Taipei, Saturday, April 19, 2014 22:19 (GMT+8)
mostly cloudy
Taipei
25°C
KLA-Tencor ICOS WI-2250
Photo: Company [Dec 2, 2009]

KLA-Tencor has introduced its ICOS WI-2250 wafer inspector for MEMs and LED manufacturing. This product marks a major breakthrough for the MEMS and LED industry, as it offers a dramatic improvement in inspection speed and allows manufacturers to transition to larger LED and MEMS wafer sizes, according to the company.

The new KLA-Tencor system allows defect inspection of whole and diced wafers up to 200mm, with macro inspection sensitivity in the pre- and post-dice inspection (i.e., front- and back-end) of high-brightness (HB) LEDs and MEMS wafers.

Comparing with similar products on the market today, KLA-Tencor said its ICOS WI-2250 provides significantly
higher inspection sensitivity to critical LED and MEMS process defects. The new system also offers advanced rule-based binning (RBB) for real-time defect classification, advanced metrology capabilities and faster throughput for inspection as a result of new inspection and data processing technology, which allows an increase in inspection speed.

2014 global high brightness LED market
DIGITIMES Marketing Services
2014 global mobile application processor market forecast