Taipei, Tuesday, June 28, 2016 22:03 (GMT+8)
thunderstorms
Taipei
31°C
TSMC joins Sematech
Press release; Jessie Shen, DIGITIMES [Thursday 12 May 2011]

Sematech, the global consortium of chipmakers, has announced Taiwan Semiconductor Manufacturing Company's (TSMC) decision to join it as a core member.

TSMC will join Sematech to collaborate on semiconductor R&D for IC process technologies for 20nm generation and beyond, including extreme ultra-violet (EUV) lithography, 3D interconnects, metrology, novel materials and device structures, and to develop critical infrastructure vital for next-generation manufacturing, including the transition to 450 mm wafer size.

"This relationship further reflects our commitment to push the boundaries of innovation and deliver leading-edge technology to our customers," said Jack Sun, VP and CTO, Research and Development of TSMC. "This complementary cooperation leverages Sematech's collaborative approach to lead critical industry technology transitions, with TSMC's position as an industry leader in advanced technology development and manufacturing."

Sematech's other core members include Globalfoundries, Hewlett-Packard (HP), IBM, Intel, Samsung Electronics, United Microelectronics Corporation (UMC) and the College of Nanoscale Science and Engineering (CNSE).

Sematech manages an international network of world-leading collaborative partners, including foundries, IDMs, fabless, packaging and assembly companies and material and equipment suppliers, to provide industry-wide solutions to the challenges of chip manufacturing.

Realtime news
  • China market: Subor Electronics teams up with AMD to develop VR gaming chip, says report

    Bits + chips | 38min ago

  • TCL sees smartphone shipments decline nearly 13% on year in May

    Mobile + telecom | 1h 14min ago

  • Digitimes Research: Samsung Display AMOLED panel shipments to increase to 560 million units in 2019

    Displays | 1h 31min ago

  • Commentary: Samsung Display to continue dominating AMOLED market until 2H17

    Displays | 1h 34min ago

  • IC design houses allocating 28/40nm orders to UMC, SMIC

    Before Going to Press | 1h 26min ago

  • Fingerprint sensor startup raises nearly NT$200 million

    Before Going to Press | 1h 40min ago

  • China market: Foxconn plans to resume retail deployment

    Before Going to Press | 1h 46min ago

  • Qualcomm aims to roll out 5G SoC solutions in 2018-2019

    Before Going to Press | 1h 49min ago

  • SAS not seeing rebound in China market

    Before Going to Press | 1h 50min ago

  • Arcadyan Technology to deal out 2015 dividend of NT$1.60

    Before Going to Press | 1h 54min ago

  • LTE Cat-M1, LTE Cat-NB1 to become mainstream IoT technology, says Qualcomm at MWC Shanghai 2016

    Before Going to Press | 1h 55min ago

  • Hiwin Technologies to deal out 2015 dividend of NT$2.30

    Before Going to Press | 1h 56min ago

  • Wafer Works to not deal out 2015 dividend

    Before Going to Press | 1h 57min ago

  • InterServ International to not deal out 2015 dividend

    Before Going to Press | 1h 58min ago

  • Egis fingerprint sensor adopted by Samsung

    Before Going to Press | 1h 59min ago

Pause
 | 
View more
China smartphone touch-panel industry 2016 forecast
Display panels for wearable devices
The transition to 4k TV - UHD TV market forecast, 2014-2017
  • Wireless broadband developments in Southeast Asia markets

    As of 2013, the 10 ASEAN nations had a total of over 700 million mobile subscriptions, with the CAGR from 2003-2013 reaching 24%. This Digitimes Research Special Report analyzes the various mobile broadband markets in ASEAN and looks at the respective trends in 4G LTE development for those markets.

  • 2015 global tablet demand forecast

    This Digitimes Research Special Report provides a 2015 forecast for the global tablet market and analyzes the strategies of key market players such as Google, Apple, Intel, and Microsoft.

  • 2015 China smartphone panel trend forecast

    This Digitimes Research Special Report analyzes the strategies of key China-based major panel makers BOE, Tianma and IVO for attacking the different market segments through technology and pricing, and their relationship to local vendors Huawei, Lenovo, ZTE, Xiaomi and Coolpad.