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NEWS TAGGED MEMS
Friday 10 August 2018
IC distributors WT Micro, Edom to see robust growths in 3Q18
IC distributors WT Microelectronics and Edom Technology are both expected to enjoy robust sequential revenue growths in the third quarter driven mainly by a pick-up in chip demand...
Tuesday 10 July 2018
Robust MOSFET demand drives PSI revenue growth
Strong MOSFET demand boosted revenues at Phoenix Silicon International (PSI), which provides wafer thinning services, in June.
Wednesday 20 June 2018
Xintec halts 12-inch wafer-level packaging production
Image sensor packaging specialist Xintec has decided to suspend its 12-inch wafer-level packaging production line for one year due to disappointing CMOS image sensor (CIS) demand...
Thursday 14 June 2018
PSI expanding wafer thinning business
Phoenix Silicon International (PSI), which specializes in wafer reclaim services, expects steady growth in its wafer thinning business in 2018. The product segment has expanded to...
Friday 8 June 2018
PSI reportedly grabs orders for industrial MOSFETs from Infineon
Phoenix Silicon International (PSI) has been contracted by a number of Europe- and US-based IDMs, such as Infineon, to use wafer thinning for making industrial MOSFET chips, according...
Monday 4 June 2018
Taiwan 2nd-tier backend firms enjoy pick-up of orders
Taiwan-based second-tier packaging and testing houses have enjoyed a pick-up of orders for flash memory, and 3D sensing and other optical components recently as their downstream clients...
Friday 1 June 2018
Backend firm Lingsen sales to peak in 3Q
Taiwan-based backend service company Lingsen Precision Industries is expected to see its sales climb to their peak for 2018 in the third quarter driven by robust demand for MEMS sensors,...
Friday 25 May 2018
Backend firms to gain from strong demand for MEMS sensors
Taiwan-based backend houses are expected to significantly benefit from increasingly brisk market demand for MEMS sensors for use in smartphones and other consumer electronics devices,...
Monday 14 May 2018
CHPT eyes revenue gain from MEMS vertical probe cards in 2018
Taiwan-based wafer test solution provider Chunghwa Precision Test Tech (CHPT) is expected to see the revenue ratio for its MEMS-based vertical probe cards (VPCs) surge to a double-digit...
Friday 16 March 2018
3S expects revenues and gross margin to fall in 1Q18
Solid State System (3S) expects to post sequential decreases in revenues and gross margin for the first quarter of 2018, due to a seasonal slowdown in orders for NAND flash device...
Friday 2 March 2018
SMIC forms MEMS JV with China local government
Semiconductor Manufacturing International (SMIC), China's Shaoxing government and Shengyang Group have formed a joint venture named Semiconductor Manufacturing Electronics (Shaoxin...
Thursday 1 March 2018
TDK to acquire ultrasonic sensor developer
TDK has reached an agreement with Chirp Microsystems, a developer of ultrasonic sensing solutions, in which Chirp becomes a wholly-owned subsidiary of TDK. TDK expects to close the...
Monday 26 February 2018
Chip demand for voice assistant devices rising
Chip demand for smart speakers and other voice-assistant devices has been rising, according to sources at Taiwan-based IC design houses.
Tuesday 16 January 2018
IC packager Lingsen to benefit from explosive demand for MEMS microphones
With smart speakers emerging as new fashion devices at CES 2018 and global tech giants such as Amazon, Google, Apple and Alibaba rushing to release new products, the global market...
Monday 11 December 2017
Apple Watch 3 shipment growth to benefit Taiwan IC packagers in 2018
Shipments of Apple Watch 3 are expected to surge 20% on year to reach 23-25 million units in the coming year, which will greatly benefit Taiwan players in the supply, particularly...
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