Taipei, Thursday, April 17, 2014 00:25 (GMT+8)
partly cloudy
Taipei
24°C
Intel launches 6W server-class processors
Press release, December 13; Joseph Tsai, DIGITIMES [Thursday 13 December 2012]

Intel has introduced the Atom processor S1200 product family, delivering the world's first low-power, 64-bit server-class system-on-chip (SoC) for high-density microservers, as well as a new class of energy-efficient storage and networking systems. The energy-sipping, industrial-strength microprocessor features essential capabilities to achieve server-class reliability, manageability and cost effectiveness, said Intel.

As public clouds continue to grow, the opportunity to transform companies providing dedicated hosting, content delivery or front-end web servers are also growing. High density servers based on low-power processors are able to deliver the desired performance while at the same time significantly reduce the energy consumption – one of the biggest cost drivers in the data center. However, before deploying new equipment in data centers, companies look for several critical features.

The Intel Atom processor S1200 product family is the first low-power SoC delivering required data center features that ensure server-class levels of reliability and manageability while also enabling significant savings in overall costs. The SoC includes two physical cores and a total of four threads enabled with Intel Hyper-Threading Technology. The SoC also includes 64-bit support, a memory controller supporting up to 8GB of DDR3 memory, Intel Virtualization Technologies, eight lanes of PCI Express 2.0, ECC support for higher reliability, and other I/O interfaces integrated from Intel chipsets. The new product family will consist of three processors with frequency ranging from 1.6GHz to 2GHz.

The Intel Atom S1200 product family is also compatible with the x86 software that is commonly used in data centers today. This enables easy integration of the new low-powered equipment and avoids additional investments in porting and maintaining new software stacks.

Intel continues to drive power consumption down in its products, enabling systems to be as energy efficient as possible. Each year since the 2006 introduction of low-power Intel Xeon processors, Intel has delivered a new generation of low-power processors that have decreased the thermal design power (TDP) from 40W in 2006 to 17W in 2012 due to Intel's advanced 22nm process technology. The Intel Atom processor S1200 product family is the first low-power SoC with server-class features offering as low as 6W of TDP.

More than 20 low-power designs including microservers, storage and networking systems use the Intel Atom processor S1200 processor family from companies including Accusys, CETC, Dell, HP, Huawei, Inspur, Microsan, Qsan, Quanta Computer, Supermicro and Wiwynn.

Intel is working on the next generation of Intel Atom processors for extreme energy efficiency codenamed Avoton. Available in 2013, Avoton will further extend Intel's SoC capabilities and use the company's leading 3D Tri-gate 22nm transistors, delivering world-class power consumption and performance levels.

For customers interested in low-voltage Intel Xeon processor models for low-power servers, storage and networking, Intel will introduce the new Intel Xeon processor E3 v3 product family based on the Haswell microarchitecture next year. These new processors will take advantage of new energy-saving features in Haswell and provide balanced performance-per-watt, giving customers even more options.

The Intel Atom processor S1200 is shipping today to customers with recommended customer price starting at US$54 in quantities of 1,000 units.

Intel Atom S1200 series processor

Intel Atom S1200 series processor
Photo: Company

Realtime news
  • Unitech to ramp up capacity for any-layer HDI and flex-rigid boards

    Bits + chips | 2h 39min ago

  • FIC ruggedized tablet subsidiary receives procurement orders from Brazil

    IT + CE | 3h 1min ago

  • China market: Local smartphone vendors accelerating LTE launches

    Mobile + telecom | 3h 12min ago

  • Taiwan market: Epson launches CISS printers

    IT + CE | 3h 15min ago

  • O-Film expected to produce for 35% of handset touch panels in 2014

    Displays | 4h 5min ago

  • Taiwan solar cell makers see surging orders from China

    Green energy | 4h 8min ago

  • Digitimes Research: In-house no longer useful for Qualcomm

    Before Going to Press | 3h 27min ago

  • China white-box tablet vendors gaining foothold

    Before Going to Press | 4h 27min ago

Pause
 | 
View more
MSI product press release
China FPD industry, 2013-2016
2014 global mobile application processor market forecast
  • Trends in the upstream LED equipment and materials industries, 2H13

    This report examines the outlook for upstream, which includes MOCVD equipment, rare earth materials and sapphire substrates, is also particularly significant as an indicator of trends in the LED industry as a whole over the next year.

  • Global AMOLED market analysis and forecast, 2011-2015

    This report analyzes the current state of development and strategies of the two largest AMOLED panel makers, Samsung and LG Display, examines the potential of the AMOLED handset panel and OLED TV markets, and takes an in-depth look at the competitiveness of S. Korea in the AMOLED sector.

  • ASPs of TD-LTE chips to remain stable initially as suppliers are limited

    While a number of IC vendors have begun shipping chips supporting TD-LTE, including base band chips, radio frequency chips, APs, SoC solutions and soft modems, shipments of base band chips account for a majority share of total TD-LTE chip shipments currently, according to Digitimes Research.