Taipei, Friday, April 18, 2014 18:02 (GMT+8)
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VIA Mobile ITX form factor-based motherboard
Photo: Ninelu Tu, DIGITIMES [Dec 4, 2009]

VIA Technologies has announced Mobile-ITX, the latest VIA-developed open form factor specification for the creation of ultra-compact and portable embedded devices.

Mobile-ITX defines a uniquely compact 6cm x 6cm computer-on-module specification designed to enable an easier and less resource intensive development cycle for a range of ultra-compact, portable embedded systems.

Vertical market segments including medical, transportation and military embedded markets have evolved to demand higher miniaturization and portability from today's x86 platforms and VIA's Mobile-ITX form factor can offer a size 50% smaller than its Pico-ITX form factor, which measures 10cm x 7.2cm.

Mobile-ITX employs a modularized design that includes a CPU module card and an I/O carrier board. This offers greater flexibility for developers who can simply drop in the CPU module to a custom designed, application specific carrier board, negating lengthy developmental design and testing phases.

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