Taipei, Wednesday, August 5, 2015 19:49 (GMT+8)
partly cloudy
Taipei
29°C
Winbond TS16949-certified, AEC-Q100-qualified serial flash memory
Photo: Company [Mar 2, 2012]

Winbond has announced that the firm will provide its TS16949-certified AEC-Q100-qualified serial flash memory devices - featuring densities from two megabits to 256 megabits - to global equipment makers in the automotive-electronics market.

Winbond's 90nm AEC-Q100 qualified automotive grades SpiFlash memories are available now in densities up to 128Mb. Industrial Grade Plus is also available for less stringent automotive applications. A 58nm family of SpiFlash starting with densities up to 256Mb will be introduced later in 2012, as will Winbond's 90nm parallel NOR flash memories, also up to 256Mb.

Display panels for wearable devices
Taiwan server shipment forecast and industry analysis, 2015
2015 global notebook demand forecast
  • Wireless broadband developments in Southeast Asia markets

    As of 2013, the 10 ASEAN nations had a total of over 700 million mobile subscriptions, with the CAGR from 2003-2013 reaching 24%. This Digitimes Research Special Report analyzes the various mobile broadband markets in ASEAN and looks at the respective trends in 4G LTE development for those markets.

  • 2015 global tablet demand forecast

    This Digitimes Research Special Report provides a 2015 forecast for the global tablet market and analyzes the strategies of key market players such as Google, Apple, Intel, and Microsoft.

  • 2015 China smartphone panel trend forecast

    This Digitimes Research Special Report analyzes the strategies of key China-based major panel makers BOE, Tianma and IVO for attacking the different market segments through technology and pricing, and their relationship to local vendors Huawei, Lenovo, ZTE, Xiaomi and Coolpad.