Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries Ltd (SPIL) are eyeing the low-density (16Mbit to 128Mbit) DRAM packaging market, according to sources.
The article requires paid subscription. Subscribe Now
Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries Ltd (SPIL) are eyeing the low-density (16Mbit to 128Mbit) DRAM packaging market, according to sources.