IC substrate makers develop coreless substrates for thin-profile mobile devices
Ingrid Lee, Taipei; Jessie Shen, DIGITIMES
Major Taiwan-based IC substrate suppliers, including Nanya PCB (NPC) and Unimicron Technology, have developed coreless IC substrates for use in thin-profile mobile devices, and already received verification from clients, according to industry sources...
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The coronavirus outbreak has disrupted production and weakened consumer confidence, with all ICT sectors bracing for major declines in shipments. Digitimes Research has conducted analyses on three mobile device sectors, namely notebooks, smartphones and tablets in the wake of the outbreak.