Bits + chips
China-based foundry house XMC ties up with Spansion to develop 3D NAND flash chips
Josephine Lien, Taipei; Steve Shen, DIGITIMES

China-based 12-inch wafer foundry house XMC reportedly has teamed up with Spansion to jointly develop and produce 3D NAND flash chips, with trial production to begin in 2016 and volume production in 2017, according to industry sources.

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.
Realtime news
© 2019 DIGITIMES Inc. All rights reserved.
Please do not republish, publicly broadcast or publicly transmit content from this website without written permission from DIGITIMES Inc. Please contact us if you have any questions.