chip capex in 2013, says IC Insights

Mar 27, 16:00

The combined capital spending by Samsung Electronics and Intel is forecast to represent 42% of the world's semiconductor capital outlay in 2013, up from 40% in 2012, according to...

TSMC to issue corporate bonds overseas, says report

Newswatch - Mar 18, 14:34

Taiwan Semiconductor Manufacturing Company (TSMC) plans to issue US$1.5 billion worth of unsecured corporate bonds overseas, according to a recent Economic Daily News report...

China Mobile 2013 capex increases 49% on year

Mar 14, 21:56

China Mobile, one of the biggest telecom carriers in China, reported 2012 total revenues of CNY560.4 billion (US$90 billion, up 6.1% on year. Net profits were CNY129.3 billion, representing...

Innolux to spend US$673 million expanding panel capacity in 2013

Feb 27, 14:19

Innolux Corporation plans to budget a capital expenditure (capex) of NT$20 billion (US$673 million) in 2013 to expand its 5G LCD panel production capacity. The expenditure could allow...

FET sets record capex of NT$10.5 billion for 2013

Feb 8, 10:59

Far EasTone Telecommunications (FET), one of the three largest mobile telecom carriers in Taiwan, has set aside a capex budget of NT$10.5 billion (US$355 million) for 2013, the highest...

Semiconductor R&D spending rises 7% in 2012, says IC Insights

Feb 7, 11:19

Spending on R&D by chip companies grew 7% in 2012 to a record-high US$53 billion even though the semiconductor market declined 1% to US$317.6 billion, according to IC Insights.

Taiwan PCB makers to raise 2013 capex

Feb 5, 12:30

Major Taiwan-based PCB manufacturers including Unimicron Technology, Compeq Manufacturing and Unitech Printed Circuit Board have all set higher capex budgets for 2013, according to...

Samsung, Hynix cautious about 2013 capex plans

Feb 1, 13:59

Memory chip vendors Samsung Electronics and SK Hynix have both taken a cautious approach to planning for capital expenditure (capex) in 2013, implying that the pair is looking to...

IC backend firms to suffer setback in January-February, says SPIL chair

Jan 31, 12:15

IC packaging and testing companies will suffer setbacks in revenues during January and February because of inventory adjustments at clients, as well as fewer working days due to the...

SPIL chairman Bough Lin

Taiwan market: Chunghwa Telecom sets aside record capex budget for 2013

Jan 30, 11:39

Chunghwa Telecom (CHT) has set aside a copmpany record capital expenditure (capex) budget of NT$37.15 billion (US$1.26 billion) for 2013, increasing 11.7% from 2012.

Walton to cut 2013 capex, provides cautious outlook

Jan 22, 21:50

Walton Advanced Engineering, which provides packaging and testing services for memory chips, has expressed caution about its business outlook for 2013. Filling under-utilized capacity...

Chipbond, ChipMOS 2013 capex to stay flat

Jan 22, 19:58

LCD driver IC packaging and testing houses Chipbond Technology and ChipMOS Technologies will have their capex for 2013 stay unchanged at the prior year's level.

FPCB maker Flexium to raise 2013 capex

Jan 18, 12:38

Flexible PCB manufacturer Flexium Interconnect expects its capex for 2013 to top the NT$1.7-1.8 billion (US$58.73-62.18 million) it spent in the previous year, with plans to upgrade...

Sigurd plans flat capex in 2013

Dec 27, 22:14

IC packaging and testing house Sigurd Microelectronics expects to maintain its 2013 capex at the same level as 2012. The expenditures will be spent on expanding capacity and R&...

KYEC sets 2013 capex at almost NT$5 billion

Dec 27, 15:50

Taiwan-based King Yuan Electronics Company (KYEC), which provides wafer probing testing services, has budgeted NT$4.989 billion (US$171.9 million) in capex for 2013, compared to the...

SPIL approves NT$11.3 billion for 2013 capex

Dec 21, 11:29

The board of directors of IC packager Siliconware Precision Industries (SPIL) has approved plans to budget NT$11.3 billion (US$389 million) in capex for 2013, which is lower than...

IC backend services firms to ride high as TSMC ramps capex for 2013, say sources

Dec 17, 21:37

Taiwan-based IC backend services companies will benefit from an increase in capital expenditure (capex) by Taiwan Semiconductor Manufacturing Company (TSMC) in 2013, according to...

TSMC to allocate US$9 billion in capex, expects 15-20% revenue growth in 2013, says chairman

Dec 17, 11:24

Taiwan Semiconductor Manufacturing Company (TSMC) will set aside a capital expenditure budget of US$9 billion for 2013, an annual record with growth of 8.4% from 2012, and it expects...

ASML CEO to attend annual TSMC supply chain forum

Dec 12, 11:58

Foundry chipmaker Taiwan Semiconductor Manufacturing Company (TSMC) will hold its annual supply chain management forum for 2012 on December 14. Participants will include Eric Meurice,...

ASML CEO Eric Meurice to attend TSMC annual supply-chain forum

TSMC board approves US$3 billion for advanced process capacity expansion

Nov 14, 12:04

The board of Taiwan Semiconductor Manufacturing Company (TSMC) on November 13 approved a capital appropriation in the amount of US$2.975 billion for the purpose of expanding advanced...

Specialty IC foundry VIS revises 2012 capex

Oct 29, 22:40

Vanguard International Semiconductor (VIS) has revised upward its capex target for 2012 to NT$1.5-1.6 billion (US$51-55 million) from the NT$650 million estimated previously. The...

VIS chairman Chang Ching-chu

PCB maker Apex to increase investment in Thailand

Oct 19, 12:19

PCB manufacturer Apex Circuit International plans to increase total investment in its new plant in Thailand by 25% to THB5 billion (US$163.2 million), with the additional capex to...

CHT expected to increase 2013 capex

Oct 5, 15:42

Taiwan-based Chunghwa Telecom (CHT) is expected to expand its capital expenditure (capex) in 2013 from a budget of NT$33.1 billion (US$1.12 billion) in 2012 because the company will...

TSMC 2013 capex to top US$10 billion, says report

Newswatch - Sep 27, 12:00

While Samsung Electronics reportedly plans to halve its 2013 capital expenditure (capex), Taiwan Semiconductor Manufacturing Company (TSMC) is expected to raise its capex for the...

Top-5 spenders to represent 64% of total chip capex in 2012, says IC Insights

Sep 12, 16:35

Intel and four other large semiconductor suppliers are expected to account for almost two-thirds of industry-wide capital expenditures in 2012, according to IC Insights. The top-5...

Tong Hsing raises 2012 capex

Aug 24, 11:51

Tong Hsing Electronic Industries, which provides assembly and test services for niche ICs and produces ceramic substrates for the manufacture of LEDs, has budgeted more than NT$2...

Tong Hsing president Henry Liu

Ardentec to increase 2012 capex by 50%

Aug 16, 01:20

Ardentec, a Taiwan-based provider of IC testing services, plans to increase its capex for 2012 by 50% to NT$1.2 billion (US$40.05 million) to ramp up its testing capacity for logic...

TSMC to allocate US$2.4 billion to grow advanced technology capacity

Aug 15, 10:18

The board of directors of Taiwan Semiconductor Manufacturing Company (TSMC) on August 14 approved capital appropriations totaling about US$2.41 billion for expanding and upgrading...

Major IC packagers step up 2012 capex

Aug 6, 15:41

Advanced Semiconductor Engineering (ASE), Amkor Technology and Siliconware Precision Industries (SPIL) – the world's leading packaging and testing houses – have all set...

AUO adds NT$1.84 billion to 2012 capex budget

Aug 6, 10:45

The board of directors of LCD panel maker AU Optronics (AUO) has approved an additional capital expenditure (capex) budget of NT$1.84 billion (US$61.3 million) in 2012 specifically...

Only six major semiconductor suppliers to spend more on capex in 2012, says IC Insights

Jul 18, 14:32

IC Insights' latest survey and ranking of the major semiconductor capital spenders shows that only six of the 35 major semiconductor suppliers - Intel, Samsung, Hynix, TSMC, UMC and...

479 items [4/14]
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