Taipei, Wednesday, September 20, 2017 15:36 (GMT+8)
partly cloudy
Taipei
34°C
News tagged Tessera
  • Last update: Tuesday 3 May 2016 [15 news items]

Invensas signs BVA technology license and development agreement with ASE

May 3, 13:57

Tessera Technologies has announced that its wholly-owned subsidiary Invensas signed a new technology license and development agreement with Advanced Semiconductor Engineering (ASE)...

ASE payment to settle patent litigation with Tessera reduced

Nov 6, 19:51

Advanced Semiconductor Engineering (ASE) has issued a company filing with the Taiwan Stock Exchange (TSE) announcing that its payment to settle patent disputes with Tessera have been...

PTI to pay Tessera US$196 million in patent lawsuit settlement

Stockwatch - Feb 27, 15:54

Packaging and testing firm Powertech Technology (PTI) has issued a company filing with the Taiwan Stock Exchange (TSE) disclosing it has settled a patent infringement dispute with...

ASE to pay US$30 million to Tessera to settle patent case

Feb 26, 15:34

Advanced Semiconductor Engineering (ASE) has issued a company filing with the Taiwan Stock Exchange (TSE) announcing that the company will pay Tessera a total of US$30 million to...

STATS ChipPAC enters into license and settlement agreement with Tessera

Jan 29, 11:30

STATS ChipPAC announced on January 29 that it has signed a patent license and settlement agreement with Tessera. The agreement results in the dismissal of all claims and counterclaims...

Samsung, Hynix renew license deals with Tessera through 2017

Nov 24, 16:39

Tessera Technologies on November 23 announced that Hynix Semiconductor has exercised the renewal option in its 2005 license agreement to extend the term to May 2017.

PTI seeking clarity on ITC ruling in Tessera DRAM case

Mar 9, 14:27

Despite receiving a favorable ruling in a US International Trade Commission (ITC) over a patent infringement lawsuit brought by Tessera, memory packaging and testing service provider...

IC packaging and testing companies feeling relief after Tessera lost in lawsuit against DRAM makers

Dec 31, 15:58

Taiwan-based IC packaging and testing companies, along with DRAM chip vendors, have felt a sense of relief after the US International Trade Commission (ITC) issued a final determination...

Tessera loses ITC chip-patent case against DRAM makers and sellers

Dec 30, 12:25

Nanya Technology on December 30 announced the US International Trade Commission (ITC) has affirmed the company and other DRAM makers that no violation was found in the Investigation...

Tessera terminates patent lawsuit against packaging and testing firms

Mar 18, 10:37

Tessera Technologies has withdrawn a patent infringement lawsuit against Taiwan- and Singapore-based IC packaging and testing service providers, with industry soruces saying that...

Tessera licenses micro-PILR technology to Taiwan-based Kinsus

Feb 12, 16:23

Tessera Technologies has announced that Taiwan IC substrate maker Kinsus Interconnect Technology has licensed Tessera's micro-PILR interconnect platform, which reduces semiconductor...

Tessera licenses TSV technology to Korea-based packaging house

Oct 2, 17:07

Tessera Technologies has announced today that Advanced Wafer Level Packaging Inc. (AWLP) has licensed its full range of Shellcase image sensor packaging technologies, including its...

Tessera single-element VGA lens to enter volume production in 1Q09

Sep 23, 01:00

Tessera Technologies a provider of transformational technologies that enable innovation in next-generation electronics, announced its new Product Launch Services, which will provide...

Tessera WLC VGA lens module

Tessera highlights competitive cost structure of its wafer-level camera

Jun 23, 10:56

Tessera has highlighted the competitive cost structure of its new wafer-level camera (WLC) compared with traditional solutions, adding that active customer engagement is already un...

Tessera progressing on wafer-level camera licensing

Jun 13, 11:35

With more CMOS image sensor makers migrating their products to wafer-level camera (WLC) production in light of benefits such as smaller form factor and cost reduction, Tessera Technologies...

Tessera WLC
Realtime news
  • Diverse LPWAN specs available for different IoT applications

    Mobile + telecom | 50min ago

  • Acer increases marketing budget for gaming notebooks

    IT + CE | 1h 2min ago

  • UL to help Taiwan set up certification capability for offshore wind farms

    Green energy | 1h 7min ago

  • FormoSat-5 sends blurry images

    IT + CE | 1h 16min ago

  • Touch Taiwan 2017: ITRI showcases flexible display, touch technologies

    Displays | 1h 24min ago

  • India PV firms eyeing overseas markets

    Green energy | 1h 27min ago

  • PCB firm Unitech president steps down

    Bits + chips | 1h 38min ago

  • Leading-edge paves way for pure-play foundry growth, says IC Insights

    Bits + chips | 1h 41min ago

  • Intel reschedules Cannon Lake launch to year-end 2018, say sources

    IT + CE | 1h 44min ago

  • Synopsys tapes out DesignWare, Interface IP for TSMC 7nm FinFET process

    Bits + chips | 2h 3min ago

  • EIH, Plastic Logic strengthen e-paper partnership

    Displays | 2h 5min ago

  • Taiwan market: CHT teams up with Fox+ to provide OTT service

    Mobile + telecom | 2h 10min ago

  • NAND flash supply to stay tight til end-2017, says Phison chairman

    Bits + chips | 2h 13min ago

  • Touch Taiwan 2017: Corning showcases advanced glass technologies

    Displays | 2h 15min ago

  • Intel provides 10nm updates, plan for 10nm FPGA

    Bits + chips | 4h 47min ago

  • Touch Taiwan 2017: GIS to highlight smart touch panel solutions

    Before Going to Press | Sep 19, 21:42

Pause
 | 
View more
Global notebook shipment forecast, 2017 and beyond
Global AP demand forecast, 2017-2020

20-Sep-2017 markets closed

 LastChange

TAIEX (TSE)10519.17-56.97-0.54% 

TSE electronic447.25-2.84-0.63% 

GTSM (OTC)142.07-0.40-0.28% 

OTC electronic210.41-0.69-0.33% 

Global notebook shipment forecast, 2017 and beyond
  • China AMOLED panel capacity expansion forecast, 2016-2020

    This Digitimes Research Special Report examines the China AMOLED industry, focusing on the expansion capacity of the makers, the current implementation plans of major smartphone vendors in the market and the technological hurdles faced by the China makers.

  • Taiwan server shipment forecast and industry analysis, 2017

    Digitimes Research estimates that revenues from sales of server motherboards, servers, storage systems and related network system equipment by Taiwan-based vendors reached NT$555.8 billion in 2016 and the amount is estimated to grow 5.9% on year in 2017.

  • Global notebook shipment forecast, 2017 and beyond

    This Digitimes Special Report examines key factors in the notebook industry, including products, vendors and ODMs, that will affect total shipments in 2017 and through 2021.