Siemens Gamesa, a leading wind turbine manufacturer, has warned that Taiwan's position as the frontrunner in Asia-Pacific's offshore wind market could be at risk, with Japan and South...
Foxconn is redefining smart manufacturing and aiming for a future where AI produces AI. Foxconn's two-day Hon Hai Tech Day (HHTD24) event began on October 8, during which it unveiled...
The offshore wind sector in the Asia-Pacific (APAC) region is poised for significant transformation as Japan and South Korea accelerate their development to match Taiwan's established...
The Asia-Pacific offshore wind sector is at a pivotal juncture, with Taiwan's early lead now under pressure from rapidly advancing markets in Japan and South Korea. Industry experts...
Chinese offshore wind turbine manufacturers are leveraging their cost advantage to capture global market share, posing a serious threat to European competitors like Siemens Gamesa...
Taiwan's offshore wind power industry, once heralded as a cornerstone of the country's green energy transition, is now grappling with significant challenges. Policy shifts and supply...
Intel Foundry's design ecosystem has hit a new milestone as key partners Ansys, Cadence, Siemens, and Synopsys release reference flows for Intel's Embedded Multi-die Interconnect...
Siemens and Hon Hai Technology Group (Foxconn) have signed a Memorandum of Understanding (MoU) to accelerate digital transformation and sustainability in smart manufacturing system...
Taiwanese industries are navigating two major currents: the wave of digitization and the shift towards net zero emissions. These trends, while presenting challenges, also offer lucrative...
Intel and Siemens have signed a memorandum of understanding (MoU) to collaborate on driving the digitalization and sustainability of microelectronics manufacturing. The companies...
At the TSMC 2023 OIP Ecosystem Forum, TSMC announced the new 3Dblox 2.0 open standard and major achievements of its Open Innovation Platform (OIP) 3DFabric Alliance. The 3Dblox 2.0...
Intel and the German federal government have signed a revised letter of intent for Intel's planned leading-edge wafer fabrication site in Magdeburg, the capital of Saxony-Anhalt....
Siemens AG will invest €2 billion ($2.2 billion) to expand high-tech manufacturing, including a new plant in Singapore and an expansion at its Chinese plant in Chengdu.
