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Thursday 17 February 2022
Kinsus to expand production capacity for ABF substrates in 2022, 2023
Kinsus Interconnect Technology is on track to expand its production capacity for ABF substrates by 30-40% in 2022, and by another 40% in 2023, to meet ever-increasing demand for processing...
Tuesday 15 February 2022
Rising materials prices boost Nan Ya January revenue
Taiwan-based Nan Ya Plastics has reported revenues grew 2.1% sequentially and 20.2% on year to NT$35.27 billion (US$1.27 billion) in January 2022, buoyed by rising prices of its electronics...
Wednesday 9 February 2022
Nan Ya PCB posts record January revenue
Nan Ya PCB has reported its consolidated revenue climbed 33.6% on year to a record high of NT$5.24 billion (US$188.3 million) in January 2022.
Tuesday 8 February 2022
Mirle fulfills NT$1 billion worth of orders from AUO
AU Optronics (AUO) has announced the purchase of a batch of equipment from Mirle Automation for NT$1.02 billion (US$36.6 million).
Thursday 27 January 2022
Nan Ya PCB to expand ABF substrate capacity in Taiwan and China
Taiwan-based Nan Ya PCB, which specializes in the manufacture of IC substrates, has announced plans to further expand fab capacities in Taiwan and China for high-end ABF substrates...
Monday 24 January 2022
Strong graphics card sales to buoy ASRock, TUL
Buoyed by strong graphics card sales, ASRock and TUL are expected to post brisk revenue and profit results in the first half of 2022, according to industry sources.
Wednesday 19 January 2022
Taiwan ABF substrate makers eyeing new profits with new capacities
Taiwan-based ABF substrate suppliers expect the activation of new production capacities later this year and in 2023 to boost their profits amid tight supplies, according to industry...
Thursday 30 December 2021
WT Microelectronics to gain from rising SiC penetration in EV, industrial apps
Green energy gaining momentum amid growing calls for carbon emission reduction is expected to accelerate the penetration of third-generation semiconductors GaN and SiC in EV and industrial...
Wednesday 29 December 2021
Unimicron showcases FOPLP substrates at SEMICON Taiwan 2021
IC substrate supplier Unimicron Technology is showcasing its newly-developed fan-out panel-level packaging (FOPLP) substrates at the ongoing SEMICON Taiwan 2021, looking to better...
Tuesday 28 December 2021
Semco reportedly to build new ABF substrate capacity in Vietnam to serve Intel
Samsung Electro-Mechanics (Semco) reportedly will set up a new ABF substrate plant in Vietnam mainly to provide dedicated capacity for Intel, with construction slated to kick off...
Friday 24 December 2021
ABF substrate makers keep expanding production capacities
ABF substrate makers Unimicron Technology, Nan Ya PCB, and Kinsus Interconnect Technology have added capital expenditure to keep expanding production capacities, according to the...
Wednesday 22 December 2021
EMC to issue bonds for capacity expansion on IC substrate CCLs
Taiwan-based CCL manufacturer Elite Material (EMC) has disclosed plans to issue NT$3.5 billion (US$125.7 million) in convertible corporate bonds to fund its capacity expansion for...
Wednesday 22 December 2021
Car-use thermal material sales to drive Ventec revenue gains in 2022
Taiwan-based Ventec Electronics, dedicated to specialty copper-clad laminates (CCL) and thermal materials, expects shipments of high-performance thermal substrate materials for automotive...
Wednesday 22 December 2021
ABF substrate supply to see 20% shortage throughout 2022, says Unimicron
The supply of ABF substrates will continue to be at least 20% short of demand in 2022, and the crunch may start to ease only after most of new capacities at suppliers come online...
Monday 20 December 2021
Unimicron to increase 2022 capex on ABF substrate capacity for non-Intel clients
Taiwan's leading IC substrate maker Unimicron Technology has recently scaled up its capital expenses for 2022 to NT$35.858 billion (US$1.287 billion) from the originally planned level...
Holtek
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research