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NEWS TAGGED SK HYNIX
Tuesday 19 March 2024
SK Hynix begins volume production of industry's first HBM3E
SK Hynix Inc. announced today that it has begun volume production of HBM3E, the newest AI memory product with ultra-high performance, for supply to a customer in late March. The company...
Thursday 14 March 2024
Samsung is reportedly 'upgrading' its HBM development team
Samsung Electronics is reportedly pushing to establish an HBM development unit to increase Samsung's competitiveness in High-Bandwidth Memory (HBM). In other words, the recently formed...
Wednesday 13 March 2024
Samsung denies rumors about applying MR-MUF to improve HBM yield
Refuting a Reuters report citing five people stating that Samsung Electronics will apply Mass Reflow Molded Underfill (MR-MUF) technology, which is the process used by SK...
Monday 11 March 2024
SK Hynix reported has submitted 12-layer HBM3E samples to Nvidia
Players in the memory industry are fiercely competing with each other in developing the fifth-generation High Bandwidth Memory (HBM) HBM3E due to the intense demand from AI GPUs....
Monday 11 March 2024
South Korea seeks to stop tech leak, as HBM3E race intensifies
Against the backdrop of the emergence of protectionism, competition surrounding High Bandwidth Memory (HBM) is also heating up. Although the South Korean court has ruled to hinder...
Friday 8 March 2024
HBM race: South Korean court moves to prohibit former SK Hynix employee from joining Micron
The Artificial Intelligence (AI) frenzy intensifies the competition for High Bandwidth Memory (HBM). A South Korean court recently approved an order application by SK Hynix to prohibit...
Thursday 7 March 2024
SK Hynix invests US$1 Billion in key AI memory chip technology
SK Hynix Inc. is ramping up its spending on advanced chip packaging, in hopes of capturing more of the burgeoning demand for a crucial component in artificial intelligence development:...
Tuesday 5 March 2024
Samsung and SK Hynix restart equipment investment as DRAM demand returns
The DRAM market demand is picking up, and Samsung Electronics and SK Hynix, which previously adopted a production reduction strategy, have recently shown signs of resuming equipment...
Monday 4 March 2024
Samsung accelerates R&D in MUF process and 2nd Gen MBCFET
Samsung Electronics is reportedly promoting Molded Underfill (MUF) materials in its advanced packaging processes. Since SK Hynix has already adopted MUF technology for its High Bandwidth...
Monday 4 March 2024
HBM technology and capacity deployment

Introduction

Monday 4 March 2024
AI puts a rocket under HBM demand, SK Hynix rides the wave
The memory industry is set to exit the production cut phase as Generative AI superpowers high bandwidth memory (HBM) and DDR5 demand.
Monday 4 March 2024
Weekly news roundup: SMIC plans 5nm chip production expansion for Huawei amid US sanctions
These are the most-read DIGITIMES Asia stories from February 26 – March 1.
Thursday 29 February 2024
SK Hynix said to purchase 8 EUV machines for HBM3E processes
SK Hynix plans to invest KRW2 trillion ($1.5 billion) in 2024 to introduce extreme ultraviolet (EUV) lithography equipment to cope with the new generation of memory investment in...
Thursday 29 February 2024
'I'll see your 8-layer HBM3E and raise you 36GB 12-layer HBM3E' Samsung tells Micron
Samsung is engaged in fierce HBM competition with Micron.
Monday 26 February 2024
Why Kioxia is warming up to SK Hynix for WD merger talks
The memory market has rebounded from the previous trough, led by NAND Flash's multi-fold price surge. However, the NAND business of many integrated device manufacturers (IDMs) is...
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