Taipei, Thursday, October 19, 2017 00:52 (GMT+8)
cloudy
Taipei
24°C
TSMC joins Sematech
Press release; Jessie Shen, DIGITIMES [Thursday 12 May 2011]

Sematech, the global consortium of chipmakers, has announced Taiwan Semiconductor Manufacturing Company's (TSMC) decision to join it as a core member.

TSMC will join Sematech to collaborate on semiconductor R&D for IC process technologies for 20nm generation and beyond, including extreme ultra-violet (EUV) lithography, 3D interconnects, metrology, novel materials and device structures, and to develop critical infrastructure vital for next-generation manufacturing, including the transition to 450 mm wafer size.

"This relationship further reflects our commitment to push the boundaries of innovation and deliver leading-edge technology to our customers," said Jack Sun, VP and CTO, Research and Development of TSMC. "This complementary cooperation leverages Sematech's collaborative approach to lead critical industry technology transitions, with TSMC's position as an industry leader in advanced technology development and manufacturing."

Sematech's other core members include Globalfoundries, Hewlett-Packard (HP), IBM, Intel, Samsung Electronics, United Microelectronics Corporation (UMC) and the College of Nanoscale Science and Engineering (CNSE).

Sematech manages an international network of world-leading collaborative partners, including foundries, IDMs, fabless, packaging and assembly companies and material and equipment suppliers, to provide industry-wide solutions to the challenges of chip manufacturing.

Realtime news
  • HTC to introduce new smartphone in November

    Before Going to Press | 3h 43min ago

  • Samsung completes qualification of 8LPP process

    Before Going to Press | 3h 44min ago

  • Mini LED to be adopted for smartphones

    Before Going to Press | 3h 44min ago

  • Graphics card demand remains robust due to cryptocurrency mining

    Before Going to Press | 3h 45min ago

  • Genius Electronic denies clients returned lens module shipments

    Before Going to Press | 4h 26min ago

  • Audix to ramp up shipments of VCM components

    Before Going to Press | 4h 29min ago

  • China PV installation in 2018 may shrink to 20GWp

    Before Going to Press | 5h 22min ago

  • e-Enabling Data Center developing software for cloud-based management

    Before Going to Press | 5h 25min ago

  • Colorful expected to ship 2.8 million DIY motherboards in 2017

    Before Going to Press | 5h 27min ago

Pause
 | 
View more
UMC
Global AP demand forecast, 2017-2020
Global notebook shipment forecast, 2017 and beyond
  • China AMOLED panel capacity expansion forecast, 2016-2020

    This Digitimes Research Special Report examines the China AMOLED industry, focusing on the expansion capacity of the makers, the current implementation plans of major smartphone vendors in the market and the technological hurdles faced by the China makers.

  • Taiwan server shipment forecast and industry analysis, 2017

    Digitimes Research estimates that revenues from sales of server motherboards, servers, storage systems and related network system equipment by Taiwan-based vendors reached NT$555.8 billion in 2016 and the amount is estimated to grow 5.9% on year in 2017.

  • Global notebook shipment forecast, 2017 and beyond

    This Digitimes Special Report examines key factors in the notebook industry, including products, vendors and ODMs, that will affect total shipments in 2017 and through 2021.