Taipei, Thursday, July 24, 2014 01:31 (GMT+8)
mostly cloudy
Taipei
26°C
SUSS MicroTec unveils new ProbeShield technology for wafer-level testing
Photo: SUSS MicroTec [Jul 18, 2007]
SUSS MicroTec unveils new ProbeShield technology for wafer-level testing

By implementing its ProbeShield technology, SUSS MicroTec said it has improved the way in which semiconductor devices are characterized and have their reliability tested.

This system could meet challenges for an accurate measurement of parameters include current-voltage (I-V), capacitance-voltage (C-V), low-frequency (1/f) flicker noise, HF noise and scattering (S-) parameters.

For a detailed technology explaination, please refer to the company's website.

Analysis of China revised domestic semiconductor industry goals
2014 global mobile application processor market forecast