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News tagged IC design, distribution
  • Last update: Tuesday 12 December 2017 [10358 news items]

Global semiconductor sales increase 24% in July, says SIA

Sep 7, 10:51

Worldwide sales of semiconductors reached US$33.6 billion for the month of July 2017, an increase of 24.0% compared to the July 2016 total of US$27.1 billion and 3.1% more than the...

Egistec posts record August revenues

Sep 6, 19:22

Fingerprint sensor supplier Egis Technology (Egistec) has announced August consolidated revenues grew 34.6% sequentially to a record high of NT$544 million (US$18.1 million).

Visual recognition AI tech to thoroughly change social, commercial activities

Sep 6, 15:44

While AI (artificial intelligence) has quietly penetrated various fields of human life and bring brand-new dialogue models between machine and mankind, the visual recognition AI technology...

Xu Li, founder and CEO of SenseTime

Competition in AI chip market heating up on full presence of global tech giants

Sep 6, 15:02

Competition in the artificial intelligence (AI) chip market is heating up as nearly all major players in the IT industry have joined the race to develop AI chips and applications...

The midrange smartphone concept: Q&A with TL Lee, GM of MediaTek Wireless Communication Dept

Sep 6, 14:44

Taiwan-based chip designer MediaTek has newly released its Helio P-series chipset solutions for smartphones, aiming to regain its share of the global market for SoCs for midrange...

TL Lee, general manager of MediaTek's Wireless Communication Department

Realtek posts revenue growth in August

Sep 6, 11:15

Networking IC design company Realtek Semiconductor has announced consolidated revenues of NT$3.6 billion (US$119.7 million) for August 2017 - the second-highest monthly level in the...

Samsung increases chip orders to Taiwan fabless firms

Sep 5, 15:12

Samsung Electronics has stepped up purchases of IC parts from its Taiwan-based suppliers, including fingerprint sensor supplier Egis Technology (Egistec) and RF component specialist...

samsung

NXP and Changan Automobile to cooperate on infotainment and future vehicle technologies

Sep 5, 11:08

NXP Semiconductors has announced that it has entered into a long-term partnership with Changan Automobile. Headquartered in Chongqing, China, Changan Automobile is one of China's...

IFA 2017: Huawei unveils Kirin 970

Sep 4, 15:34

Huawei Consumer Business Grouphas unveiled at IFA 2017 in Berlin the Kirin 970, which combines the power of the cloud with the speed and responsiveness of native AI processing, according...

Upstream material suppliers in new iPhone supply chain to see strong growth

Sep 4, 15:09

With Apple expected to launch its new iPhone soon, Taiwan players in the US vendor's smartphone supply chain are warming up to embrace a new round of business boom, with the upstream...

Apple is expected to launch the new iPhone soon

China startup Cambricon reveals ambitious AI chip shipment plan

Aug 31, 16:24

China-based AI (artificial intelligence) chip startup Cambricon Technologies expects to roll out hundreds of millions of AI SoCs needed for smart terminal devices and servers in...

Chen Tianshi, CEO of Cambricon Technologies

Probe card demand for memory chips, high-end APs remains strong

Aug 31, 13:58

Semiconductor probe card demand for the manufacture of memory chips and high-end application processors (APs) has been strong, whereas that for the production of LCD driver ICs and...

Probe card demand rising for memory chips and high-end mobile APs

IC material supplier Wahlee obtains dry-film photoresist orders

Aug 31, 12:24

Semiconductor material distributor Wahlee Industrial has obtained dry-film photoresist orders from Taiwan-based PCB firms for the production of substrate-like PCBs (SLP), according...

Qualcomm, Himax jointly develop 3D depth sensing solution

Aug 30, 19:04

Qualcomm and Himax Technologies have jointly announced a collaboration to accelerate the development and commercialization of a high-resolution, low-power active 3D depth sensing...

Taiwan IC firms enjoys robust RFIC demand

Aug 30, 14:25

RF chip demand has been growing and is expected to peak in the third quarter, which will buoy sales at Taiwan-based Richwave Technology, Rafael Microelectronics and AMIC Communication...

Commentary: Innovation is key to survival for Taiwan IC designers

Aug 29, 15:38

Due to lackluster business performances recorded by most Taiwan IC design houses in the first half of 2017, the overall production value of Taiwan's IC design industry will see only...

MediaTek launches SoCs for mid-range smartphones

Aug 29, 15:24

MediaTek has introduced new members of its Helio chipset family, the P23 and P30 system-on-chips (SoCs), designed to deliver performance and power efficiency, dual camera photography,...

Silicon Works striving for orders from China, Taiwan

Aug 29, 10:22

Korea-based Silicon Works is striving for orders from China- and Taiwan-based panel vendors, and intends to reduce its reliance on orders placed by LG Display, according to a Korea-based...

Lite-On Semi obtains GPP diode orders from major China smartphone vendors

Aug 28, 10:58

Lite-On Semiconductor with its GPP (glass passivated package) bridge rectifiers has entered the supply chain of major China-based smartphone vendors including Huawei, Oppo, Vivo and...

Lite-On Semi and its subsidiary On-Bright are set to post strong 3Q17 results

Alchip posts EPS of NT$1.53 for 2Q17

Aug 25, 10:56

Alchip Technologies, a Taiwan-based provider of ASIC/SoC design services, saw its EPS hit a nearly 3-year high of NT$1.53 (US$0.05) in the second quarter of 2017.

China AI startup Cambricon receives new funding of US$100 million

Aug 24, 15:35

China-based AI chip startup Cambricon Technologies has newly raised US$100 million in series A round funding to support its development of advanced AI chips, which is expected to...

Qualcomm Snapdragon 835 chip powers Samsung Galaxy Note8

Aug 24, 11:02

Qualcomm has announced that its premium mobile platform is powering Samsung's latest flagship smartphone for select regions. The Samsung Galaxy Note8 is powered by the Qualcomm Snapdragon...

Semiconductor industry capital spending to rise 20% in 2017, says IC Insights

Aug 24, 10:15

IC Insights has revised its outlook for semiconductor industry capital spending to 20% growth in 2017. Spending for the first half of 2017 was already 48% greater than a year ago,...

Semiconductor market to grow 17% in 2017, says WSTS

Aug 23, 14:34

The worldwide semiconductor market is forecast to grow by 17% to US$397 billion in 2017, according to the World Semiconductor Trade Statistics (WSTS). WSTS estimated previously a...

China could enhance its position in post-Moore's Law era, says former TSMC COO

Aug 23, 14:04

China's semiconductor industry could have a chance of strengthening its position in the post-Moore's Law era, according to Shang-yi Chiang, former executive VP and co-chief operating...

Chiang

Rising graphics card demand to buoy backend houses profitability in 2H17

Aug 23, 12:06

Rising graphics card demand is expected to make a positive contribution to related backend houses' profitability in the second half of 2017, according to market sources.

North American semi equipment industry billings slip in July

Aug 23, 11:58

North America-based manufacturers of semiconductor equipment posted a slight 1.4% sequential decrease in billings worldwide in July 2017, according to SEMI.

China to phase in 14nm semiconductor process in 2018, says top tech master

Aug 22, 15:47

China is proceeding with systematic deployments in 14nm semiconductor fabrication equipment, process, packaging and materials, which will be fully industrialized in 2018. And the...

Ye Tianchun, director of Institute of Microelectronics, Chinese Academy of Science

Intel debuts 8th-generation Core CPUs

Aug 22, 14:15

Intel announced its eight-generation processors with the first U series designed for 2-in-1 and ultra-thin notebooks on August 21. Intel will launch models for desktops in fall.

Intel debuts new Coffee Lake processors

Qualcomm developing 3D depth sensing technology

Aug 22, 11:14

Qualcomm is partnering with its ecosystem partners to develop 3D depth sensing technology, which will be applied to Andriod smartphones powered the Snapdragon mobile chips, according...

Qualcomm is developing 3D depth sensing technology

Digitimes Research: Global TDDI chip shipments for 2017 to shoot up 191% on year

Aug 21, 14:26

Global TDDI (touch and display driver integration) chip shipments for 2017 are estimated to drastically soar 191% on year due mainly to increased shipments of hybrid in-cell TDDI...

smartphone

Qualcomm to extend tie-up with TSMC, says executive

Aug 21, 13:50

Qualcomm has been working with Taiwan's semiconductor firms for years, including an almost 10-year collaboration with TSMC, said Sudeepto Roy, VP of engineering for Qualcomm Technology...

Qualcomm will extend its collaboration with TSMC to FinFET process

China market: IoT chip demand promising, says ARM CEO

Aug 18, 16:14

Shipments of ARM-based mobile chips from China-based chipmakers have been rising rapidly along with the country's fast-growing IC design industry over the past 10 years, according...

arm CEO Simon Segars

Dialog looking to extend partnership with Spreadtrum

Aug 18, 10:22

Dialog Semiconductor is looking to extend its partnership with Spreadtrum Communication, and does not rule out forming a joint venture with the China-based mobile SoC provider, said...

Christophe Chene, senior VP of Asia for Dialog

Tsinghua Unigroup chief pledges firm support for Spreadtrum against mobile chip rivals

Aug 17, 15:24

China's state-backed tech conglomerate Tsinghua Unigroup will render persistent support to its subsidiary Spreadtrum Communications to counter increasingly fierce competition in the...

Zhao Weiguo, chairman of Tsinghua Unigroup
10358 items [6/296]
Realtime news
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  • ST+PWD13F60+

    ST PWD13F60

    STMicroelectronics' PWD13F60 system-in-package (SiP) contains a complete 600V/8A single-phase MOSFET full bridge in a 13mm x 11mm outline, saving bill-of-materials costs and board...

    Photo: Company, Dec 5.

  • Infineon+IRPS5401

    Infineon IRPS5401

    Infineon Technologies has launched the IRPS5401, a five-output point of load (POL) digital voltage regulator for FPGAs, ASICs, and other multi-rail power systems. The IRPS5401has...

    Photo: Company, Nov 7.

  • Samsung+ISOCELL+image+sensors

    Samsung ISOCELL image sensors

    Samsung Electronics has introduced two new ISOCELL image sensors: 1.28-micrometer 12-megapixel ISOCELL Fast 2L9 with Dual Pixel technology, and ultra-small 0.9-microemter 24-megapixel...

    Photo: Company, Oct 17.

  • TI+DLP+LightCrafter+Display

    TI DLP LightCrafter Display

    Texas Instruments (TI) has developed a new 0.2-inch DLP2000 chipset and US$99 DLP LightCrafter Display 2000 evaluation module (EVM), making it more affordable to leverage DLP technology...

    Photo: Company, Sep 15.

  • Nextchip+Apache4

    Nextchip Apache4

    CEVA, a licensor of signal processing IP for smart connected devices, has announced that Nextchip, a fabless company specializing in embedded vision applications for ADAS systems,...

    Photo: Company, Sep 15.

UMC
China AMOLED panel capacity expansion forecast, 2016-2020

12-Dec-2017 markets closed

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Global notebook shipment forecast, 2017 and beyond
  • China AMOLED panel capacity expansion forecast, 2016-2020

    This Digitimes Research Special Report examines the China AMOLED industry, focusing on the expansion capacity of the makers, the current implementation plans of major smartphone vendors in the market and the technological hurdles faced by the China makers.

  • Taiwan server shipment forecast and industry analysis, 2017

    Digitimes Research estimates that revenues from sales of server motherboards, servers, storage systems and related network system equipment by Taiwan-based vendors reached NT$555.8 billion in 2016 and the amount is estimated to grow 5.9% on year in 2017.

  • Global notebook shipment forecast, 2017 and beyond

    This Digitimes Special Report examines key factors in the notebook industry, including products, vendors and ODMs, that will affect total shipments in 2017 and through 2021.