Taipei, Sunday, October 4, 2015 16:03 (GMT+8)
partly cloudy
News tagged capex
  • Last update: Thursday 10 September 2015 [436 news items]

Taiwan market: TWM raises 2013 capex for 4G

Nov 27, 11:22

Telecom carrier Taiwan Mobile (TWM) on November 26 said it will increase its 2013 capex by NT$3.522 billion (US$119 million) to NT$17.022 billion.

Solar capital spending to expand faster than expected, says IHS

Nov 12, 14:19

Amid new signs that solar market conditions are improving and major suppliers are increasing production, IHS is raising its forecast of photovoltaic (PV) capital spending. Global...

Equipment makers pessimistic about demand for LCD panels

Oct 29, 15:21

Equipment demand for the production of LCD panels is unlikely to pick up in the short term, as an oversupplied market is discouraging panel makers from expanding capacity and making...

Major IC foundries 2014 capex to focus on 14/16nm process production

Oct 22, 21:15

IDMs Intel and Samsung Electronics, and pure-play foundries TSMC and Globalfoundries are set to see their combined capital expenditures rise about 20% in 2014, according to industry...

Pure-play foundries spending big, says IC Insights

Oct 3, 11:20

Semiconductor capital spending has increased significantly among pure-play foundries, as more IDMs shift to a fabless/fab-lite business model while new foundry participants intensify...

Semiconductor capex spending falls in Japan, says IC Insights

Sep 12, 11:12

IC Insights has traced the sales of the top 10 semiconductor companies dating back to 1985. In 1990, six Japan-based companies were counted among the top 10 leaders in semiconductor...

TSMC to raise 2014 capex to record US$11 billion, says report

Newswatch - Sep 2, 14:54

Taiwan Semiconductor Manufacturing Company (TSMC) is expected to boost volume output of 20nm chips by increasing its capex for the year to a record US$11 billion, the Chinese-language...

TSMC board approves US$1.9 billion for advanced process capacity expansion

Aug 14, 11:10

The board of Taiwan Semiconductor Manufacturing Company (TSMC) on August 13 approved a capital appropriation in the amount of US$1.925 billion for the purpose of installing, expanding...

DRAM market reaches maturity, says IC Insights

Aug 7, 12:34

Forty-three years after Intel introduced the first DRAM device in 1970, the DRAM market has finally matured to the point where there are only three major suppliers remaining - Samsung...

PTI to raise capex spending for 2013

Jul 31, 22:02

IC backend service company Powertech Technology (PTI) may inject another NT$1 billion (US$33.41 million) for capacity ramps in the second half of 2013 after already spending NT$7...

Samsung to spend KRW19.5 trillion on component business in 2013

Jul 30, 11:38

Samsung Electronics expects to spend a total of KRW19.5 trillion (US$17.5 billion), equivalent to 81.25% of its total capex, on the company's component business in 2013. Of the planned...

Inotera swings to 2Q13 profit

Jul 24, 11:35

Taiwan-based DRAM chipmaker Inotera Memories has reported net profits for the second quarter of 2013, ending a string of 13 consecutive quarter losses.

Taiwan chipmakers stepping up investment to meet mobile IC demand, says SEMI

Jul 2, 11:45

The semiconductor market is experiencing a surge in demand for mobile and wireless communications applications. While Taiwan sets a good example of rising the tide of mobile demand...

IC manufacturing equipment spending to slip 5% in 2013, says Gartner

Jun 21, 15:51

Worldwide semiconductor manufacturing equipment spending is projected to total US$35.8 billion in 2013, a 5.5% decrease from 2012 spending of US$37.8 billion, according to Gartner.

Unimicron sets 2013 capex budget at NT$10-11 billion

Jun 21, 14:02

PCB maker Unimicron Technology has set a capex budget of NT$10-11 billion (US$331.5-364.7 million) for 2013, mainly to develop thinner, high-density chip-scale package (CSP) substrates,...

Unimicron chairman tze-chang Tseng

NPC 2013 capex to focus on FC CSP substrates, says president

Jun 18, 21:45

Nan Ya PCB (NPC) will invest most of its targeted capex of NT$2 billion (US$67 million) on FC CSP (chip scale package) substrates in 2013, acknowledging brisk demand coming from the...

Kinsus sets 2013 capex at record NT$4.5-5 billion

Jun 18, 15:12

IC substrate maker Kinsus Interconnect Technology expects its capex budget to reach a record NT$4.5-5 billion (US$150.7-167.5 million) in 2013 and further climb to NT$5-6 billion...

Edison Opto 2013 capex to exceed NT$400 million

Jun 13, 20:44

LED lighting demand has been rising and Taiwan-based LED packaging house Edison Opto noted that 2013 capex will reach NT$400-500 million (US$13-16 million).

Digitimes Research: Mixed capex plans for major semiconductor firms in 2013

Jun 11, 11:01

Intel, Samsung Electronics, Taiwan Semiconductor Manufacturing Company (TSMC), Texas Instruments (TI), Toshiba, Renesas Electronics, SK Hynix, and STMicroelectronics were among the...

Fab equipment spending to soar in 2H13, says SEMI

Jun 6, 12:46

Fab equipment spending for the second half of 2013 is expected to be much stronger with a 32% growth rate or US$18.5 billion compared to the first half of the year, according to SEMI...

Digitimes Research: Samsung logic IC capex stays high in 2013

Jun 3, 12:49

Samsung Electronics is expected to spend US$6 billion on its logic IC business in 2013, down from a record US$7 billion in 2012, according to Digitimes Research.


SPIL to hike capex budget for 2013

May 29, 22:15

IC backend service company Siliconware Precision Industries (SPIL) has decided to hike its capex budget for 2013 to NT$14.9 billion (US$496.14 million), up nearly 32% from NT$11.3...

Solar industry capex hits 7-year low in 2013, says IHS

May 22, 10:44

Although global capital spending this year in the solar supply chain is expected to fall to its lowest level since 2006, indications signal that the downturn in investment has hit...

ChipMOS capex for 2013 to reach NT$2.5-2.8 billion

May 20, 16:23

ChipMOS Technologies, which specializes in assembly and test services for LCD driver ICs and memory chips, expects its capex for 2013 to total NT$2.5-2.8 billion (US$83.6-93.6 million)...

chipmos chairman SJ Cheng

TSMC to budget US$1.5 billion for R&D expenditure

May 10, 10:58

Taiwan Semiconductor Manufacturing Company (TSMC) has unveiled plans to invest a record US$1.5 billion on research and development in 2013. The spending remains focused on maintaining...

Jason Chen, senior VP of TSMC worldwide sales and marketing

Macronix approves NT$2.62 billion for 2013 capex

Stockwatch - May 3, 15:54

The board of directors of Macronix International, a manufacturer of mask ROM and NOR flash memory, has approved plans to budget NT$2.62 billion (US$88.7 million) in capex for 2013...

China Mobile sets 2013 capex of CNY41.7 billion for TD-LTE

Apr 22, 16:09

China Mobile has set aside a capex budget of CNY41.7 billion (US$6.7 billion) for procurement of about 200,000 TD-LTE base stations and related equipment in 2013 to deploy its TD-LTE...

TSMC rising 2013 capex to benefit equipment and material suppliers

Apr 22, 13:31

The decision by Taiwan Semiconductor Manufacturing Company (TSMC) to raise its 2013 capex to US$9.5-10 billion, from US$9 billion set previously, will benefit Taiwan-based suppliers...

TSMC 16nm FinFET to enter mass production within one year after 20nm ramp-up, says Chang

Apr 18, 15:53

TSMC's 16nm FinFET process will enter mass production in less than one year after ramping up production of 20nm chips, company chairman and CEO Morris Chang said at an investors meeting...

ASE to issue NT$15 billion convertible bonds

Stockwatch - Apr 9, 12:23

Taiwan-based Advanced Semiconductor Engineering (ASE), which provides semiconductor assembly and test services, has unveiled plans to issue overseas convertible bonds worth up to...

Ledlink 2013 capex to reach NT$200 million

Mar 28, 21:57

LED optical lens maker Ledlink is optimistic about the second quarter, as order visibility is clear to April-May. Telung Tang, CEO of the firm, noted that 2013 capex will reach NT$200...

Intel and Samsung to represent 42% of total chip capex in 2013, says IC Insights

Mar 27, 16:00

The combined capital spending by Samsung Electronics and Intel is forecast to represent 42% of the world's semiconductor capital outlay in 2013, up from 40% in 2012, according to...

TSMC to issue corporate bonds overseas, says report

Newswatch - Mar 18, 14:34

Taiwan Semiconductor Manufacturing Company (TSMC) plans to issue US$1.5 billion worth of unsecured corporate bonds overseas, according to a recent Economic Daily News report...

China Mobile 2013 capex increases 49% on year

Mar 14, 21:56

China Mobile, one of the biggest telecom carriers in China, reported 2012 total revenues of CNY560.4 billion (US$90 billion, up 6.1% on year. Net profits were CNY129.3 billion, representing...

Innolux to spend US$673 million expanding panel capacity in 2013

Feb 27, 14:19

Innolux Corporation plans to budget a capital expenditure (capex) of NT$20 billion (US$673 million) in 2013 to expand its 5G LCD panel production capacity. The expenditure could allow...

436 items [2/13]
Display panels for wearable devices
2015 China smartphone panel trend forecast

2-Oct-2015 markets closed


TAIEX (TSE)8305.03+9.09+0.11% 

TSE electronic321-0.05-0.02% 

GTSM (OTC)119.76+0.28+0.23% 

OTC electronic151.54+1.18+0.78% 

Analysis of China revised domestic semiconductor industry goals
  • Wireless broadband developments in Southeast Asia markets

    As of 2013, the 10 ASEAN nations had a total of over 700 million mobile subscriptions, with the CAGR from 2003-2013 reaching 24%. This Digitimes Research Special Report analyzes the various mobile broadband markets in ASEAN and looks at the respective trends in 4G LTE development for those markets.

  • 2015 global tablet demand forecast

    This Digitimes Research Special Report provides a 2015 forecast for the global tablet market and analyzes the strategies of key market players such as Google, Apple, Intel, and Microsoft.

  • 2015 China smartphone panel trend forecast

    This Digitimes Research Special Report analyzes the strategies of key China-based major panel makers BOE, Tianma and IVO for attacking the different market segments through technology and pricing, and their relationship to local vendors Huawei, Lenovo, ZTE, Xiaomi and Coolpad.