Taipei, Saturday, May 25, 2013 19:08 (GMT+8)
mostly cloudy
Taipei
27°C
Samsung 0.6mm-thick multi-chip memory package
Photo: Company [Nov 10, 2009]
Samsung Electronics has developed what it claims is the world's thinnest multi-die package, whch measures 0.6mm in height. Designed initially for 32GB densities, the new memory package is just half the thickness of a conventional memory package of eight stacked chips (or dies).

The advanced packaging technology delivers a 40% thinner and lighter memory solution for high-density multimedia handsets and mobile devices, the company said.

The new 0.6mm-thick package, which consists of eight identical dies (called an octa-die package), uses 30nm class, 32Gb NAND flash chips, each measuring just 15micron, to deliver a 32GB NAND solution.

In addition, the new package technology can be adapted to other existing MCPs, configured as system in packages (SiPs), or package on packages (PoPs). The breakthrough technique for 15micron-and-under chip thicknesses will allow for the design of high density solutions with small form factors, the company said.
  • Gigabyte+GV%2DR799D5%2D6GD%2DB+graphics+card

    Gigabyte GV-R799D5-6GD-B graphics card

    Gigabyte Technology has introduced its latest Radeon HD 7990-based graphics card, GV-R799D5-6GD-B featuring the Graphics...

    Photo: Company, Apr 30.

  • Samsung+Galaxy+Mega

    Samsung Galaxy Mega

    Samsung Electronics has announced the Galaxy Mega - a 6.3-inch smartphone. The device is also light and thin, portable...

    Photo: Company, Apr 16.

  • Samsung+Galaxy+Note+8%2E0

    Samsung Galaxy Note 8.0

    Samsung Electronics has announced that the Galaxy Note 8.0 is coming to the US market on April 11. Unveiled globally at...

    Photo: Company, Apr 12.

  • AUO+65%2Dinch+Ultra+HD+TV+panel

    AUO 65-inch Ultra HD TV panel

    AU Optronics (AUO) is exhibiting a 65-inch Ultra HD TV panel at the China Information Technology Expo & China Optoelectronics...

    Photo: Company, Apr 10.

24-May-2013 markets closed

 LastChange

TAIEX (TSE)8209.78-28.05-0.34% 

TSE electronic310.89-0.43-0.14% 

GTSM (OTC)118.64-0.71-0.59% 

OTC electronic143.77-0.29-0.2% 

Development and commercialization of Thunderbolt technology
Trends and forecast for 2013 touch panel market
2013 global tablet forecast
  • Trends and shipment forecast for 2H 2012 tablet market

    Digitimes Research remains conservative about the prospects for the period, with half-year shipments projected to reach 49.18 million units and whole-year shipments being revised downward to 88.69 million units.

  • Trends in the China video market

    In addition to strong potential video content demand in China, the market has developed rapidly due to government intervention and delays in establishing copyright protections.

  • Trends in Asia LED chip manufacturing industry

    Asia is playing an ever more important role in upstream LED chip manufacturing. The region accounted for 80% of MOCVD demand in 2011 and will account for 90% in 2012, largely because Taiwan, Japan, South Korea and China are the major global centers for LED chip production.