China-based Sinyang Semiconductor Materials has signed a three-year cooperation pact with Germany's chemical materials vendor Heraeus to jointly develop photoresist for use in producing...
NXP Semiconductors has announced a strategic partnership with Foxconn Industrial Internet (FII) to work on transforming a car into an edge device. NXP will provide FII with its comprehensive...
Foxconn Industrial Internet (FII), a smart manufacturing and integrated technology solution provider, has announced it will participate in the Netflix Hailstorm Program, an Android...
Vingroup JSC's automobile unit, VinFast is paving its way to be listed on the US initial public offering (IPO) in the second half of 2022. Vingroup is expected to raise US$3 billion...
Samsung Electronics has been actively pursuing 3nm GAA chip orders, with speculation that AMD and Qualcomm could be among the first customers of its newer foundry process technology...
GaN Systems has announced a strategic partnership with Universal Scientific Industrial (USI), a subsidiary of ASE Technology, to co-develop GaN power modules for the electric vehicle...
TSMC's ecosystem partners, particularly equipment makers, are poised to embrace strong growth momentum, as the foundry will be expanding its fab capacities over the next three years,...
TSMC and Sony Semiconductor Solutions (SSS) have jointly announced plans to establish a joint-venture foundry in Kumamoto, Japan to initially provide 22nm and 28nm process manufacturing...
Own-brand electric scooter maker Gogoro has signed with Gojek, an Indonesia-based provider of mobile on-demand services including ride-hailing, for a strategic partnership to promote...
From 5G wireless communications to electrical vehicles (EV), open architectures, such as open radio access network (O-RAN) and MIH open EV development platform, are serving as an...
MixComm, a provider of millimeter-wave (mmWave) and front-end solutions for 5G and Satcom applications, has recently announced a collaboration with SiTune, an innovator of multiple...
Fabless chipmakers are looking to step up their deployments in the 5G RF front-end module (RF FEM) and other device markets by working closely with their manufacturing partners, according...
GaN Systems has announced the signing of a comprehensive capacity agreement with BMW Group for GaN Systems' high-performance, automotive-grade GaN power transistors, which increase...
GlobalFoundries (GF) has announced the foundry is continuing its partnership with Qualcomm, expanding their RF collaboration on 5G multi-Gigabit speed RF front-end products.
