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News tagged Tessera
  • Last update: Thursday 27 February 2014 [13 news items]

PTI to pay Tessera US$196 million in patent lawsuit settlement

Stockwatch - Feb 27, 15:54

Packaging and testing firm Powertech Technology (PTI) has issued a company filing with the Taiwan Stock Exchange (TSE) disclosing it has settled a patent infringement dispute with...

ASE to pay US$30 million to Tessera to settle patent case

Feb 26, 15:34

Advanced Semiconductor Engineering (ASE) has issued a company filing with the Taiwan Stock Exchange (TSE) announcing that the company will pay Tessera a total of US$30 million to...

STATS ChipPAC enters into license and settlement agreement with Tessera

Jan 29, 11:30

STATS ChipPAC announced on January 29 that it has signed a patent license and settlement agreement with Tessera. The agreement results in the dismissal of all claims and counterclaims...

Samsung, Hynix renew license deals with Tessera through 2017

Nov 24, 16:39

Tessera Technologies on November 23 announced that Hynix Semiconductor has exercised the renewal option in its 2005 license agreement to extend the term to May 2017.

PTI seeking clarity on ITC ruling in Tessera DRAM case

Mar 9, 14:27

Despite receiving a favorable ruling in a US International Trade Commission (ITC) over a patent infringement lawsuit brought by Tessera, memory packaging and testing service provider...

IC packaging and testing companies feeling relief after Tessera lost in lawsuit against DRAM makers

Dec 31, 15:58

Taiwan-based IC packaging and testing companies, along with DRAM chip vendors, have felt a sense of relief after the US International Trade Commission (ITC) issued a final determination...

Tessera loses ITC chip-patent case against DRAM makers and sellers

Dec 30, 12:25

Nanya Technology on December 30 announced the US International Trade Commission (ITC) has affirmed the company and other DRAM makers that no violation was found in the Investigation...

Tessera terminates patent lawsuit against packaging and testing firms

Mar 18, 10:37

Tessera Technologies has withdrawn a patent infringement lawsuit against Taiwan- and Singapore-based IC packaging and testing service providers, with industry soruces saying that...

Tessera licenses micro-PILR technology to Taiwan-based Kinsus

Feb 12, 16:23

Tessera Technologies has announced that Taiwan IC substrate maker Kinsus Interconnect Technology has licensed Tessera's micro-PILR interconnect platform, which reduces semiconductor...

Tessera licenses TSV technology to Korea-based packaging house

Oct 2, 17:07

Tessera Technologies has announced today that Advanced Wafer Level Packaging Inc. (AWLP) has licensed its full range of Shellcase image sensor packaging technologies, including its...

Tessera single-element VGA lens to enter volume production in 1Q09

Sep 23, 01:00

Tessera Technologies a provider of transformational technologies that enable innovation in next-generation electronics, announced its new Product Launch Services, which will provide...

Tessera WLC VGA lens module

Tessera highlights competitive cost structure of its wafer-level camera

Jun 23, 10:56

Tessera has highlighted the competitive cost structure of its new wafer-level camera (WLC) compared with traditional solutions, adding that active customer engagement is already un...

Tessera progressing on wafer-level camera licensing

Jun 13, 11:35

With more CMOS image sensor makers migrating their products to wafer-level camera (WLC) production in light of benefits such as smaller form factor and cost reduction, Tessera Technologies...

Tessera WLC
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