Taipei, Friday, April 25, 2014 09:52 (GMT+8)
light rain
Taipei
23°C
Intel, Micron unveil 25nm NAND production process
Press release; Jessie Shen, DIGITIMES [Tuesday 2 February 2010]

Intel and Micron Technology have jointly introduced a 25nm NAND flash production process technology, which provides a more cost-effective path for increasing storage capacity in today's consumer gadgets including smartphones and personal music and media players (PMPs), as well as SSDs.

Manufactured by their joint venture IM Flash Technologies, the 25nm process produces 8GB of storage in a single NAND device. It measures 167mm-square.

The new 25nm 8GB device reduces chip count by 50% compared to previous process generations, allowing for smaller, yet higher density designs and greater cost efficiencies, according to their joint statement. For example, a 256GB SSD can now be enabled with just 32 of these chips (versus 64 previously), a 32GB smartphone needs just four, and a 16GB flash card requires only two.

The flash alliance expects to begin mass production of the 25nm, 8GB device in the second quarter of 2010.

Intel and Micron formed IM Flash in 2006 and started production with a 50nm process, followed by 34nm in 2008.

25nm NAND fash wafer

25nm NAND flash wafer
Photo: Company

Realtime news
  • Korea-based vendors show more interest in Ultra HD TV segment

    Displays | 11h 53min ago

  • Taiflex expects revenues increase in 2Q14

    Bits + chips | Apr 24, 20:10

  • Acer wins exclusive IT supply contract from Victoria Police, Australia

    IT + CE | Apr 24, 18:58

  • Largan Precision nets NT$22.36 per share for 1Q14

    Before Going to Press | 12h 52min ago

  • Digitimes Research: Taiwan DSC shipments decrease 30.4% on quarter in 1Q14

    Before Going to Press | 12h 52min ago

  • NFC penetration in smartphones to exceed 50% in 2015, says NXP Semiconductors executive

    Before Going to Press | Apr 24, 20:59

  • Acer sets internal target shipments of 10 million smartphones, 10 million tablets for 2014

    Before Going to Press | Apr 24, 20:33

  • Taiwan thermal module makers expanding heat-pipe capacities

    Before Going to Press | Apr 24, 20:15

  • Taiwan IC design houses see booming orders from China smartphone vendors

    Before Going to Press | Apr 24, 19:53

  • China-based white-box tablet vendors face increasing competition from international vendors

    Before Going to Press | Apr 24, 18:51

  • Lenovo to start dual-brand smartphone marketing

    Before Going to Press | Apr 24, 18:50

  • Tesla seeing short production capacity, say Taiwan makers

    Before Going to Press | Apr 24, 18:49

Pause
 | 
View more
MSI product press release
China FPD industry, 2013-2016
2014 global notebook demand forecast