Taipei, Thursday, April 24, 2014 17:34 (GMT+8)
mostly cloudy
Taipei
24°C
NXP claims to have slashed smart card IC thickness by 50%
Photo: NXP [Nov 2, 2006]

NXP Semiconductors claimed that its new SmartMX smart card IC can now be manufactured to be only 75 micrometers (0.000075 m) thick, representing a 50%thinner thickness than current industry standards.

NXP stresses that the slim profile addresses requirements for electronic identification documents such as ePassports, eVisas and national ID cards.

Global tablet tracker
China smartphone tracker
DIGITIMES Translation Services