Intel recently released a disappointing earnings report, revealing declines in both revenue and operating margin. The company announced comprehensive cost-cutting plans, including...
Winbond Electronics, a specialty DRAM and flash memory chipmaker, has begun ramping up its DDR4 chip output in the second half of 2024, with the memory output increase expected to...
Intel has unveiled a cost reduction plan involving significant layoffs, substantial cuts in operating expenses, and a sharp reduction in capital expenditures (capex). The announcement...
Amazon's AWS division continued to gain momentum despite reporting lower-than-expected revenue. The company plans to boost its capital expenditures to accommodate the growing demand...
Microsoft reported a deceleration in its cloud business growth for the fourth quarter of fiscal 2024, which ended in June. Despite this, CEO Satya Nadella emphasized that generative...
OSAT ASE Technology Holding (ASEH) has stated its enthusiasm for "Foundry 2.0," a novel concept that is designed to transform the foundry industry, which was recently announced by...
The world's top-3 memory chipmakers are likely to reduce their NAND flash memory capex in 2024, following two years of robust spending, according to industry sources.
OSATs have in recent years stepped up their capital expenditures and are actively implementing high-end packaging technology and chip heterogeneous integration, according to industry...
According to Bloomberg citing UBS forecasts, Taiwan Semiconductor Manufacturing Company (TSMC) could spend up to US$37 billion in capex in 2025, marking a 15.6%...
TSMC's quarterly investors conference is scheduled for July 18, with market attention focused on topics such as AI chip demand, the foundry's expected price increase, and capital...
Backend house ChipMOS Technologies has made upward revisions to its capex for the second half of 2024 in response to strong demand for high-end Display Driver ICs (DDI), according...
Taiwan-based IC backend houses including ASE Technology, Chipbond Technology, ChipMOS Technologies, King Yuan Electronics (KYEC), Powertech Technology (PTI), and Sigurd Microelectronics...
Taiwan's top memory backend specialist Powertech Technology (PTI) has decided to sharply raise its capital expenditure for 2024 from the original NT$10 billion (US$307.22 million)...