Taipei, Monday, December 18, 2017 13:05 (GMT+8)
cloudy
Taipei
15°C
OCZ Flex EX 4GB series
Photo: Company [Dec 18, 2008]

OCZ Technology has unveiled the Flex EX memory series for enthusiasts. These high-density modules operate at DDR2 and DDR3 speeds, and the company claims offer enthusiasts the thermal management necessary for the stability and performance on high-end gaming and overclocking systems.

The OCZ Flex EX thermal management solution enables high-frequency memory to operate within an optimal balance of speeds and low latencies without the high temperatures that inhibit or damage the module, said the company. Each Flex EX memory module features the integrated liquid injection system design which originated in the OCZ Flex XLC (Xtreme Liquid Convection) Series.

The Flex EX modules will be available in 4GB (2x2048MB) dual-channel kits.

Global notebook shipment forecast, 2017 and beyond
Global AP demand forecast, 2017-2020
Global notebook shipment forecast, 2017 and beyond
  • China AMOLED panel capacity expansion forecast, 2016-2020

    This Digitimes Research Special Report examines the China AMOLED industry, focusing on the expansion capacity of the makers, the current implementation plans of major smartphone vendors in the market and the technological hurdles faced by the China makers.

  • Global AP demand forecast, 2017-2020

    Digitimes Research expects global AP shipments to surpass the 1.9 billion mark in 2017, with smartphones remaining the main application. Qualcomm will be leading the market in 2017, as other players continue playing catch up and scramble for funds to invest in more diverse applications.

  • Global notebook shipment forecast, 2017 and beyond

    This Digitimes Special Report examines key factors in the notebook industry, including products, vendors and ODMs, that will affect total shipments in 2017 and through 2021.