Taipei, Monday, September 22, 2014 10:19 (GMT+8)
heavy rain shower
Taipei
25°C
IDF San Francisco: Intel CEO displayed a silicon wafer built on 22nm process
Photo: Monica Chen [Sep 24, 2009]

Intel president and CEO Paul Otellini has displayed a silicon wafer containing its first working chips built on 22nm process technology. The 22nm test circuits include both SRAM memory as well as logic circuits to be used in future Intel processors, according to Intel.

The 22nm wafer displayed by Otellini is made up of individual die containing 364 million bits of SRAM memory and has more than 2.9 billion transistors packed into an area the size of a fingernail. The chips contain the smallest SRAM cell used in working circuits ever reported at 0.092-square microns, claimed Intel. The devices rely on a third-generation high-k metal gate transistor technology for improved performance and lower leakage power.

UHD TV market forecast, 2014-2017
DIGITIMES Marketing Services
Greater China touch panel shipment forecast through 2015
  • 2014 global high brightness LED market, trends and shipment forecast

    For the global LED lighting market, the market size will reach US$25.82 billion in 2014 or a market penetration rate of 23.4%. This is attributable to exponential shipment growth for light bulbs, tubes, and directional lamps.

  • Greater China touch panel shipment forecast through 2015

    This Special Report provides forecasts through 2015 for Greater China touch panel shipments with breakdowns based on technology (glass, film, resistive), application (smartphone, NB and tablet) and by firm.

  • 2014 global tablet demand forecast

    This report analyzes the main players, their strategies and shipments forecasts for 2014, as well as other factors contributing to either growth or decline in various segments within the tablet market, with a particular focus on Apple, Google, Samsung, and Microsoft, along with whitebox vendors.