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  • Last update: Tuesday 14 November 2017 [15 news items]

Intel, Micron increase 3D XPoint manufacturing capacity with IM Flash fab expansion

Nov 14, 09:31

Intel and Micron Technology have announced the completion of an expansion to Building 60 (B60) at the IM Flash facilities in Lehi, Utah. The expanded fab will produce 3D XPoint memory...

Staying focused on profitability: Q&A with UMC co-president SC Chien

Oct 2, 11:45

United Microelectronics (UMC) recently disclosed plans to expand its 28nm process offering by launching 28nm HPC and 28nm HPC Plus nodes, and introduce a further improved version...

UMC co-president SC Chien

SEMICON Taiwan 2017: Brewer Science showcasing innovative materials for EUV and 3D IC manufacturing

Sep 14, 13:44

With the semiconductor-manufacturing industry needing the high computing power that can only be achieved through advanced node logic and memory, as well as the heterogeneous-integration...

Samsung intros 11nm LPP process; 7nm LPP with EUV on schedule

Sep 12, 10:47

Samsung Electronics has added 11nm FinFET process technology (11LPP, Low Power Plus) to its advanced foundry process portfolio, offering customers with a wider range of options for...

Commentary: Can Samsung Foundry unseat TSMC?

Aug 3, 21:20

Samsung Foundry has unveiled an aggressive sub-10nm roadmap that scales down to 4nm, and claimed it is looking to unseat United Microelectronics (UMC) as the world's second-largest...

TSMC is the leader in the pure-play foundry sector

Faraday MFP ASIC shipments rise at CAGR of 38%

Jun 22, 21:20

Faraday Technology has announced that its MFP (Multi-Function Printer) ASIC solutions have surpassed 50 design wins since its introduction 10 years ago, and the MFP ASIC shipment...

Globalfoundries launches 7LP FinFET process

Jun 14, 20:56

Globalfoundries has announced the availability of its 7nm leading-performance (7LP) FinFET semiconductor technology, delivering a 40% generational performance boost to meet the needs...

Global 2016 handset baseband market increases 5%, says Strategy Analytics

Jun 14, 15:47

The global handset baseband processor market grew 5% on year to reach US$22.3 billion in 2016, according to Strategy Analytics. Qualcomm, MediaTek, Samsung LSI, Spreadtrum and HiSilicon...

Intel said to postpone Kaby Lake processor launch to late 2016

Jul 7, 15:10

Following the delay of Skylake processors, Intel's next-generation Kaby Lake processors, which were originally scheduled for early 2016, reportedly will be pushed back until September...

AMD CEO to visit Lenovo, Asustek, TSMC and Acer

Oct 28, 12:27

AMD CEO Lisa Su is planning to visit Lenovo in China and Asustek Computer, Taiwan Semiconductor Manufacturing Company (TSMC) and Acer in Taiwan in the near future to tighten its relationships...

AMD CEO Lisa Su

Intel may stop providing subsidies for mobile solutions; switch to providing support through different methods

Oct 21, 16:06

With better-than-expected performance in the third quarter of 2014, some market watchers have speculated that Intel will stop providing subsidies for its mobile device solutions to...

Efficiency enhancements to define solar PV technology roadmap for next 5 years, says Solarbuzz

Oct 14, 15:58

Solar photovoltaic (PV) modules using solar-grade wafers, as offered by 16 of the top 20 solar module suppliers to the industry, will account for 89% of solar capacity forecast to...

ARM and TSMC unveil roadmap for 64-bit ARM-based processors on 10nm FinFET process

Oct 6, 09:43

ARM and Taiwan Semiconductor Manufacturing Company (TSMC) have announced a new multi-year agreement that will deliver ARMv8-A processor IP optimized for TSMC 10nm FinFET process technology...

TSMC to host Taiwan Technology Symposium on May 29

May 28, 15:46

Taiwan Semiconductor Manufacturing Company (TSMC) will hold its Taiwan Technology Symposium 2014 on May 29, with the agenda of the annual event to focus on current production of 20nm...

AMD aims to hike global DIY market share; updates 2014 roadmap

Dec 18, 13:52

AMD has been enhancing the marketing of its processors in DIY markets and aims to increase its global DIY market share from about 30% currently to 40%, and to reach a DIY market share...

UMC
Global AP demand forecast, 2017-2020

17-Nov-2017 markets closed

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Global notebook shipment forecast, 2017 and beyond
  • China AMOLED panel capacity expansion forecast, 2016-2020

    This Digitimes Research Special Report examines the China AMOLED industry, focusing on the expansion capacity of the makers, the current implementation plans of major smartphone vendors in the market and the technological hurdles faced by the China makers.

  • Global AP demand forecast, 2017-2020

    Digitimes Research expects global AP shipments to surpass the 1.9 billion mark in 2017, with smartphones remaining the main application. Qualcomm will be leading the market in 2017, as other players continue playing catch up and scramble for funds to invest in more diverse applications.

  • Global notebook shipment forecast, 2017 and beyond

    This Digitimes Special Report examines key factors in the notebook industry, including products, vendors and ODMs, that will affect total shipments in 2017 and through 2021.