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Intel joins forces with Japanese firms to automate chip packaging by 2028

Chiang, Jen-Chieh, Taipei; Jingyue Hsiao, DIGITIMES Asia Wednesday 8 May 2024 0

Credit: AFP

Intel has partnered with 14 Japan-based companies to develop manufacturing technology for IC backend manufacturing automation, which is anticipated to be commercialized by 2028, aiming to reduce reliance on labor-intensive regions in China and Southeast...

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