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SEMICON Taiwan 2014
  • Semicon Taiwan 2014 will kick off in Taipei from September 3-5, with this year's theme focusing on advanced wafer processes, next-generation memory technologies, 3D ICs and SiP packaging technology.

    Last update: Wednesday 3 September 2014 [3 news items]

Demand of 3D ICs may not take off for 3 years, says Amkor Technology

Sep 3, 15:52

Demand for 3D IC parts may not begin to take off until three years due to concerns of high production costs, according to Mike Liang, president of Amkor Technology Taiwan.

Mike Liang, president of Amkor Technology Taiwan

China to post highest growth in semiconductor manufacturing equipment spending in 2014

Sep 3, 12:05

While Taiwan will remain globally the largest spender on semiconductor manufacturing equipment in 2014, the rise of the semiconductor industry in China will give the country the highest...

Semicon Taiwan 2014: Focus on new processing, packaging technologies

Sep 2, 22:13

Semicon Taiwan 2014 will kick off in Taipei from September 3-5, with this year's theme focusing on advanced wafer processes, next-generation memory technologies, 3D ICs and SiP packaging...

VOICE 2015 Developer Conference
Wireless broadband developments in Southeast Asia markets

30-Jan-2015 markets closed

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TSE electronic375.12-3.70-0.98% 

GTSM (OTC)139.36+0.11+0.08% 

OTC electronic181.15+0.56+0.31% 

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