The ZSSC3008 is optimized for those applications with sensors that do not require temperature compensation because they have an intrinsically low temperature coefficient (TC). This includes ceramic pressure sensors, thin-film pressure sensors with good TC performance, and oil-filled stainless steel or passively compensated sensors. The calibrated ZSSC3008 and a specific sensor are mated digitally: fast, precise, and without the cost overhead associated with trimming by external devices or laser, the company said.
The ZSSC3008 is housed in a SOP8 package. Unit prices start at EUR1.40 (US$1.83) in volumes of 1,000 devices.
Gigabyte GV-R799D5-6GD-B graphics card
Gigabyte Technology has introduced its latest Radeon HD 7990-based graphics card, GV-R799D5-6GD-B featuring the Graphics...
Photo: Company, Apr 30.
Samsung Electronics has announced the Galaxy Mega - a 6.3-inch smartphone. The device is also light and thin, portable...
Photo: Company, Apr 16.
Samsung Electronics has announced that the Galaxy Note 8.0 is coming to the US market on April 11. Unveiled globally at...
Photo: Company, Apr 12.
AU Optronics (AUO) is exhibiting a 65-inch Ultra HD TV panel at the China Information Technology Expo & China Optoelectronics...
Photo: Company, Apr 10.
2013 Taiwan Internationbal Lighting Show
LED firms around the world are participating in the Taiwan International Lighting Show from March 26-29.
Date: Mar 29.
The exhibit is taking place at Nangang Exhibition Hall from June 19-21.
Date: Jun 21.
2012 Taiwan International Lighting Show
The 2012 Taiwan International Lighting Show was held on March 13-16 at the Taipei World Trade Center.
Date: Apr 19.
17-May-2013 markets closed
| Last | Change |
| TAIEX (TSE) | 8368.19 | -21.86 | -0.26% |
| TSE electronic | 316.17 | -0.60 | -0.19% |
| GTSM (OTC) | 119.56 | +0.49 | +0.41% |
| OTC electronic | 143.91 | +0.93 | +0.65% |
- Imec and Renesas collaborate on ultra-low power short range radios (May 16) - Company release
- AMD announces memory modules designed for gaming (May 8) - x-bit Labs
- Fabless suppliers play increasing role in IC market (May 1) - IC Insights
- Ex-Palm chief joins Qualcomm's board (May 6) - CNET
- Chipmaker Infineon says auto orders help lift outlook (May 2) - Reuters
- Intel may look to outrun foundry competitors with new CEO Krzanich (May 2) - PC World
- Chipmaker Altera's quarterly revenue below expectations (April 25) - Reuters
- SK Hynix to supply Samsung as early as June (April 30) - AsiaOne
- China market: Several smartphone components in short supply
- AUO supply of iPad mini panels in 2Q13 expected to slip sequentially
- Demand for small-size panel driver ICs stays strong
- Innolux, AUO differ in strategies for tapping China smartphone panel market
- Asustek unveils Intel 8 series motherboards
- Wintek to reportedly set up joint venture 6G touch panel factory in China with Nanjing Panda Electronics
- PCB firm Apex 2Q13 sales to rise over 10%
- Taiwan LED firms to attend Guangzhou International Lighting Exhibition 2013
- Touch screen notebook shipments reach 4.57 million units in 1Q13, says Displaybank
- Asia Pacific leads worldwide mobile phone sales growth in 1Q13, says Gartner
- Mobile DRAM revenues slip 5% in 1Q13, says DRAMeXchange
- SMA Technology sees 1Q13 revenues fall on year
- SunPower announces fiscal 2013 financial guidance
- LED plant factory market to reach US$1.2 billion in 2013, says PIDA
- Suntech agrees on new forbearance agreement with converible note holders
- BlackBerry to offer BBM on Android and iOS platforms
- New generation iPhone may adopt sapphire crystal glass for home button
- Ledlink to begin LED lighting shell volume production in May-June
- Ruggedized PC vendors eyeing 7- to 8-inch tablet market
- Equipment maker Acter sees profits down in 1Q13
- Soft-World sees over 50% of 1Q13 profit from 3 subsidiaries
- Corning introduces Lotus XT Glass
- Synnex Technology reports profits for 1Q13
- HannStar Display posts 1Q13 profits
- Taiwan market: HTC, Samsung optimistic about May sales
- Releases
- White papers
- Bulletin
- Enriching multiple MEMS applications for mobile devices
- Dialog Semiconductor expands into ultrabooks and all-in-one PCs with a new generation of multi-touch display sensor ICs
- Altera Cyclone V GT FPGA is industry first low-power FPGA to achieve compliance for PCIe Gen2 at 5 Gbps
- Digi-Key adds Califia Lighting to line card of more than 650 global suppliers
- A Changing Landscape - Chilisin on the Rise
- Embracing the New Generation Intel Atom Family with DDR3 Memory Support
- Got The Message? Ensuring efficient and reliable delivery of content across a mission critical digital signage network
- Emb' Store On-Demand Software Service for Embedded Computing
- Efficient Network Management for Digital Signage
- Design Benefits of the MI/O Extension Solution
- ATO Solution Co., Ltd. to launch 1Gb SLC NAND Flash after 256Mb/512Mb mass production for the first time in Fab-less industry
- Chilisin's miniature power inductor in 0603/0805 sizes
- Chilisin introduces Thin-film chip inductor 0201 size
- Chilisin at 2012 electronics Munich A5/159 & 260
- Chilisin sunken-type molded power inductor for MXM Graphic application
- Coto Technology claims industry's smallest MEMS reed switch
- Silicon Labs introduces single-chip digital radio receivers for CE devices
- Memory makers see better profits as chip pricing improves
- Globalfoundries quietly becoming a threat to competitors
- Digitimes Research: Mobile devices to drive 2013 DRAM market
Samsung reportedly to outsource more chips
Samsung Electronics reportedly is looking to expand the purchase of memory products, including mobile DRAM chips and eMMC NAND devices, from outside.
Micron reaches deal to acquire Elpida
Micron Technology and Elpida Memory's trustees have reached an agreement for Micron to acquire Elpida. Micron also announced a separate agreement with...
Taiwan DRAM firms mull fab sales
Taiwan-based DRAM chipmakers including Powerchip Technology and ProMOS Technologies are considering selling fabs in order to preserve cash and strengthen...
Specializing in the manufacture of memory chips and LCD panels, Samsung's component operations are undergoing a focus shift to advanced process design...
Opportunity lies for MEMS energy harvesting: Q&A with Holst Centre general manager Bert Gyselinckx
Digitimes recently interviewed Bert Gyselinckx, general manager of the Holst Centre in Eindhoven, to...
MEMS-enabled energy harvesting: Q&A with MIG executive director Karen Lightman
Digitimes recently spoke with Karen Lightman, the executive director of MEMS Industry Group (MIG),...
Complete mobile platform solutions: Q&A with Broadcom executive VP Robert Rango
In a relentless competition against rivals including Qualcomm, Nvidia and Media in the smartphone chipset...
Focused on embedded flash: Q&A with Spansion EVP Glenda Dorchak
Spansion recently announced a joint development with United Microelectronics (UMC) to integrate its...
- Taiwan DRAM module industry overview - Jun 2011
The year 2010 represented a peak in recent years for the DRAM module industry. Optimism surfaced in the second half of 2009 thanks to a return of demand on the...
- Taiwan DRAM-module industry overview - May 2010
Back to 2006 when total revenues for the third-party module market reached US$12.2 billion, Taiwan had over 15 vendors shipping DRAM modules under their own brand...
- Taiwan semiconductor equipment industry overview - Aug 2008
Worries about a global economic downturn have taken a toll on a number of industries, with the semiconductor industry being no exception. Players in the semiconductor...
- Foundry overview - Sep 2006
Taiwan's semiconductor industry has begun to out-run its global peers, once more, in 2006. This followed a trough in 2004, caused by over-inventory, plus volatility...
- Trends and shipment forecast for 2H 2012 tablet market
Digitimes Research remains conservative about the prospects for the period, with half-year shipments projected to reach 49.18 million units and whole-year shipments being revised downward to 88.69 million units.
- Trends and shipment forecast for 2H 2012 smartphone market
Smartphone shipments in 2010 and 2011 both enjoyed growth of more than 60%. Growth will decelerate in 2012 due to the high base, as well as a slowdown in consumer spending in Western Europe.
- Trends in Asia LED chip manufacturing industry
Asia is playing an ever more important role in upstream LED chip manufacturing. The region accounted for 80% of MOCVD demand in 2011 and will account for 90% in 2012, largely because Taiwan, Japan, South Korea and China are the major global centers for LED chip production.