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Oversupply of COF substrates to lower ASP

Ingrid Lee, Taipei; Esther Lam, DIGITIMES Asia Monday 7 January 2008 0

An oversupply of IC substrates for chip-on film (COF) packaging that is driven by players from Taiwan who aim to enlarge market share, is expected to lead to a possible 20% drop in the average selling price (ASP) of COF substrates in 2008, said industry...

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