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News tagged SPIL
  • Last update: Wednesday 13 May 2015 [270 news items]

ChipMOS looks to higher capex in 2012

Jan 10, 15:32

ChipMOS Technology has set aside a capital expenditure budget of US$85 million for 2012, an increase of 10.4% from 2011.

ASE, SPIL, PTI, Sigurd see decrease in December revenues

Jan 10, 01:05

Advanced Semiconductor Engineering (ASE), Siliconware Precision Industries (SPIL), Powertech Technology (PTI) and Sigurd Microelectronics, four Taiwan-based providers of IC packaging...

ASE, SPIL post slight drops in 4Q11 sales

Jan 9, 16:42

Advanced Semiconductor Engineering (ASE) has announced that revenues of its core IC assembly test and material (ATM) business slid 2.1% sequentially in the fourth quarter of 2011,...

SPIL steps into LED packaging

Dec 30, 16:48

Siliconware Precision Industries (SPIL), a Taiwan-based provider of IC packaging/testing service, has stepped into high-end packaging of multiple LED chips, according to company vice...

Backend firms gearing up for new MediaTek solution

Dec 23, 01:05

IC packagers Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL), and substrate makers Unimicron Technology and Kinsus Interconnect Technology are...

ASE revenues down 5% in November

Dec 7, 16:44

Advanced Semiconductor Engineering (ASE) has reported its core ATM (assembly test and material) division generated revenues of NT$10.7 billion (US$356 million) in November 2011, down...

SPIL posts slight drop in November revenues

Dec 6, 15:06

IC assembly and test service provider Silicon Precision Industries (SPIL) has announced consolidated revenues of NT$5.26 billion (US$174 million) for November 2011, down 1.7% on month...

Copper pillar bump penetration of FC packaging to rise

Nov 29, 12:25

Adoption of copper pillar bump for flip-chip (FC) packaging is expected to increase, with its proportion rising from 10-20% in 2010-2011 to 20-30% in 2015, industry sources quoted...

October revenues up slightly for IC packaging firms

Nov 8, 01:00

Advanced Semiconductor Engineering (ASE), Siliconware Precision Industries (SPIL), Powertech Technology (PTI) and Sigurd Microelectronics, four Taiwan-based providers of IC packaging/testing...

SPIL sees 4-8% decline in 4Q11 revenues on lower utilization

Oct 27, 01:00

Semiconductor packaging and testing company Silicon Precision Industries (SPIL) has forecast revenues will decrease 4-8% sequentially in the fourth quarter of 2011, citing slowing...

SPIL chairman Bough Lin

Packaging and testing firms see flat growth in 4Q11

Oct 21, 01:05

The global semiconductor packaging and testing industry will only see flat sequential growth in the fourth quarter of 2011, as it continues to feel the effects of the economic downturn,...

SPIL outperforms fellow backend firms in 3Q11

Oct 11, 12:13

Silicon Precision Industries' (SPIL) consolidated revenues for the third quarter of 2011 rose 10.8% sequentially, beating the firm's targeted 2-6% growth. But Advanced Semiconductor...

SEMICON Taiwan 2011: Companies announce job openings

Sep 8, 01:40

A number of Taiwan-based semiconductor companies including foundries Taiwan Semiconductor Manufacturing Company (TSMC) and United Microelectronics Corporation (UMC), memory chipmakers...

ASE, SPIL post sequential growth in August sales

Sep 8, 01:25

IC packagers Advanced Semiconductor Engineering (ASE) and Silicon Precision Industries (SPIL) have reported sequential growth of 2.9% and 6.7%, respectively, in consolidated revenues...

MediaTek places additional orders with UMC on emerging market demand

Aug 31, 14:48

IC design house MediaTek, in view of increasing orders for its handset SoC solutions from China, India and other emerging markets, has released additional orders to United Microelectronics...

MediaTek

SPIL vying for CPU back-end orders from Apple

Aug 26, 11:07

Packaging and testing firm Siliconware Precision Industries (SPIL) is likely to snatch outsourcing orders for Apple's new processor dubbed A6, according to industry sources.

Packaging and testing growth to slow in 3Q11

Aug 17, 10:53

The global semiconductor packaging and testing industry is likely to see less than 5% growth sequentially in the third quarter of 2011, affected by the transition from gold to copper...

ASE and SPIL look to continued growth in copper wire bonding business in 3Q11

Aug 15, 15:15

IC packaging and testing houses Advanced Semiconductor Engineering (ASE) and Silicon Precision Industries (SPIL), both expect their sales generated from copper wire bonding to increase...

ASE, SPIL report revenue gains for July

Newswatch - Aug 9, 12:09

IC packagers Advanced Semiconductor Engineering (ASE) and Silicon Precision Industries (SPIL) both have reported sequential revenue gains for July. Revenues of ASE's core IC ATM (assembly...

ASE core ATM business likely to post 2% sales growth in 3Q11

Aug 4, 01:35

Advanced Semiconductor Engineering (ASE) is expected to see sales of its ATM (assembly test and material) division increase about 2% sequentially in the third quarter of 2011, according...

SPIL sees 2-6% revenue rise in 3Q11, moderate industry growth

Jul 28, 01:00

Siliconware Precision Industries (SPIL) projects its third-quarter revenues will grow 2-6% sequentially with both the consumer electronics and wireless communications sectors playing...

SPIL chairman Bough Lin

ASE, SPIL to post up to 5% growth in 3Q11 sales

Jul 22, 01:20

Judging from Intel's revenue outlook, market watchers expect Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) to see revenue growth of up to 5%...

ASE, SPIL reiterate 2011 capex outlook

Jul 14, 01:10

Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have said they currently have no plans to adjust planned capex for 2011. Meanwhile, both IC packagers...

SPIL 2Q11 sales miss guidance

Jul 6, 15:12

IC packaging and testing house Siliconware Precision Industries (SPIL) has reported consolidated revenues of NT$5.1 billion (US$176 million) for June, up 5.1% on month. Consolidated...

Major Taiwan IC backend firms developing copper pillar bumping

Jun 27, 13:54

Major IC packagers Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL), and memory packaging and testing specialist Powertech Technology (PTI), have...

SPIL concerned about client overbooking, cautious about 3Q11

Jun 23, 13:50

The Japan disaster in March prompted IDM and fabless companies to overbook chips, but the inventory build-up has not been consumed due to a slow second quarter, according to Bough...

SPIL chairman Bough Lin

SPIL turning focus to SiP packaging, IDM orders

Jun 23, 01:30

Siliconware Precision Industries (SPIL) is stepping up the development of system-in-package (SiP) specifically for use in handsets, and has been more actively expanding its IDM client...

IC packagers post slight growth in May revenues

Jun 8, 10:19

Advanced Semiconductor Engineering (ASE) has announced that sales of its ATM (assembly test and material) division grew 1.8% sequentially to NT$10.95 billion (US$382 million) in May...

Copper pillar to be mainstream FC packaging technology in 2012

Jun 3, 15:43

IC packagers Advanced Semiconductor Engineering (ASE), Amkor Technology, Siliconware Precision Industries (SPIL) and STATS ChipPAC have all started developing a new flip-chip (FC)...

ASE, SPIL April sales down slightly on-month

May 9, 16:11

Chip packaging and testing firms Advanced Semiconductor Engineering (ASE) and Silicon Precision Industries (SPIL) have reported sequential drops of 2.5% and 5.1%, respectively, in...

Normal substrate supply to resume in June, says SPIL chairman

Apr 28, 01:10

Siliconware Precision Industries (SPIL) chairman Bough Lin on April 27 confirmed that the company has been facing stretched lead times for its IC substrates due to limited availability...

IC backend 2Q11 sales likely affected by material shortages

Apr 14, 15:18

IC packaging and testing firms including Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) are expected to provide a cautious outlook for the second...

ASE core ATM unit posts 5% sales drop in 1Q11; SPIL also down

Apr 8, 14:30

Advanced Semiconductor Engineering (ASE) has announced that sales of its ATM (assembly test and material) division slid 5.3% sequentially to NT$30.88 billion (US$1.07 billion) in...

ASE to deal out dividend of NT$1.80 for 2010

Stockwatch - Mar 31, 01:30

Advanced Semiconductor Engineering (ASE) will deal out a dividend of NT$1.80 (US$0.06), including NT$1.15 in stocks and NT$0.65 in cash, for 2010, according to a decision made by...

ASE February sales down 11% sequentially

Mar 9, 10:53

Advanced Semiconductor Engineering (ASE) has announced consolidated revenues of NT$13.87 billion (US$471.5 million) for February 2011, down 11.1% sequentially. However, February sales...

270 items [4/8]
  • SPIL+anticipates+3Q+revenues+to+exceed+NT%2410+billion

    SPIL anticipates 3Q revenues to exceed NT$10 billion

    Bough Lin, chairman of SPIL, stated the company's BGA packaging lines are currently tight. The chip packaging and testing firm plans to install additional 700 fine-pitch wire bonders...

    Photo: Allen Lin, DigiTimes, Jul 29.

2015 China IC design market forecast
2015 China smartphone panel trend forecast

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