United Microelectronics Corporation (UMC), a leading global semiconductor foundry, today announced that its 300mm Fab 12X in Xiamen China, has gained LEED (Leadership in Energy and Environmental Design) Gold recognition from the U.S. Green Building Council. The state-of-the-art fab achieved the highest combined score among all 300mm foundry fabs in China, including a perfect score for Water Efficiency. This milestone further demonstrates UMC's commitment to green building and environmentally sustainable operations.
M.L. Liao, vice president in charge of manufacturing resources integration and the environmental committee at UMC said, "UMC has initiated and implemented green measures not only to enhance energy-conservation for existing fabs, but also to ensure that new fabs meet and exceed the latest green building standards. Fab 12X's LEED Gold certification is a significant milestone in our efforts to promote sustainable manufacturing. Going forward, UMC will continue to fulfill its responsibility as a corporate citizen and base its development on green building concepts to promote the formation of a low-carbon, sustainable society."
UMC's Fab 12X is southern China's first 300mm foundry facility. The fab is in mass production for 40nm and 28nm technologies, with a maximum design capacity of 50,000 wafers per month. The Xiamen based fab is a short distance from Taiwan, allowing seamless support from UMC's Taiwan headquarters. Fab 12X offers diversified 300mm manufacturing in addition to UMC's two other 300mm fabs in Taiwan and Singapore, and complements Hejian fab in Suzhou, China, which provides 8" foundry services.
UMC can be found on the web at http://www.umc.com.
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