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NXP claims to have slashed smart card IC thickness by 50%
Photo: NXP [Nov 2, 2006]

NXP Semiconductors claimed that its new SmartMX smart card IC can now be manufactured to be only 75 micrometers (0.000075 m) thick, representing a 50%thinner thickness than current industry standards.

NXP stresses that the slim profile addresses requirements for electronic identification documents such as ePassports, eVisas and national ID cards.

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