Taipei, Thursday, April 17, 2014 10:03 (GMT+8)
fair
Taipei
27°C
Hynix DDR3L-RS DRAM
Photo: Company [Sep 18, 2012]

SK Hynix has introduced DDR3L-RS (Reduced Standby) DRAM for mobile solutions using its 20nm class technology. By using 20nm class technology and efficiently managing standby current, this DDR3L-RS product reduces 70% of standby power compared to existing DDR3L DRAM while it maintains DDR3L performance, according to the vendor. The product is available in both chip and module types.

Chips for on-board use enable thinner devices to implement various densities with 2Gb, 4Gb and 8Gb. SO-DIMMs are also provided with densities of 2GB, 4GB and 8GB.

The new Hynix DDR3L-RS is targeted at ultrabook and tablet PC applications, which highly require mobility and low power figure. The product is price competitive than LPDDR3 and reduces standby current than existing DDR3L, SK Hynix said. As it combines performances of mobile DRAM and PC DRAM, SK Hynix expects to penetrate into the new market including low to mid-end ultabooks and tablets with this intermediary product and lead the mobile market.

2014 global high brightness LED market
TD-LTE market developments and forecast, 2014-2016
2014 global smartphone market forecast
  • China flat panel display industry outlook, 2013-2016

    This Digitimes Research Special Report outlines and analyzes the key trends and players that are influencing the continued development of China large-size and small-to medium size TFT LCD panel industry, while providing related growth forecasts for the industry through 2016.

  • TD-LTE market developments and forecast, 2014-2016

    TD-LTE has become the mainstream global choice for the construction of 4G asymmetric frequency spectrum networks. This Digitimes Research Special Report examines the current global status of TD-LTE, and forecasts developments in the TD-LTE supply chain in China and worldwide through 2016.

  • ASPs of TD-LTE chips to remain stable initially as suppliers are limited

    While a number of IC vendors have begun shipping chips supporting TD-LTE, including base band chips, radio frequency chips, APs, SoC solutions and soft modems, shipments of base band chips account for a majority share of total TD-LTE chip shipments currently, according to Digitimes Research.