Intel announced a new modem chip for smartphones using faster 5G technologies as it seeks to outpace rival Qualcomm in the battle for next generation mobile gear.

More than 177,000 people attended CES last year, making CES 2016 a record-breaking year.

At CES 2017, Qualcomm plans to showcase its Snapdragon 835, but more than that, it also intends on unveiling another Tango-enabled smartphone, but this time belonging to ASUS, and it is named the ZenFone AR.

Apple will trim production of its iPhone family around 10% on the year in the first quarter of 2017, according to calculations by The Nikkei based on data from suppliers.

Samsung Electronics plans to mass produce 64-layer NAND flash memory for the first time in the world early in 2017, while SK hynix plans to mass produce 72-layer NAND flash in the second half of 2017 jumping over 64-layer NAND flash.

Huawei's Kirin 960 chip actually surpasses the Snapdragon 835 by racking up 1949 points in single-core and 6439 points in multi-core tests.

Intel aims to gain the upper hand in the budding field of artificial intelligence with a new lineup of chip products in 2017, a senior executive said.

HTC is having trouble getting AMOLED headset display panels as competition grows, industry analysts say. Even more glaringly real, newer brands would cut into VIVE's lead anyway.

CEO Durcan sees supply-demand balance persisting in 2017.

Samsung was Apple's main supplier for the iPhones from the very beginning, making the A-series processors and supplying both NAND flash and DRAM memory chips.

SK Hynix is going to mass-produce 10-nano-range DRAMs in 2017 and this will be the world's second mass-production of 10-nano-range DRAMs followed by Samsung Electronics. At the same time when it is finished with development of 1x DRAM, it is going to start developing 1y DRAM and also build up its competitive edge for the future by establishing a development team for 1z DRAM.

Unlike KGI, Macotakara says that the 7s series would not include features like wireless charging or a glass casing. It would be a straightforward internal component update, moving from the A10 chip to the A11 chip, alongside the introduction of the red color option for the exterior.

With Apple expected to launch three new iPhone models next year, a new report suggests the company could slash prices on the 4.7- and 5.5-inch models with legacy LCD technology, allowing them to appeal to a new segment of consumers.

Apple will not refresh the iPhone SE in the first half of 2017, according to KGI Securities analyst Ming-Chi Kuo. The lack of refresh comes as Apple attempts to maintain high margins on its high-end iPhone models, Kuo said in a new research note.

Hon Hai Precision Industry, better known as Foxconn Technology Group, is making wireless charging modules to go with the iPhone's 10th anniversary range slated for release in 2017, according to an industry source familiar with the matter.

LG Electronics is not going to apply modularized structure for its next smartphone called 'G6 (tentative)' that is expected to be released in 2017. It is basically withdrawing its strategy of modularization that was first introduced to G5 in just a year.

TSMC will be ready to take orders for products on the 7nm node by as early as April 2017. This is, of course, a pretty significant announcement because it lets us know the approximate time by which we can expect GPUs and CPUs on the same node.

Looking at 2017, the semiconductor industry should see tight DRAM/NAND supply due to unbalanced supply conditions. Mea

SK Hynix made a plan to mass-produce 13 million-pixel CMOS Image Censor (CIS) from 300 wafer factory called M10, which is located in Icheon, in 2017.

The US Patent and Trademark Office has published a patent application from Apple titled "Electronic Devices with Sapphire-Coated Substrates." The invention is designed to add a sapphire coating to future OLED displays like those that will begin shipping in 2017 and beyond.

Samsung Electronics plans to launch a program to sell refurbished used versions of its premium smartphones as early as 2017, a person with direct knowledge of the matter told Reuters.

Samsung is rumored to be in exclusive talks with Apple about OLED supply, and could be set to ship panels as soon as 2017. LG will presumably miss out on supplying OLED screens for 2017 iPhones, but could be in a position to join the supply chain for 2018.

After a strong 2H16, TSMC's growth could slow in 2017 (JPMe 4% sales growth), due to already 100% share in iPhone 7 and lack of further customer traction at 10nm, said JP Morgan analyst Gokul Hariharan.

Apple plans bigger design changes for 2017, the 10th anniversary of the original iPhone. Those changes could include an edge-to-edge organic light-emitting diode, or OLED, screen and eliminating the home button by building the fingerprint sensor into the display, according to people familiar with the matter.

Samsung Electronics is co-developing EMI shielding process that uses spray method with Protec, which is a South Korean company specializing in dispenser, Asymtek from the US, Hansol Chemical and Ntrium. While Protec and Asymtek are developing equipment, Hansol Chemical and Ntrium are developing EMI masking material that is in a form of ink. Samsung is planning to supply NAND-flash package with EMI shield to Apple when equipment and material are developed. It is predicted that supply will be possible starting from 2017.

I don't expect Intel to roll out server chips built on the company's 10nm technology to roll out in 2017; Intel is expected to introduce its second-generation 14nm server chip family in early to mid-2017. However, if Intel can get the process ramped at high yields during the second half of 2017 with PC-targeted products, it should bode well for a launch of 10nm server processors in the first half of 2018.

The latest leak reveals that the new processor, dubbed Snapdragon 830, will support a massive 8GB of RAM and is expected to come with an enhanced Kryo custom architecture. It will also be built based on Samsung's 10nm process.

That supercomputer in your pocket will soon make Sony's and Microsoft's latest home gaming consoles look old and crusty.

The video shows the phone from a few angles with a look at the innovative display as well as a lack of a physical home button and a main camera that doesn't have a flash LED.

Intel plans to produce its first "10-nanometer" processors in the second half of 2017, CEO Brian Krzanich said Wednesday. Intel hadn't given a start date for the process before, but many observers had expected it to arrive some time next year.

Intel's Cannonlake, originally slated for 2016 and later 2017, is now on hold indefinitely. Instead, Intel's current processors - of the Skylake platform - will be succeeded by the less drastic Kaby Lake platform.

2014 will be the year that wearables become a key consumer technology, as the smart band segment is estimated to reach 8 million annual shipments. Canalys estimates that this number will grow to over 23 million units by 2015, and over 45 million by 2017.

ASML expects new extreme ultraviolet lithography machines to reach a production standard that satisfies all of its semiconductor-equipment customers by 2017, CEO Peter Wennink said.

IC Insights forecasts that in 2017, fabless IC companies will command at least one-third (33%) of the total IC market.

GlobalFoundries is expected to ramp up to 7nm process technology by 2017.

The first production semiconductor fabs to use 450mm wafers are projected to commence operation in 2017, according to Christian Dieseldorff, a senior analyst with the fab tool vendor trade group SEMI's industry research and statistics group.