Taipei, Saturday, August 19, 2017 15:35 (GMT+8)
thunderstorms
Taipei
34°C
TSMC joins Sematech
Press release; Jessie Shen, DIGITIMES [Thursday 12 May 2011]

Sematech, the global consortium of chipmakers, has announced Taiwan Semiconductor Manufacturing Company's (TSMC) decision to join it as a core member.

TSMC will join Sematech to collaborate on semiconductor R&D for IC process technologies for 20nm generation and beyond, including extreme ultra-violet (EUV) lithography, 3D interconnects, metrology, novel materials and device structures, and to develop critical infrastructure vital for next-generation manufacturing, including the transition to 450 mm wafer size.

"This relationship further reflects our commitment to push the boundaries of innovation and deliver leading-edge technology to our customers," said Jack Sun, VP and CTO, Research and Development of TSMC. "This complementary cooperation leverages Sematech's collaborative approach to lead critical industry technology transitions, with TSMC's position as an industry leader in advanced technology development and manufacturing."

Sematech's other core members include Globalfoundries, Hewlett-Packard (HP), IBM, Intel, Samsung Electronics, United Microelectronics Corporation (UMC) and the College of Nanoscale Science and Engineering (CNSE).

Sematech manages an international network of world-leading collaborative partners, including foundries, IDMs, fabless, packaging and assembly companies and material and equipment suppliers, to provide industry-wide solutions to the challenges of chip manufacturing.

WCIT 2017
Global AP demand forecast, 2017-2020
Global notebook shipment forecast, 2017 and beyond
  • China AMOLED panel capacity expansion forecast, 2016-2020

    This Digitimes Research Special Report examines the China AMOLED industry, focusing on the expansion capacity of the makers, the current implementation plans of major smartphone vendors in the market and the technological hurdles faced by the China makers.

  • Global AP demand forecast, 2017-2020

    Digitimes Research expects global AP shipments to surpass the 1.9 billion mark in 2017, with smartphones remaining the main application. Qualcomm will be leading the market in 2017, as other players continue playing catch up and scramble for funds to invest in more diverse applications.

  • Global notebook shipment forecast, 2017 and beyond

    This Digitimes Special Report examines key factors in the notebook industry, including products, vendors and ODMs, that will affect total shipments in 2017 and through 2021.