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Chipbond 3Q revenues hit record, but margins down slightly on declining COF prices, says paper

EDN, October 24; Rodney Chan, DIGITIMES Asia 0

The third quarter revenues of driver IC packaging and testing house Chipbond Technology hit a record of NT$1.62 billion (US$49.81 million), but gross margins dropped slightly to 26.5% from 27% in the second quarter because of declining prices for the...

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