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Prospects of IC backend sector

Digitimes Research: Taiwan IC backend production value to expand 5.9% in 2014

Apr 11, 10:47

The production value of Taiwan's IC testing and packaging industry is expected to grow 5.9% in 2014, higher than the 4.9% growth posted a year earlier, as well as the 4.2% growth...

ASE performs better than expected in 1Q14

Newswatch - Apr 9, 11:52

Advanced Semiconductor Engineering (ASE) has reported consolidated revenues of NT$54.7 billion (US$1.82 billion) for the first quarter of 2014, which were down 14.8% from the previous...

IC backend service firms to enjoy brisk sales in 2Q14

Apr 8, 15:05

Advanced Semiconductor Engineering (ASE), Siliconware Precision Industries (SPIL) and other IC backend service companies are expected to enjoy brisk sales in the second quarter of...

ASE, Inotera reportedly to set up 3D IC packaging joint venture

Mar 31, 21:48

Advanced Semiconductor Engineering (ASE) reportedly plans to team up with Inotera Memories to set up a joint venture for handling TSV (through-silicon via) 3D IC packaging.

ASE may land more packaging orders for Apple A8 CPUs

Mar 11, 21:40

Advanced Semiconductor Engineering (ASE) may land a higher portion of packaging orders for Apple's next-generation A8 processor than the 20% expected previously, according to industry...

apple

SPIL to perform better than expected in 1Q14

Mar 10, 14:50

IC testing and packaging company Siliconware Precision Industries (SPIL) is expected to perform better than its guidance set for the first quarter of 2014 as clients are building...

Categories: Bits + chips
UMC
Global AP demand forecast, 2017-2020

17-Nov-2017 markets closed

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Global notebook shipment forecast, 2017 and beyond
  • The 10nm competition

    TSMC and Samsung have been competing for clients for the 10nm node.

  • Qualcomm royalty row

    Qualcomm faces pressure to renegotiate royalty terms with clients as more phone vendors reportedly mull following Apple's lead in suspending payments...

  • TSMC 3nm fab

    TSMC will build its 3nm fab in southern Taiwan.

  • SEMICON Taiwan 2017

    Semiconductor equipment and material suppliers are showcasing their latest products and technologies at SEMICON Taiwan 2017 in Taipei September 13-15.

  • China AMOLED panel capacity expansion forecast, 2016-2020

    This Digitimes Research Special Report examines the China AMOLED industry, focusing on the expansion capacity of the makers, the current implementation plans of major smartphone vendors in the market and the technological hurdles faced by the China makers.

  • Global AP demand forecast, 2017-2020

    Digitimes Research expects global AP shipments to surpass the 1.9 billion mark in 2017, with smartphones remaining the main application. Qualcomm will be leading the market in 2017, as other players continue playing catch up and scramble for funds to invest in more diverse applications.

  • Global notebook shipment forecast, 2017 and beyond

    This Digitimes Special Report examines key factors in the notebook industry, including products, vendors and ODMs, that will affect total shipments in 2017 and through 2021.