Taipei, Wednesday, April 22, 2015 11:52 (GMT+8)
mostly cloudy
Taipei
21°C
Intel, Micron unveil 25nm NAND production process
Press release; Jessie Shen, DIGITIMES [Tuesday 2 February 2010]

Intel and Micron Technology have jointly introduced a 25nm NAND flash production process technology, which provides a more cost-effective path for increasing storage capacity in today's consumer gadgets including smartphones and personal music and media players (PMPs), as well as SSDs.

Manufactured by their joint venture IM Flash Technologies, the 25nm process produces 8GB of storage in a single NAND device. It measures 167mm-square.

The new 25nm 8GB device reduces chip count by 50% compared to previous process generations, allowing for smaller, yet higher density designs and greater cost efficiencies, according to their joint statement. For example, a 256GB SSD can now be enabled with just 32 of these chips (versus 64 previously), a 32GB smartphone needs just four, and a 16GB flash card requires only two.

The flash alliance expects to begin mass production of the 25nm, 8GB device in the second quarter of 2010.

Intel and Micron formed IM Flash in 2006 and started production with a 50nm process, followed by 34nm in 2008.

25nm NAND fash wafer

25nm NAND flash wafer
Photo: Company

Realtime news
  • IoT to drive semiconductor growth, says TSMC co-CEO

    Bits + chips | 1h ago

  • Two STATS ChipPAC subsidiaries in Taiwan merge

    Bits + chips | Apr 21, 21:04

  • Win Semi expects to post double-digit growth in 2Q15 sales

    Bits + chips | Apr 21, 21:00

  • 32-inch TV panel pricing expected to drop US$2-3 during late April, says WitsView

    Displays | Apr 21, 20:38

  • GET to issue 150 million new shares for private placement

    Green energy | Apr 21, 20:36

  • China March mobile phone user base reaches 1.9 billion, says MIIT

    Before Going to Press | Apr 21, 20:47

  • China building home-grown DRAM industry, to pose threat to existing leaders in 2017

    Before Going to Press | Apr 21, 20:18

  • Memory related device suppliers to break into Taiwan top-10 IC design houses in 2015

    Before Going to Press | Apr 21, 20:05

  • Taiwan market: HTC to introduce mid-range HTC One E9+

    Before Going to Press | Apr 21, 20:04

  • Huawei Technologies aims at revenues of US$70 billion for 2018

    Before Going to Press | Apr 21, 20:03

  • Second-tier China LED makers may start price-cut competition

    Before Going to Press | Apr 21, 19:30

  • Digitimes Research: Taiwan large-size TFT LCD panel shipments to increase 5% in 2Q15

    Before Going to Press | Apr 21, 19:29

  • Intel to launch quad-core SoFIA LTE chips in 4Q15, say Taiwan makers

    Before Going to Press | Apr 21, 19:29

  • Over 50% of Philips sales came from green products in 2014

    Before Going to Press | Apr 21, 19:28

  • Global Sources Electronics debuts UAVs exhibition

    Before Going to Press | Apr 21, 19:27

  • Hampoo showcases Intel platform-based tablet solutions at Global Sources Electronics

    Before Going to Press | Apr 21, 19:26

Pause
 | 
View more
2015 China IC design market forecast
2015 global tablet demand forecast
2015 global notebook demand forecast
  • Wireless broadband developments in Southeast Asia markets

    As of 2013, the 10 ASEAN nations had a total of over 700 million mobile subscriptions, with the CAGR from 2003-2013 reaching 24%. This Digitimes Research Special Report analyzes the various mobile broadband markets in ASEAN and looks at the respective trends in 4G LTE development for those markets.

  • 2015 global tablet demand forecast

    This Digitimes Research Special Report provides a 2015 forecast for the global tablet market and analyzes the strategies of key market players such as Google, Apple, Intel, and Microsoft.

  • 2015 China smartphone panel trend forecast

    This Digitimes Research Special Report analyzes the strategies of key China-based major panel makers BOE, Tianma and IVO for attacking the different market segments through technology and pricing, and their relationship to local vendors Huawei, Lenovo, ZTE, Xiaomi and Coolpad.