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Samsung accelerates R&D in MUF process and 2nd Gen MBCFET

Daniel Chiang, Taipei; Judy Lin, DIGITIMES Asia Monday 4 March 2024 0

Credit: Samsung

Samsung Electronics is reportedly promoting Molded Underfill (MUF) materials in its advanced packaging processes. Since SK Hynix has already adopted MUF technology for its High Bandwidth Memory (HBM) processes, Samsung's implementation of this technology...

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