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News tagged SPIL
  • Last update: Friday 11 April 2014 [253 news items]

ASE core ATM business posts 7% growth in 3Q10 sales

Oct 7, 02:00

Chip packager Advanced Semiconductor Engineering (ASE) saw sales of its ATM (assembly test and material) division grow 7.3% sequentially to NT$34.02 billion (US$1.1 billion) in the...

SPIL 3Q10 sales miss market estimates

Oct 6, 15:02

Taiwan-based chip packager Siliconware Precision Industries (SPIL) collected NT$5.22 billion (US$169 million) in consolidated revenues in September 2010, down 6.4% from August, according...

ASE holds rosy outlook on 4Q10 business

Sep 20, 10:49

Taiwan-based IC packaging/testing service provider Advanced Semiconductor Engineering (ASE) has seen better orders than originally expected due to strong demand for handsets and consumer...

SPIL enters LED packaging market

Sep 14, 15:26

Siliconware Precision Industries (SPIL) has entered the LED packaging business and started LED shipments through wirebonding packaging technology to three US-based clients. It is...

SPIL posts flat revenues in August

Sep 7, 11:36

Siliconware Precision Industries (SPIL) saw sales stay almost flat sequentially in August 2010, according to data released by the company. Market watchers expect the chip packaging...

Chip backend firms to see revenues rebound in August

Aug 18, 14:25

Chip packagers Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL), and testing specialists King Yuan Electronics Company (KYEC) and Sigurd Microelectronics...

IC packaging and testing firms post revenue gains in July

Aug 6, 12:14

Several major Taiwan-based packaging and testing companies have reported sequential revenue gains for July 2010.

SPIL announces equipment purchase

Stockwatch - Aug 3, 14:43

Siliconware Precision Industries (SPIL) has announced an equipment purchase worth NT$574.62 million (US$18 million) from Verigy, which mainly supplies automated test equipment.

SPIL on copper wirebonder buying spree

Jul 29, 13:12

Siliconware Precision Industries (SPIL) has revealed that another 600 copper wirebonders will be installed at its production sites in China and Taiwan during the third quarter. Total...

SPIL chairman Bough Lin

SPIL 2Q10 earnings below expectation

Jul 28, 17:42

Chip packaging and testing company Siliconware Precision Industries (SPIL) saw second-quarter consolidated revenues grow by only 4.5% sequentially, missing market watchers' estimates...

IC packaging and testing houses turn conservative over 3Q10 outlook

Jul 15, 16:08

Taiwan-based IC packaging and testing companies are conservative about the outlook for the third quarter after Intel projected a moderate revenue growth for the traditional peak season,...

ASE posts monthly sales record in June

Jul 7, 12:24

Chip packager Advanced Semiconductor Engineering (ASE) posted consolidated revenues of NT$16.26 billion (US$504.65 million) in June 2010, up 4.9% sequentially and hitting a new monthly...

ASE, SPIL to feel constrained by capacity crunch

Jul 5, 15:32

Advanced Semiconductor Engineering (ASE) and Silicon Precision Industries (SPIL) are likely to see constraints in fab capacity limit their abilities to support strong revenue growth...

SPIL approves NT$21 billion for 2010 capex

Stockwatch - Jun 25, 13:43

The board of directors of Siliconware Precision Industries (SPIL) has approved plans to budget NT$21 billion (US$652 million) in capex for 2010, according to a company filing with...

SPIL declines to comment on reported order for AMD CPUs

Stockwatch - Jun 22, 12:26

Chip packaging and testing service provider Siliconware Precision Industries (SPIL) has declined to comment on reports that it has received a large order from AMD for CPUs, according...

SPIL to raise 2010 capex budget for copper wire bonding equipment procurement

Jun 17, 10:30

Chip packaging house Siliconware Precision Industries (SPIL) will raise 2010 capex budget by at least 30% from US$450 million to about US$585 million due to increased procurement...

ASE, SPIL May revenues up on month

Jun 8, 14:23

Chip packaging and testing houses Advanced Semiconductor Engineering (ASE) and Silicon Precision Industries (SPIL) saw their consolidated revenues for May 2010 grow 5.7% and 2.9%...

Chip packagers reportedly to raise quotes on gold costs

May 19, 11:44

Higher gold prices have prompted chip packaging houses to consider transferring rising material costs to customers. Advanced Semiconductor Engineering (ASE) started adjusting quotes...

Backend supplier UTAC says sales of copper wirebonding process growing

May 18, 11:48

United Test and Assembly Center (UTAC) has seen sales generated from copper wire bonding account for 20% of its total revenues, according to company CEO Lee Joon Chung. Apart from...

AMD said to use bulk 40nm at TSMC for Fusion chips

May 13, 12:12

AMD reportedly plans to outsource wafer starts for its Fusion CPUs with integrated graphics to Taiwan Semiconductor Manufacturing Company (TSMC) using bulk 40nm process technology,...

ASE, SPIL see sequential revenue drops in April

May 10, 16:51

Chip packaging and testing firm Advanced Semiconductor Engineering (ASE) has announced consolidated revenues for April 2010 totaled NT$14.66 billion (US$465.6 million), down 7.5%...

ASE 1Q10 earnings beat market expectations

Apr 30, 16:56

Chip packaging and testing house Advanced Semiconductor Engineering (ASE) has announced net profits of NT$3.395 billion (US$108 million) on consolidated revenues of NT$37.555 billion...

SPIL posts weaker-than-expected 1Q10 results

Apr 29, 11:11

Chip packaging and testing house Siliconware Precision Industries (SPIL) saw net profits for the first quarter of 2010 decline 60% sequentially to NT$1.51 billion (US$48.31 million)...

SPIL chairman Bough Lin

Market watchers upbeat on TSMC, UMC 2Q10

Apr 26, 14:21

Taiwan Semiconductor Manufacturing Company (TSMC) and United Microelectronics Corporation (UMC) are expected to guide for mid to high single-digit revenue growth sequentially in the...

ASE 1Q10 revenues up on quarter, but SPIL down

Apr 8, 10:21

Chip packaging and testing house Advanced Semiconductor Engineering (ASE) has reported consolidated revenues for the first quarter rose 42.8% sequentially to NT$37.56 billion. Meanwhile,...

ChipMOS expects strong 1Q10

Mar 19, 16:19

ChipMOS Technologies expects its revenues for the first quarter of 2010 to stay flat or increase by a single-digit percentage from the fourth quarter of 2009 thanks to increasing...

Semiconductor firms step up hiring of new employees

Mar 12, 10:25

Major Taiwan-based foundries and backend suppliers, including Taiwan Semiconductor Manufacturing Company (TSMC), United Microelectronics Corporation (UMC), Advanced Semiconductor...

ASE February 2010 revenues up on month, but SPIL down

Mar 9, 16:24

IC packaging and testing house Advanced Semiconductor Engineering (ASE) has announced revenues for February 2010 grew 1.1% sequentially to NT$4.67 billion (US$147 million). Meanwhile,...

SPIL to drop out from LCD driver IC, DRAM segments; sell related equipment to ChipMOS

Mar 1, 11:39

Siliconware Precision Industries (SPIL) has announced that it will take a 15.8% stake in ChipMOS Technologies in exchange for all of its of LCD driver IC packaging and testing equipment...

Amkor to boost 1Q10 capex

Feb 12, 15:00

Amkor Technology has said it plans to allocate a capex of US$100-125 million for the first quarter of 2010, a significant rise compared to US$69 million spent a year ago. The figure...

Greatek and TICP to step into copper-wire bonding in 2Q10

Feb 11, 14:58

With Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) aggressively ramping production on copper-wire bond processes, second-tier Taiwan-based IC...

Major IC backend houses report stronger-than-expected revenues for January

Feb 9, 11:34

IC packaging specialist Advanced Semiconductor Engineering (ASE) saw consolidated revenues remain almost flat on month in January, whereas rival Siliconware Precision Industries (SPIL)...

Global IC packaging and testing industry looks to double-digit growth in 2010, says SPIL chairman

Feb 4, 12:26

The global IC packaging and testing industry is expected to grow by a double-digit rate in 2010, according to Bough Lin, chairman of Siliconware Precision Industries (SPIL). In line...

SPIL chairman Bough Lin

SPIL stepping up pace of copper wirebonder purchases

Feb 1, 16:05

Siliconware Precision Industries (SPIL), which falls behind Advanced Semiconductor Engineering (ASE) in copper-wire bonding processes, plans to add an additional 400-600 copper wire...

UMC teams up with three others to seek government funding for MEMS project

Jan 28, 12:01

United Microelectronics Corporation (UMC) has teamed up with Integrated Technology Express (ITE), Siliconware Precision Industries (SPIL) and King Yuan Electronics (KYEC) to jointly...

253 items [5/8]
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  • SPIL+anticipates+3Q+revenues+to+exceed+NT%2410+billion

    SPIL anticipates 3Q revenues to exceed NT$10 billion

    Bough Lin, chairman of SPIL, stated the company's BGA packaging lines are currently tight. The chip packaging and testing firm plans to install additional 700 fine-pitch wire bonders...

    Photo: Allen Lin, DigiTimes, Jul 29.

2014 global high brightness LED market
China smartphone tracker

16-Apr-2014 markets closed

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2014 global notebook demand forecast
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  • Global AMOLED market analysis and forecast, 2011-2015

    This report analyzes the current state of development and strategies of the two largest AMOLED panel makers, Samsung and LG Display, examines the potential of the AMOLED handset panel and OLED TV markets, and takes an in-depth look at the competitiveness of S. Korea in the AMOLED sector.

  • ASPs of TD-LTE chips to remain stable initially as suppliers are limited

    While a number of IC vendors have begun shipping chips supporting TD-LTE, including base band chips, radio frequency chips, APs, SoC solutions and soft modems, shipments of base band chips account for a majority share of total TD-LTE chip shipments currently, according to Digitimes Research.