- 5 May 2010:GlobalFoundries, Samsung and TSMC appear to be engaged in a new capital spending race in an effort to gain share in current and future cycles. They will survive, observers said, adding that UMC and SMIC could hit the wall and/or may get acquired.
- 15 Mar 2010:Abu Dhabi-backed foundry Globalfoundries is planning to spend US$2.5 billion to increase its 300mm wafer manufacturing capacity by 50% in 2010, according to Udo Nothelfer, company VP and general manager of Fab 1 in Dresden, Germany.
- 12 Mar 2010:Hynix Semiconductor has said it would invest 465 billion won (US$410 million) to expand and upgrade its production capacity and research and development.
- 23 Jan 2010:MoneyToday, citing unnamed industry sources, said that Samsung was expected to set this year's capital expenditure for the semiconductor business at about 7 trillion won (US$6.1 billion). The Korean vendor is also planning a new chip production line in its domestic plant, marking the first time in years that it would add a line.
- 18 Jan 2010:"Our goal is to pay back a significant amount of debt while at the same time being able to invest in what we require," said company CEO Kim Jong Kap. "2010 will be a good year for the memory chip industry and the possibility of oversupply seems low."
- 15 Jan 2010:"Samsung Group will invest 26.5 trillion won (US$23.61 billion) and Samsung Electronics will spend 18.4 trillion won," said the official who declined to be identified.
- 25 Dec 2009:Hynix Semiconductor has revised upward its capex budget for 2010 to 2.3 trillion won (US$1.95 billion), according to its company filing with the Korea Exchange. In October, it set a goal of more than 1.5 trillion won.
- 11 Dec 2009:Hynix Semiconductor plans to invest about 2.3 trillion won (about US$2 billion) in its semiconductor business íV 1.5 trillion won in DRAM and 800 billion won in NAND flash memory and logic íV in 2010, a 130% jump from one trillion won this year.
- 9 Dec 2009:Japan's economy in third-quarter 2009 grew sharply less than initial estimates as cautious companies decided to save, not spend.
- 26 Nov 2009:Samsung Electronics has set its 2010 capital expenditure at 8.5 trillion won (US$7.4 billion), up from this year's planned seven trillion won, the Maeil Business Newspaper reported in its early Thursday edition.
- 23 Oct 2009:"Even if Taiwanese and Japanese players ramp up production, the possibility of oversupply is slim as worries over a double-dip in the global economy are easing," says chief executive of Hynix Semiconductor. Sources estimated Hynix' capex for 2010 will double to 2 trillion won.
- 11 Sep 2009:"Despite positive earnings pre-announcements, the overall tone from companies remains relatively muted and cautious," said Doug Freedman, an analyst for Broadpoint AmTech.
- 12 Aug 2009:
- 5 Aug 2009:Toshiba has slashed a forecast for operating profit and sales next fiscal year made before the global recession drove the company to post its first net loss in seven years. It will also cut capital spending to 1.1 trillion yen for 2009 to 2011, from 1.64 trillion yen in the preceding three-year period.
- 27 Jul 2009:Samsung plans to spend 70% of its total chip investment projected in the second half to sharpen the next DRAM chips, while Hynix will also use a great portion of its investment budget for the chips.
- 23 Jul 2009:Robert Rivet, AMD's CFO said in a conference call that capex for subsidiary Globalfoundries would be trimmed to US$690 million.
- 19 May 2009:Samsung Electronics said it will press ahead with its research and development effort. The world's biggest producer of DRAM chips is to spend some US$2 billion on chips R&D for 2009.
- 19 Feb 2009:The market for TFT-LCD equipment may have grown 30% in 2008, but it is expected to drop 41% in 2009, according to The Information Network.
- 18 Feb 2009:A combination of 200mm fab closures and slowing capacity expansions at existing 300mm fabs is expected to result in a NAND flash capital expenditure decline of 58.9% in 2009, according to DRAMeXchange. In 2008, NAND flash capex declined 27.7%.
- Singapore's chip-packaging and testing firm STATS ChipPAC has said that it will not proceed with an exercise to reduce its capital because it was unable to obtain debt financing amid the financial turmoil.
- 7 Jan 2009:A slowdown in technology node migrations at the major DRAM producers is adding to the expected capital expenditure cuts manufacturing as companies struggle to combat increasing losses and preserve cash, according to the latest report from DRAMeXchange. The spending cuts are a direct result of the combined DRAM industry losing approximately US$8 billion in 2008.
- 6 Jan 2009:Samsung Electronics denied a report saying it may cut its 2009 investment in semiconductors by more than half from last year amid a lingering downturn. "At this point, we have not made any decisions on our investment plan, and even if we had a plan it would be contingent on different economic scenarios that will be possible during this year," Chu-Woo-sik, Samsung's executive vice president of investor relations, told Reuters.
- 10 Dec 2008:Chu Woo-sik, the Korean electronics giant's executive vice president in charge of investor relations, said at an investor conference that capital expenditures will drop from about 10 trillion won (US$6.91 billion) expected this year to a range of 7 trillion won (US$4.84 billion) to 8 trillion won (US$5.53 billion) next year.
- 19 Nov 2008:Market research group Gartner has lowered its forecast for semiconductor equipment manufacturing gear sales in 2009, just weeks after a previous downgrade.
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