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Samsung, JCET, Wise Road Capital poised for major leap in advance packaging

Julian Ho, Taipei; Jingyue Hsiao, DIGITIMES Asia 0

Credit: AFP

As the demand for AI chips surges, and TSMC's capacity of CoWos is expected to remain tight until its Tongluo facility begins operation in 2027, other "CoWos-like suppliers" are expected to be thrust into the spotlight.

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