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News tagged SiP
  • Last update: Wednesday 25 November 2015 [51 news items]

China firm reportedly lands SiP device orders from Apple

Nov 25, 13:56

Jiangsu Changjiang Electronics Technology (JCET), China's largest semiconductor packaging and test services provider, has reportedly grabbed assembly orders for SiP (system-in-package)...

ASE to grow revenues from Korea, says company COO

Nov 3, 11:03

Advanced Semiconductor Engineering (ASE) is looking to grow revenues generated from the market in Korea, where the Taiwan-based IC backend house has invested US$1 billion in building...

Brisk SiP shipments buoying EMS operation, says ASE

Oct 30, 11:01

The average utilization rate of Advanced Semiconductor Engineering's (ASE) IC ATM (assembly test and material) operation is expected to fall 4-6% sequentially in the fourth quarter...

ASE CFO Joseph Tung

ASE, SPIL report increased August revenues

Sep 8, 15:05

IC packaging and testing houses Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have reported sequential increases of 5.8% and 5.7%, respectively,...

ASE and TDK launch joint venture

Sep 7, 11:04

Advanced Semiconductor Engineering (ASE) has announced the official inauguration of ASE Embedded Electronics Incorporated, at a formal signing ceremony in Kaohsiung with TDK and local...

SPIL looks to effective results of SiP packaging development with Foxconn

Sep 2, 11:22

Siliconware Precision Industries (SPIL) expects its strategic partnership with Foxconn Electronics for developing SiP (system-in-package) packaging technology to begin bearing fruit...

SPIL chairman Bough Lin

ASE expects to post revenue growth through 4Q15

Jul 30, 21:57

Advanced Semiconductor Engineering (ASE) will manage to post sequential revenue growth through the fourth quarter of 2015, according to company COO Tien Wu.

ShunSin revenues to rise starting July

Jun 26, 15:22

Revenues at ShunSin Technology, a Foxconn subsidiary engaged in the assembly and testing of system-in-package (SiP) modules, are expected to rise substantially in July 2015 thanks...

IC backend set for tepid growth in 2H15, says ASE COO

Jun 24, 12:28

The global IC packaging and testing industry has been working through excessive inventory for almost two quarters, but is set for tepid growth in the second half of the year, according...

ASE buys new factory buildings for NT$2.5 billion

Jun 5, 11:08

Advanced Semiconductor Engineering (ASE) has acquired two new factory buildings nearby its operations in the Nantze Export Processing Zone, Kaohsiung, southern Taiwan, for a total...

Computex 2015: ASE to showcase SiP solutions

Jun 1, 15:49

Advanced Semiconductor Engineering (ASE) has announced it will be showcasing system-in-package (SiP) solutions for consumer applications at the Computex Taipei 2015. These SiP applications...

Dialog, Foxconn SiP subsidiary to invest in Dyna Image

May 6, 21:58

Dialog Semiconductor, which focuses on power management IC solutions, has announced plans to acquire a 40% stake in Taiwan-based Dyna Image, a wholly-owned subsidiary of Lite-On Se...

ASE expects to double SiP revenues in 2015

May 4, 12:09

IC packaging and testing house Advanced Semiconductor Engineering (ASE) expects to more than double sales generated from its SiP (system-in-package) business in 2015, according to...

ASE nets NT$0.58 per share for 1Q15

Apr 30, 16:06

IC packaging and testing house Advanced Semiconductor Engineering (ASE) has reported net profits of NT$4.47 billion (US$146 million) for the first quarter of 2015, up 30% on year...

ASE to expand production capacity over the next 3 years, says chairman

Apr 8, 21:24

IC packager Advanced Semiconductor Engineering (ASE) will continue to expand its production capacity over the next three years, with investment to total between NT$100 billion (US$3.2...

ASE grabs SiP module orders for iPhone 6S and 7, says report

Stockwatch - Mar 9, 21:50

A recent Chinese-language Commercial Times report quoted sources from Apple's supply chain as saying that Taiwan's Advanced Semiconductor Engineering (ASE) has obtained assembly...

ASE looks to 12-15% revenue drop in 1Q15

Feb 9, 11:32

Advanced Semiconductor Engineering (ASE) has reported record consolidated revenues and profits for 2014. For 2015, the IC backend house expects its quarterly sales to register sequential...

ASE CFO Joseph Tung

Foxconn SiP subsidiary to list on TSE

Jan 8, 07:42

ShunSin Technology, a subsidiary of Foxconn Electronics (Hon Hai Precision Industry) specializing in assembly and test of system-in-package (SiP) modules, plans to have its stock...

Semicon Taiwan 2014: Focus on new processing, packaging technologies

Sep 2, 22:13

Semicon Taiwan 2014 will kick off in Taipei from September 3-5, with this year's theme focusing on advanced wafer processes, next-generation memory technologies, 3D ICs and SiP packaging...

USI reportedly lands SiP module orders for iWatch devices

Jul 23, 13:49

Universal Scientific Industrial (USI), an affiliated company of Advanced Semiconductor Engineering (ASE), reportedly has landed SiP module orders from Apple for its iWatch wearable...

Chip packager ASE expects 1Q14 shipments to drop 12-15%

Feb 10, 14:03

Advanced Semiconductor Engineering (ASE), the world's largest chip packaging and testing company, expects its first-quarter shipments to decrease 12-15% sequentially due to seasonal...

ASE CFO Joseph Tung

SiP market has room to expand, says ASE

Nov 15, 14:03

SiP (system-in-package) currently accounts for 5-10% of the overall production value of the IC packaging sector, according to Tien Wu, COO for Advanced Semiconductor Engineering (ASE)...

ASE posts record consolidated revenues for October 2013

Nov 8, 16:03

Consolidated revenues at Advanced Semiconductor Engineering (ASE) climbed to an all-time high of NT$20.76 billion (US$707 million) in October 2013, representing growth of 17.7% on...

ChipSiP unveils SiP Smart Glass solution

Oct 14, 21:07

ChipSiP Technology, which provides turnkey system-in-package (SiP) solutions, has launched what the company claims is the world's first HD resolution near-eye display on the Android...

ASE IC backend unit to post sales drop in 4Q13

Oct 3, 10:40

Sales of Advanced Semiconductor Engineering's (ASE) core IC ATM (assembly test and material) business is likely to post a sequential decrease in the fourth quarter of 2013, due to...

ASE claims to have 15% market share in SiP sector

Sep 4, 15:59

Out of every 6-7 system-in-package (SiP) devices, one is produced by Advanced Semiconductor Engineering (ASE), according to Ho-Ming Tong, company chief R&D officer. With its complete...

ASE to land growing backend orders for Apple devices, says report

Newswatch - Aug 29, 15:56

IC packaging and testing house Advanced Semiconductor Engineering (ASE) is expected to secure backend orders for fingerprint sensors, application processors and Wi-Fi modules for...

AzureWave expects growing demand for WLAN SiP modules

Jan 4, 14:54

AzureWave Technologies, a Taiwan-based provider of wireless networking and image processing solutions, expects demand for WLAN SiP (system in package) modules to increase in 2013,...

MediaTek takes 10% stake in SiP module maker AcSiP, says paper

Newswatch - Oct 16, 15:44

MediaTek has taken up a 10.2% stake in wireless SiP module maker AcSiP Technology through a private placement, according to a Chinese-language Economic Daily News (EDN)...

AcSiP Technology to start production of wireless SiP modules used in tablet PCs

Jul 17, 15:13

AcSiP Technology, a Taiwan-based maker of wireless SiP (system in package) modules used in smartphones, has developed modules for tablet PCs and other terminal devices and will begin...

Use of COB for WLAN-enabled smartphones rebounding, says AzureWave

Jun 6, 15:08

COB (chip on board) used to be the mainstream solution for WLAN chips in smartphones, but has been replaced by SiP (system in package) for two years. However, the adoption of COB...

AzureWave sees growing shipments of Wi-Fi SiP modules due to Xiaomi smartphones

Apr 12, 12:05

AzureWave Technologies, a Taiwan-based provider of wireless networking and image processing solutions, has seen increasing shipments of Wi-Fi SiP (system in package) modules built...

AcSiP Technology aims to ship 40 million WLAN SiP modules in 2012

Jan 5, 01:10

Taiwan-based wireless SiP (system in package) solution provider AcSiP Technology, viewing that fast increasing shipments of entry- to mid-level smartphones in China will bring about...

SPIL turning focus to SiP packaging, IDM orders

Jun 23, 01:30

Siliconware Precision Industries (SPIL) is stepping up the development of system-in-package (SiP) specifically for use in handsets, and has been more actively expanding its IDM client...

AzureWave debuts on TSE

May 4, 14:10

Taiwan-based wireless module maker AzureWave Technologies on May 3 debuted its shares on the Taiwan Stock Exchange (TSE), opening at NT$35 (US$1.22) and closing at NT$35.70.

51 items [1/2]
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    Before Going to Press | 7h 54min ago

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    Before Going to Press | 7h 55min ago

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    Before Going to Press | 7h 56min ago

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    Before Going to Press | 7h 57min ago

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View more
  • Samsung+Secu%2DNFC+chip+

    Samsung Secu-NFC chip

    Samsung Electronics has announced its new system-in-package (SIP) near field communications (NFC) chip, the SENHRN1. The new Secu-NFC chip combines a NFC controller and a secure element...

    Photo: Company, Nov 17.

  • Epicom+WCDMA%2FHSDPA+3G+PAs

    Epicom WCDMA/HSDPA 3G PAs

    Taiwan-based Epic Communications (Epicom) has announced a series of WCDMA/HSDPA power amplifiers (PA) for 3G portable devices and mobile phones. Provided in 3x3mm packages, the new...

    Photo: Company, Jan 26.

  • Sequans+SQN1280+all%2Din%2Done+WiMAX+SiP

    Sequans SQN1280 all-in-one WiMAX SiP

    Sequans has unveiled its latest Mobile WiMAX solution, the SQN1280, an all-in-one WiMAX system-in-package (SiP) for makers of handsets, tablets, USB sticks, portable hotspots, M2M...

    Photo: Company, Oct 25.

  • Samsung+and+Radvision+develop+HD+video+conference+multimedia+LCD+monitor

    Samsung and Radvision develop HD video conference multimedia LCD monitor

    Radvision and Samsung Electronics America have unveiled the VC240, a 24-inch monitor which integrates all the components required for HD desktop video conferencing. The VC240 is...

    Photo: Company, Jun 25.

Intel strategies in the mobile device market
Wireless broadband developments in Southeast Asia markets

28-Nov-2015 markets closed


TAIEX (TSE)8398.4-86.50-1.02% 

TSE electronic328.05-3.79-1.14% 

GTSM (OTC)128.36-0.49-0.38% 

OTC electronic157.22-0.73-0.46% 

The transition to 4k TV - UHD TV market forecast, 2014-2017
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    This Digitimes Research Special Report provides a 2015 forecast for the global tablet market and analyzes the strategies of key market players such as Google, Apple, Intel, and Microsoft.

  • 2015 China smartphone panel trend forecast

    This Digitimes Research Special Report analyzes the strategies of key China-based major panel makers BOE, Tianma and IVO for attacking the different market segments through technology and pricing, and their relationship to local vendors Huawei, Lenovo, ZTE, Xiaomi and Coolpad.