Bits + chips
IC substrate makers develop coreless substrates for thin-profile mobile devices
Ingrid Lee, Taipei; Jessie Shen, DIGITIMES

Major Taiwan-based IC substrate suppliers, including Nanya PCB (NPC) and Unimicron Technology, have developed coreless IC substrates for use in thin-profile mobile devices, and already received verification from clients, according to industry sources...

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.
© 2020 DIGITIMES Inc. All rights reserved.
Please do not republish, publicly broadcast or publicly transmit content from this website without written permission from DIGITIMES Inc. Please contact us if you have any questions.