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News tagged SPIL
  • Last update: Tuesday 2 December 2014 [262 news items]

SPIL reportedly seeking to buy KYEC shares from UMC

Jan 6, 01:45

Industry rumors have circulated that Siliconware Precision Industries (SPIL) is in talks with United Microelectronics Corporation (UMC) about a takeover of UMC's holdings in testing...

IC packagers see stronger-than-expected 1Q11

Jan 4, 13:56

IC packaging and testing houses will see demand for the first quarter of 2011 stronger than the same period in previous years, when revenues were usually dragged down by 10-15% sequentially,...

ASE, SPIL post mixed results for November

Dec 7, 02:15

Advanced Semiconductor Engineering (ASE) saw net sales generated from its core ATM (assembly test and material) business slide 3.9% sequentially to NT$10.74 billion (US$356 million)...

MediaTek reportedly negotiating new prices with UMC and backend service providers

Nov 29, 12:29

MediaTek is reportedly negotiating with United Microelectronics Corporation (UMC) as well as backend service providers including Advanced Semiconductor Engineering (ASE) and Siliconware...

ASE grabs copper wirebonding orders from second-tier players

Nov 24, 01:10

With Silicon Precision Industries (SPIL) quickly catching up with Advanced Semiconductor Engineering (ASE) in copper wirebonding, ASE is currently attempting to win orders over second-tier...

ASE, SPIL October revenues down on-month

Nov 9, 01:40

Chip packagers Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) both saw revenues decrease on month in October 2010, according to data released...

Packaging and testing sector to see 7-13% growth in 2011, says SPIL chairman

Oct 28, 02:10

Siliconware Precision Industries (SPIL) chairman Bough Lin expects the packaging and testing sector to see a 7-13% rise in 2011, and the overall chip market to show stable growth.

SPIL chairman Bough Lin

SPIL 3Q10 profits down 42% on year, revenues slip

Oct 28, 01:00

Chip packager Siliconware Precision Industries (SPIL) has announced net profits of NT$1.49 billion (US$48 million) for the third quarter of 2010, down 41.8% from a year earlier. Net...

ASE and SPIL likely to see 1Q11 profits halve, says paper

Newswatch - Oct 12, 14:29

Major chip packagers Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) are likely to see their profits for the first quarter of 2011 halve from...

ASE core ATM business posts 7% growth in 3Q10 sales

Oct 7, 02:00

Chip packager Advanced Semiconductor Engineering (ASE) saw sales of its ATM (assembly test and material) division grow 7.3% sequentially to NT$34.02 billion (US$1.1 billion) in the...

SPIL 3Q10 sales miss market estimates

Oct 6, 15:02

Taiwan-based chip packager Siliconware Precision Industries (SPIL) collected NT$5.22 billion (US$169 million) in consolidated revenues in September 2010, down 6.4% from August, according...

ASE holds rosy outlook on 4Q10 business

Sep 20, 10:49

Taiwan-based IC packaging/testing service provider Advanced Semiconductor Engineering (ASE) has seen better orders than originally expected due to strong demand for handsets and consumer...

SPIL enters LED packaging market

Sep 14, 15:26

Siliconware Precision Industries (SPIL) has entered the LED packaging business and started LED shipments through wirebonding packaging technology to three US-based clients. It is...

SPIL posts flat revenues in August

Sep 7, 11:36

Siliconware Precision Industries (SPIL) saw sales stay almost flat sequentially in August 2010, according to data released by the company. Market watchers expect the chip packaging...

Chip backend firms to see revenues rebound in August

Aug 18, 14:25

Chip packagers Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL), and testing specialists King Yuan Electronics Company (KYEC) and Sigurd Microelectronics...

IC packaging and testing firms post revenue gains in July

Aug 6, 12:14

Several major Taiwan-based packaging and testing companies have reported sequential revenue gains for July 2010.

SPIL announces equipment purchase

Stockwatch - Aug 3, 14:43

Siliconware Precision Industries (SPIL) has announced an equipment purchase worth NT$574.62 million (US$18 million) from Verigy, which mainly supplies automated test equipment.

SPIL on copper wirebonder buying spree

Jul 29, 13:12

Siliconware Precision Industries (SPIL) has revealed that another 600 copper wirebonders will be installed at its production sites in China and Taiwan during the third quarter. Total...

SPIL chairman Bough Lin

SPIL 2Q10 earnings below expectation

Jul 28, 17:42

Chip packaging and testing company Siliconware Precision Industries (SPIL) saw second-quarter consolidated revenues grow by only 4.5% sequentially, missing market watchers' estimates...

IC packaging and testing houses turn conservative over 3Q10 outlook

Jul 15, 16:08

Taiwan-based IC packaging and testing companies are conservative about the outlook for the third quarter after Intel projected a moderate revenue growth for the traditional peak season,...

ASE posts monthly sales record in June

Jul 7, 12:24

Chip packager Advanced Semiconductor Engineering (ASE) posted consolidated revenues of NT$16.26 billion (US$504.65 million) in June 2010, up 4.9% sequentially and hitting a new monthly...

ASE, SPIL to feel constrained by capacity crunch

Jul 5, 15:32

Advanced Semiconductor Engineering (ASE) and Silicon Precision Industries (SPIL) are likely to see constraints in fab capacity limit their abilities to support strong revenue growth...

SPIL approves NT$21 billion for 2010 capex

Stockwatch - Jun 25, 13:43

The board of directors of Siliconware Precision Industries (SPIL) has approved plans to budget NT$21 billion (US$652 million) in capex for 2010, according to a company filing with...

SPIL declines to comment on reported order for AMD CPUs

Stockwatch - Jun 22, 12:26

Chip packaging and testing service provider Siliconware Precision Industries (SPIL) has declined to comment on reports that it has received a large order from AMD for CPUs, according...

SPIL to raise 2010 capex budget for copper wire bonding equipment procurement

Jun 17, 10:30

Chip packaging house Siliconware Precision Industries (SPIL) will raise 2010 capex budget by at least 30% from US$450 million to about US$585 million due to increased procurement...

ASE, SPIL May revenues up on month

Jun 8, 14:23

Chip packaging and testing houses Advanced Semiconductor Engineering (ASE) and Silicon Precision Industries (SPIL) saw their consolidated revenues for May 2010 grow 5.7% and 2.9%...

Chip packagers reportedly to raise quotes on gold costs

May 19, 11:44

Higher gold prices have prompted chip packaging houses to consider transferring rising material costs to customers. Advanced Semiconductor Engineering (ASE) started adjusting quotes...

Backend supplier UTAC says sales of copper wirebonding process growing

May 18, 11:48

United Test and Assembly Center (UTAC) has seen sales generated from copper wire bonding account for 20% of its total revenues, according to company CEO Lee Joon Chung. Apart from...

AMD said to use bulk 40nm at TSMC for Fusion chips

May 13, 12:12

AMD reportedly plans to outsource wafer starts for its Fusion CPUs with integrated graphics to Taiwan Semiconductor Manufacturing Company (TSMC) using bulk 40nm process technology,...

ASE, SPIL see sequential revenue drops in April

May 10, 16:51

Chip packaging and testing firm Advanced Semiconductor Engineering (ASE) has announced consolidated revenues for April 2010 totaled NT$14.66 billion (US$465.6 million), down 7.5%...

ASE 1Q10 earnings beat market expectations

Apr 30, 16:56

Chip packaging and testing house Advanced Semiconductor Engineering (ASE) has announced net profits of NT$3.395 billion (US$108 million) on consolidated revenues of NT$37.555 billion...

SPIL posts weaker-than-expected 1Q10 results

Apr 29, 11:11

Chip packaging and testing house Siliconware Precision Industries (SPIL) saw net profits for the first quarter of 2010 decline 60% sequentially to NT$1.51 billion (US$48.31 million)...

SPIL chairman Bough Lin

Market watchers upbeat on TSMC, UMC 2Q10

Apr 26, 14:21

Taiwan Semiconductor Manufacturing Company (TSMC) and United Microelectronics Corporation (UMC) are expected to guide for mid to high single-digit revenue growth sequentially in the...

ASE 1Q10 revenues up on quarter, but SPIL down

Apr 8, 10:21

Chip packaging and testing house Advanced Semiconductor Engineering (ASE) has reported consolidated revenues for the first quarter rose 42.8% sequentially to NT$37.56 billion. Meanwhile,...

ChipMOS expects strong 1Q10

Mar 19, 16:19

ChipMOS Technologies expects its revenues for the first quarter of 2010 to stay flat or increase by a single-digit percentage from the fourth quarter of 2009 thanks to increasing...

262 items [5/8]
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  • SPIL+anticipates+3Q+revenues+to+exceed+NT%2410+billion

    SPIL anticipates 3Q revenues to exceed NT$10 billion

    Bough Lin, chairman of SPIL, stated the company's BGA packaging lines are currently tight. The chip packaging and testing firm plans to install additional 700 fine-pitch wire bonders...

    Photo: Allen Lin, DigiTimes, Jul 29.

Wireless broadband developments in Southeast Asia markets
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DIGITIMES Translation Services
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