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News tagged SPIL
  • Last update: Thursday 3 September 2015 [285 news items]

Taiwan likely to lift cross-strait ban on backend semiconductor technology soon

Dec 30, 10:14

The Taiwan government will likely lift a ban on local firms setting up more advanced packaging and testing operations in China in early 2010, according to market sources. The government...

Amkor raises 4Q09 revenue guidance; Taiwan rivals expect growth

Dec 23, 14:18

Amkor Technology has announced it expects revenues for the fourth quarter to grow by around 6% sequentially, attributing the better outlook to higher-than-expected customer demand...

IC packaging and testing companies experiencing strong orders for December 09 and 1Q10

Dec 7, 14:05

Most Taiwan-based chip packaging and testing houses have received stronger than expected orders for December 2009 as well as for the first quarter of 2010, expecting minimal seasonal...

STATS ChipPAC moves copper wire bonding process to volume production

Nov 25, 11:23

STATS ChipPAC has ramped production on its copper wire bonding process, joining rivals Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL).

ASE, SPIL revenues expected to drop slightly in November

Newswatch - Nov 17, 15:14

Chip packaging and testing house Advanced Semiconductor Engineering (ASE) is likely to see revenues slip by less than 5% on month in November 2009, while Siliconware Precision Industries...

SPIL to buy factory from PSC for NT$1.78 billion

Nov 12, 14:48

Chip packaging and testing house Siliconware Precision Industries (SPIL) has announced it will spend NT$1.78 billion (US$54.94 million) buying a factory with production equipment...

ASE and SPIL revenues hit 2-year high in October

Nov 10, 13:46

IC packaging and testing house Advanced Semiconductor Engineering (ASE) saw revenues in October 2009 reach a two-year high at NT$4.9 billion (US$152 million), while rival Siliconware...

ASE, SPIL speeding up copper wire bonding expansion

Nov 2, 16:34

Advanced Semiconductor Engineering (ASE) plans to add an additional 2,000 copper wirebonders by the end of 2010, while Siliconware Precision Industries (SPIL) will add 200-300 copper...

SPIL says 2010 capex to double

Oct 29, 11:57

Siliconware Precision Industries (SPIL) has set its capex budget for 2010 at NT$10 billion (US$307.7 million), doubling from NT$5.3 billion allocated for 2009, according to company...

SPIL chairman Bough Lin

ASE and SPIL deny headhunting rumors

Oct 16, 12:23

Taiwan-based chip packaging houses Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have both come out to deny a Citi Investment Research report...

ASE and SPIL 4Q09 revenues expected to beat seasonal patterns

Oct 15, 13:46

Market watchers have revised upward their revenue growth estimates for Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL), and expect the IC packaging...

SPIL to raise capex for 2009, say sources

Newswatch - Oct 15, 12:05

Siliconware Precision Industries (SPIL) is expected to announce an upward revision of its projected capex for 2009 at its upcoming investors conference, according to industry sources...

ASE and SPIL resume on-year growth in September

Oct 7, 16:57

IC packaging and testing firms Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) both saw revenues for September 2009 grow on year, ending a streak...

ASE ramping copper wire bonding output

Oct 1, 14:18

Advanced Semiconductor Engineering (ASE) has been ramping up its output utilizing a copper wire bonding process, with shipments of such ICs reaching over 50 million units in the past...

SPIL and OSE microSD card packaging to run at full capacity on Samsung orders

Sep 28, 16:39

Siliconware Precision Industries (SPIL) and Orient Semiconductor Electronics (OSE) recently landed more outsourcing orders for packaging microSD card modules from Samsung Electronics,...

MediaTek to shift to 45nm in 1Q10

Sep 25, 14:08

MediaTek plans to leap to 45nm processing for 3G chips in the first quarter of 2010 despite that volume production of 65nm WCDMA chips is scheduled to begin in the fourth quarter...

ASE and SPIL monthly sales still down on year, but declines narrowing

Newswatch - Sep 8, 11:51

Advanced Semiconductor Engineering (ASE) has announced consolidated revenues of NT$8.35 billion (US$254 million) for August, with the on-year decline narrowing to negative 4.9%. Rival...

KYEC announces Taiwan Memory investment

Newswatch - Aug 21, 10:33

Logic IC and memory testing house King Yuan Electronics Company (KYEC) announced on August 20 that its board of directors has approved the investment in Taiwan Memory Company (TMC)...

IC backend suppliers expected to see lower revenues but higher gross margins in 4Q09

Newswatch - Aug 20, 16:55

Taiwan-based IC packaging and testing service providers are expected to post sequential revenue drops of less than 10% in the fourth quarter of 2009, but overall gross margins may...

SPIL board approves investment in Taiwan Memory

Aug 14, 10:24

Packaging and testing house Siliconware Precision Industries (SPIL) has announced its board of directors on August 13 approved plans to invest in Taiwan Memory Company (TMC), making...

SPIL chairman Bough Lin

ASE and SPIL continue to see sales recovery

Aug 11, 16:46

Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have reported sequential revenue increases from February through July 2009, with smaller on-year...

ASE, SPIL to expand high-end process capacity

Aug 3, 17:09

Advanced Semiconductor Engineering (ASE) plans to increase wire-bond and bumping capacity, and Siliconware Precision Industries (SPIL) will expand its flip-chip (FC) ball-grid array...

Top backend houses to see revenues grow in 3Q09

Aug 3, 12:14

Amkor Technology is expected to see the strongest revenue growth among top packaging and testing houses in th third quarter, followed by Advanced Semiconductor Engineering (ASE),...

SPIL chairman anticipates rising demand from emerging markets in 3Q09

Jul 30, 10:46

Following a better-than-expected second quarter financial report, IC packaging and testing firm Siliconware Precision...

SPIL chairman Bough Lin

SPIL posts 54% sales growth in 2Q09, margins edging up

Jul 29, 17:04

IC packager Siliconware Precision Industries (SPIL) has announced revenues for second-quarter 2009 grew 53.6% sequentially to NT$14.14 billion (US$430 million), and margins for the...

IC backend firms expect 10% revenue decline in 4Q09

Jul 27, 16:37

IC packaging and testing houses estimate revenues will peak in the third quarter of 2009, and decline 10% in the fourth. Shipment forecasts from foundries show that fourth-quarter...

MediaTek to ship 100 million handset chips in 3Q09, says paper

Newswatch - Jul 20, 14:22

MediaTek's handset chip shipments are expected to reach 100 million units in the third quarter, hitting the company's record, and topping 350 million units in 2009, according to industry...

Intel orders expected to help ASE and SPIL outperform 3Q sales expectations

Jul 16, 12:30

IC packaging and testing firms Advanced Engineering Semiconductor (ASE) and Siliconware Precision Industries (SPIL) are likely to outperform market watchers' expectation of 10% sequential...

ASE, SPIL to benefit from Qualcomm Snapdragon business

Jul 15, 12:03

Qualcomm's new platform Snapdragon is in the process of validation and volume production is scheduled for the end of the third quarter, which will help boost utilization rates of...

SPIL 2Q09 sales up more than 50%

Jul 8, 15:53

Siliconware Precision Industries (SPIL) has announced unaudited revenues for second-quarter 2009 grew 53.6% sequentially to NT$14.14 billion (US$431.24 million), beating market watchers'...

IC testing house KYEC ups capex for 2009

Jul 2, 12:16

King Yuan Electronics Company (KYEC) has adjusted upward its capex budget for 2009 by 50% to NT$3 billion (US$91.66 million), which will be utilized for purchases of new test equipment...

SPIL to merge with wholly-owned investment subsidiary

Newswatch - Jun 26, 14:38

Siliconware Precision Industries (SPIL) plans to merge with its 100%-owned subsidiary, Siliconware Investment Company, in order to simplify the group's structure and reduce its management...

Driver IC testing, COF prices raised by 10-30%

Jun 12, 16:38

IC packaging and testing companies have indicated that some driver IC customers have suggested raising backend manufacturing prices to speed up production. Chipbond Technology and...

chipbod

SPIL interested in Taiwan Memory investment

Jun 12, 15:13

IC backend supplier Siliconware Precision Industries (SPIL) has expressed interest in investing in the government-led Taiwan Memory Company (TMC) project, which is seeking investment...

SPIL chairman Bough Lin

ASE and SPIL implementing capex plans for 2009

Jun 11, 16:24

Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have started implementing their capex plans for 2009, with each placing orders for 200 wire bonders...

(Right to left) SPIL chairman Bough Lin and president CW Tsai
285 items [7/9]
  • SPIL+anticipates+3Q+revenues+to+exceed+NT%2410+billion

    SPIL anticipates 3Q revenues to exceed NT$10 billion

    Bough Lin, chairman of SPIL, stated the company's BGA packaging lines are currently tight. The chip packaging and testing firm plans to install additional 700 fine-pitch wire bonders...

    Photo: Allen Lin, DigiTimes, Jul 29.

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