The shortfall in CoWoS packaging capacity at TSMC is temporary, and demand will be met in one and a half years via capacity expansions, according to company chairman Mark Liu.
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TSMC chairman Mark Liu at Semicon 2023. Credit: DIGITIMES
The shortfall in CoWoS packaging capacity at TSMC is temporary, and demand will be met in one and a half years via capacity expansions, according to company chairman Mark Liu.
