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Thursday 13 February 2020
Top-5 semiconductor firms hold 53% of global wafer capacity
The world's top-five wafer capacity leaders each had capacity of more than 1,000,000 wafer starts per month, with their combined capacity representing 53% of the world's total wafer...
Tuesday 15 January 2019
Micron exercises call option to acquire remaining stake in IM Flash
Micron Technology has announced the company is exercising its right to purchase Intel's interest in the parties' joint venture, IM Flash Technologies.
Friday 19 October 2018
Micron to acquire remaining stake in IM Flash
Micron Technology has announced that the company intends to exercise its right to call Intel's interest in the parties' joint venture, IM Flash Technologies.
Wednesday 10 January 2018
Intel, Tsinghua Unigroup may team up to develop China NAND flash market
Intel is expected to enhance its presence in China's NAND flash market, with plans to ramp up the capacity of its 12-inch fab in Dalian and possibly to license its technology to Tsinghua...
Tuesday 14 November 2017
Intel, Micron increase 3D XPoint manufacturing capacity with IM Flash fab expansion
Intel and Micron Technology have announced the completion of an expansion to Building 60 (B60) at the IM Flash facilities in Lehi, Utah. The expanded fab will produce 3D XPoint memory...
Wednesday 26 April 2017
Micron talks about its integrated global operations
Micron Technology has been actively allocating its global resources to enhance its DRAM and NAND flash product lines, according to Wayne Allan, VP of global manufacturing at the US-based...
Wednesday 7 December 2011
Micron, Intel unveil 20nm 128Gb NAND flash
Intel and Micron Technology have jointly announced a 20nm, 128Gb multilevel-cell (MLC) NAND falsh device. The companies also announced mass production of their 20nm 64Gb NAND.
Friday 22 April 2011
Intel, Micron open US$3 billion NAND flash facility in Singapore
Intel and Micron Technology have expanded their NAND flash memory joint venture operations with the official opening of IM Flash Singapore, according to the companies.
Friday 15 April 2011
Intel, Micron shrink NAND flash to 20nm
Intel and Micron Technology have jointly introduced a 20nm process technology for manufacturing NAND flash memory, about one year after the pair announced 25nm NAND technology
Thursday 30 December 2010
Intel personnel change sparks speculation about future of Micron
Michael Chen, director of Intel's Asia-Pacific embedded sales and ultra-mobility group, has reportedly resigned from the company. The news comes after comments were made by the CEO...
Tuesday 2 February 2010
Intel, Micron unveil 25nm NAND production process
Intel and Micron Technology have jointly introduced a 25nm NAND flash production process technology, which provides a more cost-effective path for increasing storage capacity in today's...
Thursday 24 December 2009
PTI expects utilization rate to remain high in 1Q10
Memory backend service supplier Powertech Technology (PTI) expects its capacity utilization for the upcoming first quarter to stay similar to levels in the fourth quarter of 2009...
Monday 21 September 2009
Toshiba and SanDisk reportedly to begin sub-30nm NAND flash production in 2H10
Toshiba and its NAND flash partner SanDisk reportedly plan to begin mass producing NAND flash chips fabricated on 20nm-class process technology in the second half of 2010, according...
Wednesday 12 August 2009
Intel, Micron to ship 3-bit per cell NAND flash in 4Q09
Intel and Micron Technology have jointly announced the development of a new 3-bit per cell multi-level cell (MLC) NAND technology for consumer storage devices such as flash cards...
Monday 20 July 2009
IM Flash lowers 32Gb NAND chip spot price, sources say
IM Flash Technologies, a joint venture between Intel and Micron Technology, has recently cut 32Gb NAND flash memory price to a level lower than rivals' in the spot market, according...
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