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Hybrid bonding critical for memory advancements, yet Samsung, SK Hynix diverge in adoption strategies

Daniel Chiang; Willis Ke, DIGITIMES Asia Tuesday 5 December 2023 0

Credit: AFP

As NAND flash and high-bandwidth memory (HBM) stacking technologies continue to advance, coupled with the prospective development of 3D DRAM, the semiconductor industry is abuzz with the rising prominence of hybrid bonding technology. Both major South...

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