Taipei, Sunday, November 29, 2015 00:38 (GMT+8)
mostly cloudy
Computex 2010: Winchip Calligraphy-series high-capacity memory kits
Photo: Company [Jun 4, 2010]

Winchip Technologies has debuted its new DRAM modules, which include high-capacity DDR2 and DDR3 products, low-voltage DDR3 modules and overclocking DDR3 series, at Computex 2010 (June 1-5).

Winchip said it is now extending its Calligraphy-series high-capacity memory kit up to 24GB (4GBx6pcs) of DDR3 1333MHz LO-DIMM and 8GB (4GBx2pcs) dual-channel kit of DDR3 1600MHz for SO-DIMM to fulfill increasing demand for high-density solutions. The series targets research centers, design studios and other data-intensive users.

It is also showcasing an eco-friendly series that operates on DDR3 standard 1.35V supply voltage, which is designed for the Intel P55 platforms. In addition, Winchip's Robust-series modules overclocked to 2133MHz will be highlighted at the Computex booth (Nangang Hall, I0501).

The Big Fund
Trends and forecasts for the China FPD industry, 2014-2017
Demand and supply trends in the global sapphire industry, 2014-2015
  • Wireless broadband developments in Southeast Asia markets

    As of 2013, the 10 ASEAN nations had a total of over 700 million mobile subscriptions, with the CAGR from 2003-2013 reaching 24%. This Digitimes Research Special Report analyzes the various mobile broadband markets in ASEAN and looks at the respective trends in 4G LTE development for those markets.

  • 2015 global tablet demand forecast

    This Digitimes Research Special Report provides a 2015 forecast for the global tablet market and analyzes the strategies of key market players such as Google, Apple, Intel, and Microsoft.

  • 2015 China smartphone panel trend forecast

    This Digitimes Research Special Report analyzes the strategies of key China-based major panel makers BOE, Tianma and IVO for attacking the different market segments through technology and pricing, and their relationship to local vendors Huawei, Lenovo, ZTE, Xiaomi and Coolpad.