Bits + chips
Winbond to develop in-house 46nm Buried Wordline process
Josephine Lien, Taipei; Jessie Shen, DIGITIMES

Winbond Electronics has quietly recruited part of former Qimonda's R&D team and will develop a 46nm Buried Wordline stack process, making it the first Taiwan-based DRAM maker to develop 40nm node processes in-house, according to industry sources.

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