Home Tech Semiconductors

ChipPAC delivers six stacked-die CSP

Press release; Jack Lu, DIGITIMES Asia Wednesday 12 November 2003 0

ChipPAC, a US-based packaging and testing house, on November 11 announced delivery of its six stacked-die CSP (chip-scale package) solution in 1.6mm profile, according to a company press release.

The article requires paid subscription. Subscribe Now

Email address

Password

Save my User ID and Password

Save my User ID and Password

Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they visit the site. To activate this function, check the 'Save my User ID and Password' box in the log-in section. This will save the password on the computer you're using to access the site.

Note: If you choose to use the log-out feature, you will lose your saved information. This means you will be required to log-in the next time you visit our site.

NEW individual users please REGISTER first.

Enterprise user first-time LOGIN.

I forgot my ID and/or password?

MEMBERSHIP BENEFITS