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The 10nm competition
  • TSMC and Samsung have been competing for clients for the 10nm node.

    Last update: Thursday 16 March 2017 [70 news items]

TSMC board approves US$4.1 billion for capacity expansion

May 10, 22:56

The board of Taiwan Semiconductor Manufacturing Company (TSMC) has approved capital appropriations of approximately US$4.101 billion to expand capacity for advanced-node manufacturing,...

TSMC begins tape-out of 10nm A11 chips for Apple

May 6, 10:48

Taiwan Semiconductor Manufacturing Company (TSMC) has recently begun to tape out the design for Apple's A11 processor built on a 10nm FinFET process, according to industry sources.

Competition in advanced process technologies market to heat up

Apr 25, 21:38

Competition in the market for semiconductor advanced process technologies is expected to heat up, with Samsung Electronics and Taiwan Semiconductor Manufacturing Company (TSMC) striving...

TSMC orders equipment for NT$2.29 billion

Stockwatch - Apr 22, 10:52

Taiwan Semiconductor Manufacturing Company (TSMC) has purchased a batch of machinery equipment and intangible assets from Hermes Microvision (HMI), Fortrend Engineering, Kilopass...

Samsung starts mass producing 10nm class DRAM

Apr 6, 21:36

Samsung Electronics has begun mass producing 10nm-class, 8Gb DDR4 DRAM chips and modules derived from them, according to the company.

Cadence design tools certified for TSMC 7nm design starts and 10nm production

Mar 17, 11:13

Cadence Design Systems has announced that its digital, signoff and custom/analog tools have achieved V1.0 Design Rule Manual (DRM) and SPICE certification from TSMC for its 10nm FinFET...

Front-end fab equipment spending to rise 3.7% in 2016, says SEMI

Mar 14, 12:54

Front-end fab equipment spending (including new, used and in-house) is projected to increase 3.7% to US$37.2 billion in 2016, and will rise another 13% in 2017 to US$42.1 billion,...

Pure-play foundries put capex focus on 10nm processes, says Applied executive

Jan 22, 09:57

The 2016 capex focus of pure-play IC foundries will be on 10nm process technology, according to Applied Materials Taiwan president Erix Yu. About half of the foundries' combined capex...

Applied Materials Taiwan president Erix Yu

TSMC expects to launch 5nm node 2 years after 7nm

Jan 18, 10:30

TSMC will be ready to roll out its 5nm process technology two years after the launch of its 7nm node, according to the pure-play foundry.

TSMC chairman Morris Chang is confident that the company will lead the 10nm foundry market segment

Cadence unveils Virtuoso platform for 10nm processes

Dec 3, 11:19

Cadence Design Systems has announced the delivery of the new Virtuoso advanced-node platform that is enabled for all 10nm FinFET designs. This next-generation custom design platform...

Globalfoundries developing 10nm in-house

Oct 2, 10:57

Globalfoundries plans to develop 10nm process technology in-house instead of relying on licensing from Samsung, according to industry sources.

TSMC growing its 16nm client base

Aug 24, 16:30

Foundry chipmaker TSMC has been actively pursuing 16nm FinFET chip orders in order to gain a majority of market share in the FinFET segment starting 2016, according to market sourc...

Applied Materials intros ALD system for 3D IC manufacturing

Jul 17, 15:27

Applied Materials has unveiled the Applied Olympia ALD (atomic layer deposition) system featuring a modular architecture that delivers high-performance ALD technology to manufacturers...

TSMC says 10nm on schedule

Jul 17, 14:07

TSMC has reiterated plans to move 10nm FinFET technology to risk production at the end of 2016, followed by mass production in the first quarter of 2017.

Morris Chang

Globalfoundries completes acquisition of IBM microelectronics business

Jul 2, 22:06

Globalfoundries has completed its acquisition of IBM's microelectronics business, according to the foundry chipmaker.

Imagination, TSMC collaborate on IoT IP platforms

Jun 9, 16:12

Imagination Technologies has announced the company will work with TSMC to develop a series of advanced IP subsystems for the Internet of Things (IoT) to accelerate time to market...

Cadence, TSMC collaborate on IoT IP subsystem

Jun 9, 11:20

Cadence Design Systems has announced that it is collaborating with TSMC on the development of an Internet of Things (IoT) IP subsystem demonstration platform for TSMC's ultra-low...

TSMC to triple 16nm chip capacity by end-2016, says co-CEO

May 28, 15:52

TSMC is set to move its 16nm FinFET Plus (16FF+) process to commercial production in the second half of 2015, and plans to introduce a compact version of the 16FF+ process in early...

TSMC co-CEO CC Wei

TSMC to beat Samsung in 10nm race

May 27, 22:03

TSMC is confident that the company will beat Samsung Electronics in ramping up production on its 10nm lines, according to the Taiwan-based foundry.

TSMC to build 10nm pilot line in June, says report

Newswatch - May 26, 22:07

Taiwan Semiconductor Manufacturing Company (TSMC) is scheduled to establish a 10nm pilot line at its 12-inch wafer plant in Hsinchu (Fab 12), northern Taiwan, in June, according to...

Applied announces breakthrough technology for patterning copper interconnects at 10nm and beyond

May 21, 21:22

Applied Materials has announced its Applied Endura Cirrus HTX PVD (physical vapor deposition) system with breakthrough technology for patterning copper interconnects at 10nm and beyond...

Applied intros photomask etch solution for quadruple patterning at 10nm and beyond

Apr 21, 16:09

Applied Materials has announced the Applied Centura Tetra Z Photomask Etch system for etching next-generation optical lithographic photomasks needed by the industry to continue multiple...

TSMC to open new fab for 10nm manufacturing in mid-2016, says chairman

Apr 20, 15:42

Taiwan Semiconductor Manufacturing Company (TSMC) will break ground for a new fab at its 12-inch wafer plant in central Taiwan in June 2015. The fab is designed to manufacture chips...

tsmc

Cadence digital and custom/analog tools achieve TSMC certification for 10nm FinFET early design starts

Apr 9, 22:07

Cadence Design Systems has announced that its digital and custom/analog tools have achieved certification from TSMC for its most-current version of 10nm FinFET Design Rule Manual...

Global Unichip expects 1Q15 sales to grow on-quarter

Feb 16, 20:23

Global Unichip, an IC design service provider partnering with Taiwan Semiconductor Manufacturing Company (TSMC), expects to report a sequential increase in first-quarter revenues...

TSMC set to step up investment in central Taiwan

Feb 9, 21:47

Taiwan Semiconductor Manufacturing Company (TSMC) has disclosed plans to invest more than NT$500 billion (US$16 billion) in its manufacturing site at the Central Taiwan Science Park...

TSMC

HiSilicon expands adoption of Cadence tools and IP for advanced-node FinFET designs

Dec 2, 14:38

Cadence Design Systems announced on December 1 that HiSilicon Technologies has signed an agreement to significantly expand its use of the Cadence digital and custom/analog flows for...

Intel to cut a deal with Apple for Fab 42?

Feb 13, 14:27

With shipments of desktop and notebooks in the doldrums since 2010, Intel's PC processor business has been in decline. Meanwhile, AMD and others are taking aim at the Intel-dominated...

UMC to join IBM in 10nm process development

Jun 13, 21:18

United Microelectronics (UMC) has announced that the company will join the IBM joint technology development alliance to participate in the group's development of 10nm CMOS process...

Samsung mass producing 128Gb 3-bit MLC NAND flash

Apr 15, 10:38

Samsung Electronics has begun mass producing a 128Gb, 3-bit multi-level-cell (MLC) NAND memory chip using 10nm-class process technology, according to the company. The new Samsung...

Samsung intros 10nm eMMC NAND

Nov 16, 15:09

Samsung Electronics has announced a next-generation 64GB embedded multimedia card (eMMC) using 10nm-class process technology. The new 64Gb NAND memory went into production late in...

Samsung building eMMC NAND using 10nm process technology

Samsung seeking approval to build chip plant in China

Dec 8, 01:10

Samsung Electronics has issued a statement disclosing plans to set up a flash memory chip plant in China.

Materials and equipment pose challenges for 10nm semiconductor processes

Dec 7, 16:07

While semiconductor manufacturing processes have been continually upgraded through die shrinks, the development of processes for 10nm and below is expected to face challenges related...

wafer

Samsung new memory fab goes on line

Sep 23, 01:30

Samsung Electronics has announced that its new memory semiconductor fabrication facility, Line-16, at its Nano City Complex in Hwaseong, Gyeonggi Province, has commenced operations...

TSMC 2010 capex may exceed planned US$4.8 billion, says chairman

Jun 25, 11:59

Capex spending has been gaining momentum at Taiwan Semiconductor Manufacturing Company (TSMC) recently, and total spending may surpass the company's budget of US$4.8 billion projected...

Morris Chang
70 items [2/2]
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Analysis of China revised domestic semiconductor industry goals
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