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News tagged SPIL
  • Last update: Wednesday 13 May 2015 [270 news items]

Backend supplier UTAC says sales of copper wirebonding process growing

May 18, 11:48

United Test and Assembly Center (UTAC) has seen sales generated from copper wire bonding account for 20% of its total revenues, according to company CEO Lee Joon Chung. Apart from...

AMD said to use bulk 40nm at TSMC for Fusion chips

May 13, 12:12

AMD reportedly plans to outsource wafer starts for its Fusion CPUs with integrated graphics to Taiwan Semiconductor Manufacturing Company (TSMC) using bulk 40nm process technology,...

ASE, SPIL see sequential revenue drops in April

May 10, 16:51

Chip packaging and testing firm Advanced Semiconductor Engineering (ASE) has announced consolidated revenues for April 2010 totaled NT$14.66 billion (US$465.6 million), down 7.5%...

ASE 1Q10 earnings beat market expectations

Apr 30, 16:56

Chip packaging and testing house Advanced Semiconductor Engineering (ASE) has announced net profits of NT$3.395 billion (US$108 million) on consolidated revenues of NT$37.555 billion...

SPIL posts weaker-than-expected 1Q10 results

Apr 29, 11:11

Chip packaging and testing house Siliconware Precision Industries (SPIL) saw net profits for the first quarter of 2010 decline 60% sequentially to NT$1.51 billion (US$48.31 million)...

SPIL chairman Bough Lin

Market watchers upbeat on TSMC, UMC 2Q10

Apr 26, 14:21

Taiwan Semiconductor Manufacturing Company (TSMC) and United Microelectronics Corporation (UMC) are expected to guide for mid to high single-digit revenue growth sequentially in the...

ASE 1Q10 revenues up on quarter, but SPIL down

Apr 8, 10:21

Chip packaging and testing house Advanced Semiconductor Engineering (ASE) has reported consolidated revenues for the first quarter rose 42.8% sequentially to NT$37.56 billion. Meanwhile,...

ChipMOS expects strong 1Q10

Mar 19, 16:19

ChipMOS Technologies expects its revenues for the first quarter of 2010 to stay flat or increase by a single-digit percentage from the fourth quarter of 2009 thanks to increasing...

Semiconductor firms step up hiring of new employees

Mar 12, 10:25

Major Taiwan-based foundries and backend suppliers, including Taiwan Semiconductor Manufacturing Company (TSMC), United Microelectronics Corporation (UMC), Advanced Semiconductor...

ASE February 2010 revenues up on month, but SPIL down

Mar 9, 16:24

IC packaging and testing house Advanced Semiconductor Engineering (ASE) has announced revenues for February 2010 grew 1.1% sequentially to NT$4.67 billion (US$147 million). Meanwhile,...

SPIL to drop out from LCD driver IC, DRAM segments; sell related equipment to ChipMOS

Mar 1, 11:39

Siliconware Precision Industries (SPIL) has announced that it will take a 15.8% stake in ChipMOS Technologies in exchange for all of its of LCD driver IC packaging and testing equipment...

Amkor to boost 1Q10 capex

Feb 12, 15:00

Amkor Technology has said it plans to allocate a capex of US$100-125 million for the first quarter of 2010, a significant rise compared to US$69 million spent a year ago. The figure...

Greatek and TICP to step into copper-wire bonding in 2Q10

Feb 11, 14:58

With Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) aggressively ramping production on copper-wire bond processes, second-tier Taiwan-based IC...

Major IC backend houses report stronger-than-expected revenues for January

Feb 9, 11:34

IC packaging specialist Advanced Semiconductor Engineering (ASE) saw consolidated revenues remain almost flat on month in January, whereas rival Siliconware Precision Industries (SPIL)...

Global IC packaging and testing industry looks to double-digit growth in 2010, says SPIL chairman

Feb 4, 12:26

The global IC packaging and testing industry is expected to grow by a double-digit rate in 2010, according to Bough Lin, chairman of Siliconware Precision Industries (SPIL). In line...

SPIL chairman Bough Lin

SPIL stepping up pace of copper wirebonder purchases

Feb 1, 16:05

Siliconware Precision Industries (SPIL), which falls behind Advanced Semiconductor Engineering (ASE) in copper-wire bonding processes, plans to add an additional 400-600 copper wire...

UMC teams up with three others to seek government funding for MEMS project

Jan 28, 12:01

United Microelectronics Corporation (UMC) has teamed up with Integrated Technology Express (ITE), Siliconware Precision Industries (SPIL) and King Yuan Electronics (KYEC) to jointly...

ASE and SPIL to see strong 1Q10

Jan 8, 16:39

IC packaging and testing houses Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) are expected to see revenues drop less than 5% sequentially in...

Spansion to strengthen ties with Taiwan backend partners, says executive

Jan 7, 15:29

Spansion intends to enhance cooperation with its Taiwan-based partners such as Powertech Technology (PTI) and Siliconware Precision Industries (SPIL) in 2010, according to John Nation,...

IC packaging and testing companies feeling relief after Tessera lost in lawsuit against DRAM makers

Dec 31, 15:58

Taiwan-based IC packaging and testing companies, along with DRAM chip vendors, have felt a sense of relief after the US International Trade Commission (ITC) issued a final determination...

Taiwan likely to lift cross-strait ban on backend semiconductor technology soon

Dec 30, 10:14

The Taiwan government will likely lift a ban on local firms setting up more advanced packaging and testing operations in China in early 2010, according to market sources. The government...

Amkor raises 4Q09 revenue guidance; Taiwan rivals expect growth

Dec 23, 14:18

Amkor Technology has announced it expects revenues for the fourth quarter to grow by around 6% sequentially, attributing the better outlook to higher-than-expected customer demand...

IC packaging and testing companies experiencing strong orders for December 09 and 1Q10

Dec 7, 14:05

Most Taiwan-based chip packaging and testing houses have received stronger than expected orders for December 2009 as well as for the first quarter of 2010, expecting minimal seasonal...

STATS ChipPAC moves copper wire bonding process to volume production

Nov 25, 11:23

STATS ChipPAC has ramped production on its copper wire bonding process, joining rivals Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL).

ASE, SPIL revenues expected to drop slightly in November

Newswatch - Nov 17, 15:14

Chip packaging and testing house Advanced Semiconductor Engineering (ASE) is likely to see revenues slip by less than 5% on month in November 2009, while Siliconware Precision Industries...

SPIL to buy factory from PSC for NT$1.78 billion

Nov 12, 14:48

Chip packaging and testing house Siliconware Precision Industries (SPIL) has announced it will spend NT$1.78 billion (US$54.94 million) buying a factory with production equipment...

ASE and SPIL revenues hit 2-year high in October

Nov 10, 13:46

IC packaging and testing house Advanced Semiconductor Engineering (ASE) saw revenues in October 2009 reach a two-year high at NT$4.9 billion (US$152 million), while rival Siliconware...

ASE, SPIL speeding up copper wire bonding expansion

Nov 2, 16:34

Advanced Semiconductor Engineering (ASE) plans to add an additional 2,000 copper wirebonders by the end of 2010, while Siliconware Precision Industries (SPIL) will add 200-300 copper...

SPIL says 2010 capex to double

Oct 29, 11:57

Siliconware Precision Industries (SPIL) has set its capex budget for 2010 at NT$10 billion (US$307.7 million), doubling from NT$5.3 billion allocated for 2009, according to company...

SPIL chairman Bough Lin

ASE and SPIL deny headhunting rumors

Oct 16, 12:23

Taiwan-based chip packaging houses Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have both come out to deny a Citi Investment Research report...

ASE and SPIL 4Q09 revenues expected to beat seasonal patterns

Oct 15, 13:46

Market watchers have revised upward their revenue growth estimates for Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL), and expect the IC packaging...

SPIL to raise capex for 2009, say sources

Newswatch - Oct 15, 12:05

Siliconware Precision Industries (SPIL) is expected to announce an upward revision of its projected capex for 2009 at its upcoming investors conference, according to industry sources...

ASE and SPIL resume on-year growth in September

Oct 7, 16:57

IC packaging and testing firms Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) both saw revenues for September 2009 grow on year, ending a streak...

ASE ramping copper wire bonding output

Oct 1, 14:18

Advanced Semiconductor Engineering (ASE) has been ramping up its output utilizing a copper wire bonding process, with shipments of such ICs reaching over 50 million units in the past...

SPIL and OSE microSD card packaging to run at full capacity on Samsung orders

Sep 28, 16:39

Siliconware Precision Industries (SPIL) and Orient Semiconductor Electronics (OSE) recently landed more outsourcing orders for packaging microSD card modules from Samsung Electronics,...

270 items [6/8]
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  • SPIL+anticipates+3Q+revenues+to+exceed+NT%2410+billion

    SPIL anticipates 3Q revenues to exceed NT$10 billion

    Bough Lin, chairman of SPIL, stated the company's BGA packaging lines are currently tight. The chip packaging and testing firm plans to install additional 700 fine-pitch wire bonders...

    Photo: Allen Lin, DigiTimes, Jul 29.

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