SPIL stepping up pace of copper wirebonder purchases

Feb 1, 16:05

Siliconware Precision Industries (SPIL), which falls behind Advanced Semiconductor Engineering (ASE) in copper-wire bonding processes, plans to add an additional 400-600 copper wire...

UMC teams up with three others to seek government funding for MEMS project

Jan 28, 12:01

United Microelectronics Corporation (UMC) has teamed up with Integrated Technology Express (ITE), Siliconware Precision Industries (SPIL) and King Yuan Electronics (KYEC) to jointly...

ASE and SPIL to see strong 1Q10

Jan 8, 16:39

IC packaging and testing houses Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) are expected to see revenues drop less than 5% sequentially in...

Spansion to strengthen ties with Taiwan backend partners, says executive

Jan 7, 15:29

Spansion intends to enhance cooperation with its Taiwan-based partners such as Powertech Technology (PTI) and Siliconware Precision Industries (SPIL) in 2010, according to John Nation,...

IC packaging and testing companies feeling relief after Tessera lost in lawsuit against DRAM makers

Dec 31, 15:58

Taiwan-based IC packaging and testing companies, along with DRAM chip vendors, have felt a sense of relief after the US International Trade Commission (ITC) issued a final determination...

Taiwan likely to lift cross-strait ban on backend semiconductor technology soon

Dec 30, 10:14

The Taiwan government will likely lift a ban on local firms setting up more advanced packaging and testing operations in China in early 2010, according to market sources. The government...

Amkor raises 4Q09 revenue guidance; Taiwan rivals expect growth

Dec 23, 14:18

Amkor Technology has announced it expects revenues for the fourth quarter to grow by around 6% sequentially, attributing the better outlook to higher-than-expected customer demand...

IC packaging and testing companies experiencing strong orders for December 09 and 1Q10

Dec 7, 14:05

Most Taiwan-based chip packaging and testing houses have received stronger than expected orders for December 2009 as well as for the first quarter of 2010, expecting minimal seasonal...

STATS ChipPAC moves copper wire bonding process to volume production

Nov 25, 11:23

STATS ChipPAC has ramped production on its copper wire bonding process, joining rivals Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL).

ASE, SPIL revenues expected to drop slightly in November

Newswatch - Nov 17, 15:14

Chip packaging and testing house Advanced Semiconductor Engineering (ASE) is likely to see revenues slip by less than 5% on month in November 2009, while Siliconware Precision Industries...

SPIL to buy factory from PSC for NT$1.78 billion

Nov 12, 14:48

Chip packaging and testing house Siliconware Precision Industries (SPIL) has announced it will spend NT$1.78 billion (US$54.94 million) buying a factory with production equipment...

ASE and SPIL revenues hit 2-year high in October

Nov 10, 13:46

IC packaging and testing house Advanced Semiconductor Engineering (ASE) saw revenues in October 2009 reach a two-year high at NT$4.9 billion (US$152 million), while rival Siliconware...

ASE, SPIL speeding up copper wire bonding expansion

Nov 2, 16:34

Advanced Semiconductor Engineering (ASE) plans to add an additional 2,000 copper wirebonders by the end of 2010, while Siliconware Precision Industries (SPIL) will add 200-300 copper...

ASE and SPIL deny headhunting rumors

Oct 16, 12:23

Taiwan-based chip packaging houses Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have both come out to deny a Citi Investment Research report...

ASE and SPIL 4Q09 revenues expected to beat seasonal patterns

Oct 15, 13:46

Market watchers have revised upward their revenue growth estimates for Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL), and expect the IC packaging...

SPIL to raise capex for 2009, say sources

Newswatch - Oct 15, 12:05

Siliconware Precision Industries (SPIL) is expected to announce an upward revision of its projected capex for 2009 at its upcoming investors conference, according to industry sources...

ASE and SPIL resume on-year growth in September

Oct 7, 16:57

IC packaging and testing firms Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) both saw revenues for September 2009 grow on year, ending a streak...

ASE ramping copper wire bonding output

Oct 1, 14:18

Advanced Semiconductor Engineering (ASE) has been ramping up its output utilizing a copper wire bonding process, with shipments of such ICs reaching over 50 million units in the past...

SPIL and OSE microSD card packaging to run at full capacity on Samsung orders

Sep 28, 16:39

Siliconware Precision Industries (SPIL) and Orient Semiconductor Electronics (OSE) recently landed more outsourcing orders for packaging microSD card modules from Samsung Electronics,...

MediaTek to shift to 45nm in 1Q10

Sep 25, 14:08

MediaTek plans to leap to 45nm processing for 3G chips in the first quarter of 2010 despite that volume production of 65nm WCDMA chips is scheduled to begin in the fourth quarter...

ASE and SPIL monthly sales still down on year, but declines narrowing

Newswatch - Sep 8, 11:51

Advanced Semiconductor Engineering (ASE) has announced consolidated revenues of NT$8.35 billion (US$254 million) for August, with the on-year decline narrowing to negative 4.9%. Rival...

KYEC announces Taiwan Memory investment

Newswatch - Aug 21, 10:33

Logic IC and memory testing house King Yuan Electronics Company (KYEC) announced on August 20 that its board of directors has approved the investment in Taiwan Memory Company (TMC)...

IC backend suppliers expected to see lower revenues but higher gross margins in 4Q09

Newswatch - Aug 20, 16:55

Taiwan-based IC packaging and testing service providers are expected to post sequential revenue drops of less than 10% in the fourth quarter of 2009, but overall gross margins may...

ASE and SPIL continue to see sales recovery

Aug 11, 16:46

Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have reported sequential revenue increases from February through July 2009, with smaller on-year...

ASE, SPIL to expand high-end process capacity

Aug 3, 17:09

Advanced Semiconductor Engineering (ASE) plans to increase wire-bond and bumping capacity, and Siliconware Precision Industries (SPIL) will expand its flip-chip (FC) ball-grid array...

Top backend houses to see revenues grow in 3Q09

Aug 3, 12:14

Amkor Technology is expected to see the strongest revenue growth among top packaging and testing houses in th third quarter, followed by Advanced Semiconductor Engineering (ASE),...

SPIL posts 54% sales growth in 2Q09, margins edging up

Jul 29, 17:04

IC packager Siliconware Precision Industries (SPIL) has announced revenues for second-quarter 2009 grew 53.6% sequentially to NT$14.14 billion (US$430 million), and margins for the...

IC backend firms expect 10% revenue decline in 4Q09

Jul 27, 16:37

IC packaging and testing houses estimate revenues will peak in the third quarter of 2009, and decline 10% in the fourth. Shipment forecasts from foundries show that fourth-quarter...

MediaTek to ship 100 million handset chips in 3Q09, says paper

Newswatch - Jul 20, 14:22

MediaTek's handset chip shipments are expected to reach 100 million units in the third quarter, hitting the company's record, and topping 350 million units in 2009, according to industry...

Intel orders expected to help ASE and SPIL outperform 3Q sales expectations

Jul 16, 12:30

IC packaging and testing firms Advanced Engineering Semiconductor (ASE) and Siliconware Precision Industries (SPIL) are likely to outperform market watchers' expectation of 10% sequential...

ASE, SPIL to benefit from Qualcomm Snapdragon business

Jul 15, 12:03

Qualcomm's new platform Snapdragon is in the process of validation and volume production is scheduled for the end of the third quarter, which will help boost utilization rates of...