14 news items tagged IC assembly
ASE February revenues decreaseFriday 9 March 2018
Advanced Semiconductor Engineering (ASE) has reported consolidated revenues of NT$19 billion (US$647.9 million) for February 2018, down 19.4% sequentially and 9.9% on year.
ASE January revenues down 15.7% sequentiallyFriday 9 February 2018
Advanced Semiconductor Engineering (ASE) has reported consolidated revenues of NT$23.59 billion (US$803.1 million) for January 2018, down 15.7% sequentially but up 4% on year.
ASE October revenues increaseWednesday 8 November 2017
Advanced Semiconductor Engineering (ASE) has reported consolidated revenues of NT$27.9 billion (US$924.1 million) for October 2017, up 7.6% on year and 2.6% sequentially.
ASE likely to post record 4Q17 revenuesMonday 30 October 2017
Advanced Semiconductor Engineering (ASE) expects sales of its core IC assembly test and material (ATM) business to register flat sequential growth in the fourth quarter, while sales...
ASE August revenues increaseFriday 8 September 2017
IC packaging and testing house Advanced Semiconductor Engineering (ASE) saw its August revenues climb to the highest monthly levels thus far in 2017.
ASE July revenues slip 4% sequentiallyTuesday 8 August 2017
Advanced Semiconductor Engineering (ASE) has announced consolidated revenues of NT$22.23 billion (US$736.4 million) for July 2017, down 3.7% sequentially but up about 3% on year.
ASE likely to post over 10% revenue growth in 3Q17Monday 31 July 2017
Packaging and testing company Advanced Semiconductor Engineering (ASE) is expected to report 10-13% sequential growth in consolidated revenues for the third quarter of 2017, with...
ASE June revenues increaseMonday 10 July 2017
IC packager Advanced Semiconductor Engineering (ASE) has reported consolidated revenues of NT$23.08 billion (US$754.5 million) for June 2017, up 2.8% sequentially and 6% on year.
ASE posts profit decrease in 1Q17Tuesday 2 May 2017
Packaging and testing company Advanced Semiconductor Engineering (ASE) saw its profits fall to a 4-year low in the first quarter of 2017.
High-end packaging next battlefield for IC assembly and test services providers, says Amkor executiveTuesday 9 July 2013
Robust growth in smartphone usage is encouraging semiconductor assembly and test services providers to head towards related packaging technologies. Amkor Technology is already among...
Thai flooding affects IC backend units of multiple suppliers, says IHSFriday 4 November 2011
Numerous semiconductor suppliers headquartered around the world maintain assembly and test operations in Thailand, and many of these facilities have been affected by recent flooding...
Ichia to expand flexible PCB operation over next three yearsWednesday 19 October 2011
Taiwan-based Ichia Technologies is looking to expand production capacity for flexible PCBs (FPCB) and FPCB assembly over the next three years, and expects sales generated from its...
SPIL 4Q10 gross margin up on higher copper wire bonding salesThursday 27 January 2011
Siliconware Precision Industries (SPIL) saw its gross margin increase to reach 14.3% in the fourth quarter of 2010, up 0.1pp sequentially and beating market estimates. The chip packager...
SMT solutions provider TSMT lists on TSETuesday 24 August 2010
Taiwan Surface Mounting Technology (TSMT), an LCD surface-mount technology (SMT) solutions provider, started trading on the main board of the Taiwan Stock Exchange (TSE) on August...