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SEMICON Taiwan 2014
  • Semicon Taiwan 2014 will kick off in Taipei from September 3-5, with this year's theme focusing on advanced wafer processes, next-generation memory technologies, 3D ICs and SiP packaging technology.

    Last update: Wednesday 3 September 2014 [3 news items]

Demand of 3D ICs may not take off for 3 years, says Amkor Technology

Sep 3, 15:52

Demand for 3D IC parts may not begin to take off until three years due to concerns of high production costs, according to Mike Liang, president of Amkor Technology Taiwan.

Mike Liang, president of Amkor Technology Taiwan

China to post highest growth in semiconductor manufacturing equipment spending in 2014

Sep 3, 12:05

While Taiwan will remain globally the largest spender on semiconductor manufacturing equipment in 2014, the rise of the semiconductor industry in China will give the country the highest...

Semicon Taiwan 2014: Focus on new processing, packaging technologies

Sep 2, 22:13

Semicon Taiwan 2014 will kick off in Taipei from September 3-5, with this year's theme focusing on advanced wafer processes, next-generation memory technologies, 3D ICs and SiP packaging...

Realtime news
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    Before Going to Press | 5h 33min ago

  • Nova to see increasing orders from memory clients

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  • Taiwan Tohcello to establish ICROS tape factory in southern Taiwan

    Before Going to Press | 5h 33min ago

  • Qualcomm reportedly to cut cooperation with Taiwan IT players over IIoT development

    Before Going to Press | 5h 34min ago

  • Epistar chairman expects Mini LEDs to aid on empty capacity issue

    Before Going to Press | 5h 34min ago

  • China solar players considering new plants in US

    Before Going to Press | 5h 34min ago

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China AMOLED panel capacity expansion forecast, 2016-2020

20-Nov-2017 markets closed

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Global notebook shipment forecast, 2017 and beyond
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    TSMC and Samsung have been competing for clients for the 10nm node.

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  • TSMC 3nm fab

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  • SEMICON Taiwan 2017

    Semiconductor equipment and material suppliers are showcasing their latest products and technologies at SEMICON Taiwan 2017 in Taipei September 13-15.

  • China AMOLED panel capacity expansion forecast, 2016-2020

    This Digitimes Research Special Report examines the China AMOLED industry, focusing on the expansion capacity of the makers, the current implementation plans of major smartphone vendors in the market and the technological hurdles faced by the China makers.

  • Global AP demand forecast, 2017-2020

    Digitimes Research expects global AP shipments to surpass the 1.9 billion mark in 2017, with smartphones remaining the main application. Qualcomm will be leading the market in 2017, as other players continue playing catch up and scramble for funds to invest in more diverse applications.

  • Global notebook shipment forecast, 2017 and beyond

    This Digitimes Special Report examines key factors in the notebook industry, including products, vendors and ODMs, that will affect total shipments in 2017 and through 2021.