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News tagged SPIL
  • Last update: Monday 29 June 2015 [272 news items]

ASE ramping copper wire bonding output

Oct 1, 14:18

Advanced Semiconductor Engineering (ASE) has been ramping up its output utilizing a copper wire bonding process, with shipments of such ICs reaching over 50 million units in the past...

SPIL and OSE microSD card packaging to run at full capacity on Samsung orders

Sep 28, 16:39

Siliconware Precision Industries (SPIL) and Orient Semiconductor Electronics (OSE) recently landed more outsourcing orders for packaging microSD card modules from Samsung Electronics,...

MediaTek to shift to 45nm in 1Q10

Sep 25, 14:08

MediaTek plans to leap to 45nm processing for 3G chips in the first quarter of 2010 despite that volume production of 65nm WCDMA chips is scheduled to begin in the fourth quarter...

ASE and SPIL monthly sales still down on year, but declines narrowing

Newswatch - Sep 8, 11:51

Advanced Semiconductor Engineering (ASE) has announced consolidated revenues of NT$8.35 billion (US$254 million) for August, with the on-year decline narrowing to negative 4.9%. Rival...

KYEC announces Taiwan Memory investment

Newswatch - Aug 21, 10:33

Logic IC and memory testing house King Yuan Electronics Company (KYEC) announced on August 20 that its board of directors has approved the investment in Taiwan Memory Company (TMC)...

IC backend suppliers expected to see lower revenues but higher gross margins in 4Q09

Newswatch - Aug 20, 16:55

Taiwan-based IC packaging and testing service providers are expected to post sequential revenue drops of less than 10% in the fourth quarter of 2009, but overall gross margins may...

SPIL board approves investment in Taiwan Memory

Aug 14, 10:24

Packaging and testing house Siliconware Precision Industries (SPIL) has announced its board of directors on August 13 approved plans to invest in Taiwan Memory Company (TMC), making...

SPIL chairman Bough Lin

ASE and SPIL continue to see sales recovery

Aug 11, 16:46

Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have reported sequential revenue increases from February through July 2009, with smaller on-year...

ASE, SPIL to expand high-end process capacity

Aug 3, 17:09

Advanced Semiconductor Engineering (ASE) plans to increase wire-bond and bumping capacity, and Siliconware Precision Industries (SPIL) will expand its flip-chip (FC) ball-grid array...

Top backend houses to see revenues grow in 3Q09

Aug 3, 12:14

Amkor Technology is expected to see the strongest revenue growth among top packaging and testing houses in th third quarter, followed by Advanced Semiconductor Engineering (ASE),...

SPIL chairman anticipates rising demand from emerging markets in 3Q09

Jul 30, 10:46

Following a better-than-expected second quarter financial report, IC packaging and testing firm Siliconware Precision...

SPIL chairman Bough Lin

SPIL posts 54% sales growth in 2Q09, margins edging up

Jul 29, 17:04

IC packager Siliconware Precision Industries (SPIL) has announced revenues for second-quarter 2009 grew 53.6% sequentially to NT$14.14 billion (US$430 million), and margins for the...

IC backend firms expect 10% revenue decline in 4Q09

Jul 27, 16:37

IC packaging and testing houses estimate revenues will peak in the third quarter of 2009, and decline 10% in the fourth. Shipment forecasts from foundries show that fourth-quarter...

MediaTek to ship 100 million handset chips in 3Q09, says paper

Newswatch - Jul 20, 14:22

MediaTek's handset chip shipments are expected to reach 100 million units in the third quarter, hitting the company's record, and topping 350 million units in 2009, according to industry...

Intel orders expected to help ASE and SPIL outperform 3Q sales expectations

Jul 16, 12:30

IC packaging and testing firms Advanced Engineering Semiconductor (ASE) and Siliconware Precision Industries (SPIL) are likely to outperform market watchers' expectation of 10% sequential...

ASE, SPIL to benefit from Qualcomm Snapdragon business

Jul 15, 12:03

Qualcomm's new platform Snapdragon is in the process of validation and volume production is scheduled for the end of the third quarter, which will help boost utilization rates of...

SPIL 2Q09 sales up more than 50%

Jul 8, 15:53

Siliconware Precision Industries (SPIL) has announced unaudited revenues for second-quarter 2009 grew 53.6% sequentially to NT$14.14 billion (US$431.24 million), beating market watchers'...

IC testing house KYEC ups capex for 2009

Jul 2, 12:16

King Yuan Electronics Company (KYEC) has adjusted upward its capex budget for 2009 by 50% to NT$3 billion (US$91.66 million), which will be utilized for purchases of new test equipment...

SPIL to merge with wholly-owned investment subsidiary

Newswatch - Jun 26, 14:38

Siliconware Precision Industries (SPIL) plans to merge with its 100%-owned subsidiary, Siliconware Investment Company, in order to simplify the group's structure and reduce its management...

Driver IC testing, COF prices raised by 10-30%

Jun 12, 16:38

IC packaging and testing companies have indicated that some driver IC customers have suggested raising backend manufacturing prices to speed up production. Chipbond Technology and...

chipbod

SPIL interested in Taiwan Memory investment

Jun 12, 15:13

IC backend supplier Siliconware Precision Industries (SPIL) has expressed interest in investing in the government-led Taiwan Memory Company (TMC) project, which is seeking investment...

SPIL chairman Bough Lin

ASE and SPIL implementing capex plans for 2009

Jun 11, 16:24

Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have started implementing their capex plans for 2009, with each placing orders for 200 wire bonders...

(Right to left) SPIL chairman Bough Lin and president CW Tsai

ASE, SPIL sales up 15% sequentially in May

Jun 9, 17:07

Taiwan's major IC packaging and testing houses, Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL), have announced revenues for May 2009 increased...

ASE, SPIL optimistic about 3Q09

Jun 2, 16:10

Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industry (SPIL) have fully utilized all wire bonders, with the former using 60-70% and the latter 70-80% of their...

ASE and SPIL sales recovery continue in April

May 7, 10:35

Packaging and testing houses Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) saw sales continue improving in April, with narrower revenue drops...

ASE posts second straight quarterly loss, whereas SPIL swings to profit

Apr 30, 10:44

Advanced Semiconductor Engineering (ASE) have announced its net loss for the first quarter of 2009 expanded to NT$1.57 billion (US$46.9 million), whereas Siliconware Precision Industries...

ASE and SPIL 2Q09 revenues to grow over 30%

Apr 27, 16:25

Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) will likely enjoy revenue growth of more than 30% sequentially in the second quarter of 2009,...

IC packaging firms ASE and SPIL gain shifted orders

Newswatch - Apr 23, 16:58

Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have recently seen more orders shifted from Amkor Technology, STATS ChipPAC Taiwan Semiconductor...

ASE production line

Integrated handheld solutions driving demand for wafer-level packaging, says ASE

Apr 13, 16:00

Handheld devices incorporating functionality such as Bluetooth, FM radio, GPS and Wi-Fi have become the market driver for wafer-level packaging (WLP), Taiwan's Advanced Semiconductor...

ASE 1Q09 revenues beat guidance

Newswatch - Apr 8, 15:24

Packaging and testing house Advanced Semiconductor Engineering (ASE) has announced revenues of NT$5.5 billion (US$163 million) for March, up 28.2% on month. The company's first-quarter...

Packaging firm SPIL revenues up 29% in March, likely to swing to profits in 1Q09

Apr 6, 12:17

Siliconware Precision Industries (SPIL) has announced revenues of NT$3.87 billion (US$117 million) for March, an increase of 28.9% on month. However, its accumulated sales for the...

ASE 1Q revenue drop expected to narrow from original forecast

Newswatch - Mar 27, 17:13

With Amkor Technology recently revising up its gross margin outlook for the first quarter and indicating that its revenues will fall into the avorable end of the range of the company's...

ASE, SPIL 2Q utilization to rebound

Newswatch - Mar 25, 12:07

Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) may see their packaging and testing utilization rates climb to 60% in the second quarter of 2009,...

IC packaging and testing firms to see April growth

Mar 20, 16:13

Advanced Semiconductor Engineering (ASE), Siliconware Precision Industries (SPIL) and King Yuan Electronics Company (KYEC) will see better-than-expected performances in April amid...

Tessera terminates patent lawsuit against packaging and testing firms

Mar 18, 10:37

Tessera Technologies has withdrawn a patent infringement lawsuit against Taiwan- and Singapore-based IC packaging and testing service providers, with industry soruces saying that...

272 items [7/8]
  • SPIL+anticipates+3Q+revenues+to+exceed+NT%2410+billion

    SPIL anticipates 3Q revenues to exceed NT$10 billion

    Bough Lin, chairman of SPIL, stated the company's BGA packaging lines are currently tight. The chip packaging and testing firm plans to install additional 700 fine-pitch wire bonders...

    Photo: Allen Lin, DigiTimes, Jul 29.

Taiwan server shipment forecast and industry analysis, 2015
2015 global tablet demand forecast

6-Jul-2015 markets closed

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2015 global notebook demand forecast
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