Packaging and testing firms see sales bottom in 1Q12
Major Taiwan-based IC packaging and testing houses including Advanced Semiconductor Engineering (ASE), Silicon Precision Industries (SPIL), Powertech Technology (PTI) and Walton Advanced Engineering all expect sales to start growing after hitting bottom in the first quarter.
Last update: Friday 16 March 2012 [6 news items]
Ardentec sees sales bottom out in 1Q12
Mar 16, 15:45
IC testing house Ardentec expects sales to start growing after hitting bottom in the first quarter of 2012, as orders, particularly those placed by Europe-based customers, pick up...
Walton says 1Q12 revenues to hit bottom
Feb 17, 01:15
Walton Advanced Engineering expects sales to register sequential growth starting the second quarter after hitting bottom in the first. The memory-IC backend service provider has also...
SPIL chair sees chip market rebound
Feb 16, 16:40
The global semiconductor market is expected to stage a quick recovery after hitting bottom in the first quarter of 2012, Silicon Precision Industries (SPIL) chairman Bough Lin said...
ASE expects sales rebound in 2Q12
Feb 13, 10:46
Advanced Semiconductor Engineering (ASE) has estimated that its core IC assembly test and material (ATM) business will post another sequential decrease of 6-9% in shipments in the...
PTI 1Q12 sales to drop up to 10%, says chairman
Feb 10, 01:30
Memory packaging and testing specialist Powertech Technology (PTI) now expects its sales to decrease up to 10% sequentially in the first quarter of 2012, company chairman DK Tsai...
LCD market to rebound in 2Q12, says Chipbond
Dec 22, 01:05
Chipbond Technology has expressed caution about the company's business outlook for the rest of 2011 and first-quarter 2012, as generally weak demand continues to plague the LCD panel...